Agentic PrimitivesAP

Study reproduced ·

Reproducing Goto and Hijikata 2016: SiC growth rates on two faces, and the Si and C emission model as a candidate structure

Goto and Hijikata 2016: the sample and the timing of its process history as the paper states them, our encoding beside them item by item, the simulation in ISL, and how far it lands from the paper's numbers (29 within, 15 near, 29 off).

Richard Pedersen · Agentic Trust Labs · Rich Canvas

One of the [studies we reproduced](/writing/interface-studies-reproduced) for [Questions we need Emily to answer](/writing/questions-for-emily-testing-a-theory-of-the-interface), the companion to [the essay](/writing/testing-a-theory-of-the-interface-with-an-ontology). Generated by `scripts/reproduce_studies.py` from `reproductions/goto_2016.py`. Every value from the paper was read by an AI agent and has not been checked by a person; the sample and history were re-read from the PDF alone by a second agent that had not seen our earlier transcription.

The study and why we depend on it

D. Goto and Y. Hijikata, “Unified theory of silicon carbide oxidation based on the Si and C emission model”, J. Phys. D: Appl. Phys. 49, 225103 (2016).

Two things. A third laboratory's dry-oxygen growth on the Si and C faces (eight temperatures across the two faces), run through the SiC growth program with Song 2004's constants. And a candidate structure for that program: the Si and C emission model, whose equations and parameters are recorded below with whether our language can carry them.

How well can this study be reproduced?

Low. A modelling paper whose data are in-situ growth rates against thickness. The oxidation itself is stated (dry oxygen, 1 atm, a lamp heater, argon before oxygen), but not its duration, the clean, or the heat-up, and the model's material parameters are mostly not printed. Thickness against time has to be rebuilt by integrating the rates.

Sample described2 of 4 properties we need are stated and encoded the same
History described1 of 6 steps are stated and encoded the same; 0 are stated by the paper and absent from our history; 3 are ours because the paper is silent
Timing0 of 4 simulated steps have a stated duration; 2 of 2 other steps have none; 5 timing gaps listed below
How the results are givenOnly on figures: growth rate against thickness (Figures 2, 3), fitted parameters against 1/T (Figures 4, 5); read from the page, about ±5% in rate
Repeatability stated by the authorsNot stated
Internal consistencyFair. The text gives the activation energies of k0 in the reverse order of Figure 4's labels; L_S is 1.2 nm at 1100 °C in the text and about 2.3 nm on Figure 5
Is our model independent of this paper's data?Yes. Nothing in our SiC programs was fitted to this paper; the growth program runs Song 2004's constants. A test of transfer to a third laboratory, and to thin oxides
Outcome29 of 73 numbers within tolerance

The grade is ours and is about the paper as a source for simulation, not about the quality of the experiment: high means the sample, every step and its timing are stated well enough that a simulation needs no choices of ours; moderate that some choices are ours and are listed; low that the result depends on choices the paper does not constrain.

The sample and its history, played back

The sample is drawn from the simulation: layer heights and the read-outs are what the ISL programs compute at each moment of the history. Steps the language cannot state (a clean, a metallization, a measurement) are on the clock and marked as recorded, not simulated.

4H-SiC
Step 1 of 6 · recorded, not simulated
Surface preparation
temperature 25 °C
elapsed 0 s of 5 h 08 min 07 s
timing in the paper: not stated

not stated

The simulation at this moment
oxide thickness0 nm
consumed substrate0 nm
CleanHeatInArgon2 minArgonAtTemperature5 minToFirstPoint7.3 minOxidation4.9 hMeasure12000 °CThe same history to true scale (5 h 08 min 07 s simulated). Steps with no stated duration take no width.Temperature through the history. Step widths grow with the logarithm of duration; the bar under each step is how well our encoding matches the paper.
Drag the sample to turn it. Click the clock to move through the history.Layer heights are the simulated thicknesses, drawn to one scale within the film; the substrate is cut short.

Does our sample and history match the paper's?

Left: the paper's own words, with the page of the PDF. Right: what we simulate. 3 same, 2 approximated, 4 assumed, 1 not in ours.

✓3 same≈2 approximated?4 assumed✕1 not in ours
Sample: what the paper saysWhat we simulate
Si face
“4H-SiC (0001) Si-face (n type, 1.0×10^16 cm−3, 8° off)”
PDF p. 5
✓same
ORIENTATION: 4H_SiC_Si_face; DOPING: n_type_1e16; OFFCUT: 8_degrees (recorded)
No program reads the off-cut; Song's Si face was on axis.
C face
“4H-SiC (000-1) C-face (n type, 5.0×10^15 cm−3, 0.5° off)”
PDF p. 5
✓same
ORIENTATION: 4H_SiC_C_face; DOPING: n_type_5e15; OFFCUT: 0.5_degrees (recorded)
a face
“6H-SiC (11-20) a-face (n type)”
PDF p. 5
✕not in ours
not run
Figure 3(b) not digitized; 6H, not 4H (“differences … due to the polytype … were within the measurement errors”).
Starting oxide
not stated; the analysis model is SiO2 / interface layer / SiC
PDF p. 6
?assumed
the program's 0.2 nm
History: what the paper saysWhat we simulate
Surface preparation
not stated
PDF p. 5
?assumed
CLEAN: not_stated
The paper describes no clean.
Lamp heat-up to 1200 °C in argon
“Oxidation was conducted using an infrared lamp heater”; heat-up rate not stated
PDF p. 6
?assumed
RUN HeatInArgon DURATION 120 TEMP 25->1200 AMBIENT inert_Ar
Two minutes is ours. The gas is argon: the optical constants were measured in argon at temperature before oxygen was admitted.
Optical constants measured in argon
“Prior to oxidation, the optical constant of the SiC at the oxidation temperature was measured under an Ar atmosphere.”
PDF p. 6
≈approximated
RUN ArgonAtTemperature DURATION 300 TEMP 1200->1200 AMBIENT inert_Ar
Five minutes is ours; argon grows nothing in our programs.
Dry oxygen up to the first read thickness (5.7 nm)
“The Ar was then replaced with oxygen and real-time measurements of ellipsometric parameters (Ψ, Δ) were performed.” Figure 3 starts at the first thickness the analysis resolved
PDF p. 6
?assumed
RUN ToFirstPoint DURATION 437.802 TEMP 1200->1200 AMBIENT dry_O2
Figure 3 gives growth rate against thickness, not time. The clock is anchored at the first read point: this step lasts as long as the growth program needs to grow 5.7 nm from its 0.2 nm (7.3 min, from its own constants). That anchor is ours; searched from a quarter to four times it.
Dry oxygen at 1200 °C, 1 atm, 4.9 h after the first point
“at temperatures between 900 and 1200 °C under an oxygen flow of 1000 sccm and oxygen partial pressures from 0.02 to 1.0 atm”; Figure 3 at 1.0 atm
PDF p. 6
≈approximated
RUN Oxidation DURATION 17628.8 TEMP 1200->1200 AMBIENT dry_O2
Duration not stated. The times on the curve are integrals of 1/(growth rate) over the read thickness (trapezoid rule), so they inherit the reading error of every earlier rate.
In-situ spectroscopic ellipsometry
“The wavelength range of 310–410 nm was selected for oxide thickness analysis … The angle of incidence was 75.8°. … a three-layer structure was assumed as the analysis model, which consisted of SiO2/interface layer/SiC.”
PDF p. 6
✓same
the observable Thickness
Real time, during the oxidation.

The timing of the history

Time is counted from the start of the first simulated step. A step the language cannot state takes no simulated time; where the paper gives its duration, the duration is in the last column. Stated means the paper gives the duration; partly stated that it gives a bound or a range; not stated; assumed that the duration in our history is ours.

Si face (0001), 1200 °C

#StepStarts atLastsEnds atTemperatureRateGasIs the timing in the paper?
1Surface preparation0 snot simulatednot stated
2Lamp heat-up to 1200 °C in argon0 s2 min2 min25 → 1200 °C+9.79 °C/sinert_Arnot stated; assumed. not stated
3Optical constants measured in argon2 min5 min7 min1200 → 1200 °Cheldinert_Arnot stated; assumed. duration not stated
4Dry oxygen up to the first read thickness (5.7 nm)7 min7 min 18 s14 min 18 s1200 → 1200 °Chelddry_O2not stated; assumed. not stated; the time to the first read point is the program's own
5Dry oxygen at 1200 °C, 1 atm, 4.9 h after the first point14 min 18 s4 h 53 min 49 s5 h 08 min 07 s1200 → 1200 °Chelddry_O2not stated; assumed. reconstructed from rate against thickness
6In-situ spectroscopic ellipsometry5 h 08 min 07 snot simulatednot stated

Simulated time in this history: 5 h 08 min 07 s.

Across the samples

SampleHeatInArgonArgonAtTemperatureToFirstPointOxidationTotal
Si face (0001), 1200 °C2 min at 25→1200 °C5 min at 1200 °C7 min 18 s at 1200 °C4 h 53 min 49 s at 1200 °C5 h 08 min 07 s
Si face (0001), 1150 °C2 min at 25→1150 °C5 min at 1150 °C5 min 15 s at 1150 °C4 h 12 min 52 s at 1150 °C4 h 25 min 08 s
Si face (0001), 1100 °C2 min at 25→1100 °C5 min at 1100 °C19 min 05 s at 1100 °C4 h 05 min 26 s at 1100 °C4 h 31 min 31 s
Si face (0001), 1050 °C2 min at 25→1050 °C5 min at 1050 °C18 min 42 s at 1050 °C2 h 26 min 06 s at 1050 °C2 h 51 min 48 s
C face (000-1), 1200 °C2 min at 25→1200 °C5 min at 1200 °C3 min 38 s at 1200 °C3 h 51 min 58 s at 1200 °C4 h 02 min 36 s
C face (000-1), 1100 °C2 min at 25→1100 °C5 min at 1100 °C5 min 34 s at 1100 °C19 h 35 min 09 s at 1100 °C19 h 47 min 43 s
C face (000-1), 1000 °C2 min at 25→1000 °C5 min at 1000 °C6 min 18 s at 1000 °C5 h 34 min 31 s at 1000 °C5 h 47 min 49 s
C face (000-1), 900 °C2 min at 25→900 °C5 min at 900 °C15 min 56 s at 900 °C3 h 30 min 32 s at 900 °C3 h 53 min 28 s

Timing the paper does not give

  • Clean and loading: not stated.
  • Heat-up rate of the lamp heater and time in argon at temperature: not stated.
  • Time from the oxygen admission to the first thickness the ellipsometry resolved: not stated; Figure 3 starts at 3 to 13 nm.
  • Total oxidation time of each run: not stated. Times here are integrals of the read rates.
  • Cooling: not stated (it does not enter in-situ data).

What the second reading changed

  • The project held this paper as “abstract read … nothing digitized”, with no stored recipe and no dataset. The rates and parameters here are the second reader's readings of Figures 3 to 5.
  • Text p. 6: activation energies of k0 “0.68, 1.37 and 2.02” for the “Si-, a- and C-faces”; Figure 4(a) labels 2.02 eV on the Si-face line and 0.68 eV on the C-face line, and the paper's own argument (three Si back-bonds on the Si face, one on the C face) requires the figure's order.
  • L_S: 1.2 nm at 1100 °C for both faces in the text (for Figure 2), about 2.3 nm at 1100 °C on Figure 5(b) (for Figure 3).
  • The Si face here is 8° off axis; Song's, whose constants the program uses, was on axis. The C face is 0.5° off.

Their terms and ours

The paper saysWe writeKind in our vocabularyNote
oxide growth rate dX/dt(none: d(x_ox)/dt is internal to the program)not an observableA rate against thickness cannot be scored; it was integrated to thickness against time.
k0: initial interfacial oxidation rateB/A of the linear-parabolic law is its limit k_min C_O(1−ν_Si)/N0PARAMETERFitted in the paper; graph only (Figure 4a).
ν_Si, ν_C: emission ratios(none)not in vocabularyThe share of Si and C atoms leaving the interface as interstitials instead of oxidizing.
C_Si^I, C_C^I: interstitial concentrations at the interfacewould be FIELDs on a grid in the oxideFIELDOur grids have fixed length; the oxide's grows.
R_S, L_S: enhanced surface oxide growthan added term R_S exp(−X/L_S) in d(x_ox)/dtOPERATOR kind OxideGrowthThe steady-state limit of the model is the Massoud relation.
Si and C emission model(candidate structure)operator structureSee the alignment section: what the language can and cannot carry.
in-situ spectroscopic ellipsometry, three-layer modelThicknessobservableAn interface layer is part of the optical model and is not reported.
oxygen partial pressure 0.02–1 atmmix:O2=p,Ar=1−p (diluent not stated)ambient by partial pressureNot run here.

The simulation in our language

Each sample is one history file: a SAMPLE and a CONTROL_TRAJECTORY. This is the whole input; run it with PYTHONPATH=. python -m isl_harness.predict <file>.

Si face (0001), 1200 °C

# Si face (0001), 1200 °C
SAMPLE SiC_Si_1200 {
    FAMILY: SiC_SiO2
    ORIENTATION: 4H_SiC_Si_face
    CLEAN: not_stated
    DOPING: n_type_1e16
    OFFCUT: 8_degrees
}
CONTROL_TRAJECTORY History {
    EVENT Clean KIND clean TIMING assumed                        # Surface preparation
    RUN HeatInArgon DURATION 120 TEMP 25->1200 AMBIENT inert_Ar TIMING assumed
    RUN ArgonAtTemperature DURATION 300 TEMP 1200->1200 AMBIENT inert_Ar TIMING assumed
    RUN ToFirstPoint DURATION 437.802 TEMP 1200->1200 AMBIENT dry_O2 TIMING assumed VARY duration 109.451..1751.21
    RUN Oxidation DURATION 17628.8 TEMP 1200->1200 AMBIENT dry_O2 TIMING assumed
    EVENT Measure KIND measurement TIMING assumed                # In-situ spectroscopic ellipsometry
}

Si face (0001), 1150 °C

# Si face (0001), 1150 °C
SAMPLE SiC_Si_1150 {
    FAMILY: SiC_SiO2
    ORIENTATION: 4H_SiC_Si_face
    CLEAN: not_stated
    DOPING: n_type_1e16
    OFFCUT: 8_degrees
}
CONTROL_TRAJECTORY History {
    EVENT Clean KIND clean TIMING assumed                        # Surface preparation
    RUN HeatInArgon DURATION 120 TEMP 25->1150 AMBIENT inert_Ar TIMING assumed
    RUN ArgonAtTemperature DURATION 300 TEMP 1150->1150 AMBIENT inert_Ar TIMING assumed
    RUN ToFirstPoint DURATION 315.303 TEMP 1150->1150 AMBIENT dry_O2 TIMING assumed VARY duration 78.8258..1261.21
    RUN Oxidation DURATION 15172.2 TEMP 1150->1150 AMBIENT dry_O2 TIMING assumed
    EVENT Measure KIND measurement TIMING assumed                # In-situ spectroscopic ellipsometry
}

Si face (0001), 1100 °C

# Si face (0001), 1100 °C
SAMPLE SiC_Si_1100 {
    FAMILY: SiC_SiO2
    ORIENTATION: 4H_SiC_Si_face
    CLEAN: not_stated
    DOPING: n_type_1e16
    OFFCUT: 8_degrees
}
CONTROL_TRAJECTORY History {
    EVENT Clean KIND clean TIMING assumed                        # Surface preparation
    RUN HeatInArgon DURATION 120 TEMP 25->1100 AMBIENT inert_Ar TIMING assumed
    RUN ArgonAtTemperature DURATION 300 TEMP 1100->1100 AMBIENT inert_Ar TIMING assumed
    RUN ToFirstPoint DURATION 1144.77 TEMP 1100->1100 AMBIENT dry_O2 TIMING assumed VARY duration 286.193..4579.09
    RUN Oxidation DURATION 14725.8 TEMP 1100->1100 AMBIENT dry_O2 TIMING assumed
    EVENT Measure KIND measurement TIMING assumed                # In-situ spectroscopic ellipsometry
}

Si face (0001), 1050 °C

# Si face (0001), 1050 °C
SAMPLE SiC_Si_1050 {
    FAMILY: SiC_SiO2
    ORIENTATION: 4H_SiC_Si_face
    CLEAN: not_stated
    DOPING: n_type_1e16
    OFFCUT: 8_degrees
}
CONTROL_TRAJECTORY History {
    EVENT Clean KIND clean TIMING assumed                        # Surface preparation
    RUN HeatInArgon DURATION 120 TEMP 25->1050 AMBIENT inert_Ar TIMING assumed
    RUN ArgonAtTemperature DURATION 300 TEMP 1050->1050 AMBIENT inert_Ar TIMING assumed
    RUN ToFirstPoint DURATION 1121.91 TEMP 1050->1050 AMBIENT dry_O2 TIMING assumed VARY duration 280.477..4487.63
    RUN Oxidation DURATION 8765.64 TEMP 1050->1050 AMBIENT dry_O2 TIMING assumed
    EVENT Measure KIND measurement TIMING assumed                # In-situ spectroscopic ellipsometry
}

C face (000-1), 1200 °C

# C face (000-1), 1200 °C
SAMPLE SiC_C_1200 {
    FAMILY: SiC_SiO2
    ORIENTATION: 4H_SiC_C_face
    CLEAN: not_stated
    DOPING: n_type_5e15
    OFFCUT: 0.5_degrees
}
CONTROL_TRAJECTORY History {
    EVENT Clean KIND clean TIMING assumed                        # Surface preparation
    RUN HeatInArgon DURATION 120 TEMP 25->1200 AMBIENT inert_Ar TIMING assumed
    RUN ArgonAtTemperature DURATION 300 TEMP 1200->1200 AMBIENT inert_Ar TIMING assumed
    RUN ToFirstPoint DURATION 218.454 TEMP 1200->1200 AMBIENT dry_O2 TIMING assumed VARY duration 54.6134..873.815
    RUN Oxidation DURATION 13917.6 TEMP 1200->1200 AMBIENT dry_O2 TIMING assumed
    EVENT Measure KIND measurement TIMING assumed                # In-situ spectroscopic ellipsometry
}

C face (000-1), 1100 °C

# C face (000-1), 1100 °C
SAMPLE SiC_C_1100 {
    FAMILY: SiC_SiO2
    ORIENTATION: 4H_SiC_C_face
    CLEAN: not_stated
    DOPING: n_type_5e15
    OFFCUT: 0.5_degrees
}
CONTROL_TRAJECTORY History {
    EVENT Clean KIND clean TIMING assumed                        # Surface preparation
    RUN HeatInArgon DURATION 120 TEMP 25->1100 AMBIENT inert_Ar TIMING assumed
    RUN ArgonAtTemperature DURATION 300 TEMP 1100->1100 AMBIENT inert_Ar TIMING assumed
    RUN ToFirstPoint DURATION 334.131 TEMP 1100->1100 AMBIENT dry_O2 TIMING assumed VARY duration 83.5328..1336.53
    RUN Oxidation DURATION 70508.9 TEMP 1100->1100 AMBIENT dry_O2 TIMING assumed
    EVENT Measure KIND measurement TIMING assumed                # In-situ spectroscopic ellipsometry
}

C face (000-1), 1000 °C

# C face (000-1), 1000 °C
SAMPLE SiC_C_1000 {
    FAMILY: SiC_SiO2
    ORIENTATION: 4H_SiC_C_face
    CLEAN: not_stated
    DOPING: n_type_5e15
    OFFCUT: 0.5_degrees
}
CONTROL_TRAJECTORY History {
    EVENT Clean KIND clean TIMING assumed                        # Surface preparation
    RUN HeatInArgon DURATION 120 TEMP 25->1000 AMBIENT inert_Ar TIMING assumed
    RUN ArgonAtTemperature DURATION 300 TEMP 1000->1000 AMBIENT inert_Ar TIMING assumed
    RUN ToFirstPoint DURATION 377.932 TEMP 1000->1000 AMBIENT dry_O2 TIMING assumed VARY duration 94.483..1511.73
    RUN Oxidation DURATION 20071.1 TEMP 1000->1000 AMBIENT dry_O2 TIMING assumed
    EVENT Measure KIND measurement TIMING assumed                # In-situ spectroscopic ellipsometry
}

C face (000-1), 900 °C

# C face (000-1), 900 °C
SAMPLE SiC_C_900 {
    FAMILY: SiC_SiO2
    ORIENTATION: 4H_SiC_C_face
    CLEAN: not_stated
    DOPING: n_type_5e15
    OFFCUT: 0.5_degrees
}
CONTROL_TRAJECTORY History {
    EVENT Clean KIND clean TIMING assumed                        # Surface preparation
    RUN HeatInArgon DURATION 120 TEMP 25->900 AMBIENT inert_Ar TIMING assumed
    RUN ArgonAtTemperature DURATION 300 TEMP 900->900 AMBIENT inert_Ar TIMING assumed
    RUN ToFirstPoint DURATION 956.195 TEMP 900->900 AMBIENT dry_O2 TIMING assumed VARY duration 239.049..3824.78
    RUN Oxidation DURATION 12631.7 TEMP 900->900 AMBIENT dry_O2 TIMING assumed
    EVENT Measure KIND measurement TIMING assumed                # In-situ spectroscopic ellipsometry
}

The programs the predictor ran on these histories: experiments/sic_interface_states/one_way_anneal.isl.template, experiments/song_sic/oxide_growth_sic.isl.template.

The model itself, experiments/song_sic/oxide_growth_sic.isl.template, as it is written. Every equation the simulation uses is in this text; the runtime holds no physics.

# ==============================================================================
# ISL MODEL: DRY THERMAL OXIDATION OF 4H-SiC (growth sector on a second material)
#
# The OPERATOR and OBSERVATION_MODEL blocks below are copied character for character
# from experiments/vitkavage_dit/oxide_growth.isl.template, the silicon program; a test
# checks that they are identical. Only the declared parameters differ.
#
# Song et al. (2004) fit their SiC data with the same linear-parabolic law, reading its
# two constants as including out-diffusion of the carbon product. The constants here are
# Arrhenius fits to that paper's Tables I and II, per crystal face
# (scripts/build_song_dataset.py). Nothing is fitted by us.
# Fields in {{braces}} are filled by scripts/run_song_sic.py.
# ==============================================================================
SAMPLE {sample_id} {{
    FAMILY: SiC_SiO2
    ORIENTATION: 4H_SiC_{face}_face
}}
STATE x_ox {{
    UNIT: cm
    INITIAL: x_i
    MIN: 0
    MAX: 1.0e-3
}}
CONTROL T {{ UNIT: K }}
CONTROL p_O2 {{ UNIT: atm }}
PARAMETER B0 {{ VALUE: {B0}; UNIT: cm^2 s^-1; STATUS: sourced; SOURCE: {source} }}
PARAMETER E_B {{ VALUE: {E_B}; UNIT: eV; STATUS: sourced; SOURCE: {source} }}
PARAMETER BA0 {{ VALUE: {BA0}; UNIT: cm s^-1; STATUS: sourced; SOURCE: {source} }}
PARAMETER E_BA {{ VALUE: {E_BA}; UNIT: eV; STATUS: sourced; SOURCE: {source} }}
# The constants above are already specific to the crystal face, so no further factor is applied.
PARAMETER r_or {{ VALUE: 1.0; UNIT: 1; STATUS: constant }}
# The paper sets the time offset to zero and reports a native oxide of about 2 angstrom.
PARAMETER x_i {{ VALUE: 2.0e-8; UNIT: cm; STATUS: sourced; SOURCE: Song et al., J. Appl. Phys. 95, 4953 (2004), native oxide about 2 angstrom, agent-read }}
PARAMETER p_ref {{ VALUE: 1.0; UNIT: atm; STATUS: constant }}
PARAMETER k_B {{ VALUE: 8.617333262e-5; UNIT: eV K^-1; STATUS: constant }}
CONTROL_TRAJECTORY {trajectory_id} {{
    RUN Oxidation DURATION {duration_s} TEMP {T_C}->{T_C} AMBIENT dry_O2
}}
# dx/dt = B / (2x + A), with A = B / (B/A).
OPERATOR F_LinearParabolicGrowth : OxideGrowth {{
    EQUATION: d(x_ox)/dt = (p_O2 / p_ref) * B0 * exp(-E_B / (k_B * T)) / (2 * x_ox + B0 * exp(-E_B / (k_B * T)) / (r_or * BA0 * exp(-E_BA / (k_B * T))))
}}
OBSERVATION_MODEL Obs_Oxide_Thickness {{
    TARGET: Thickness
    UNIT: cm
    EQUATION: Thickness = x_ox
}}
EVALUATION_CONTRACT {contract_id} {{
    FROZEN: true
    DATASET: data/derived/song_2004_sic_thickness.csv
    DATASET_DIGEST: sha256:{dataset_sha256}
    SPLIT: {split}
{targets}
}}

Our simulation against the paper

29 within, 15 near, 29 off of 73 numbers. Tolerance is stated per row; nothing was fitted for this page.

✓29 within tolerance≈15 within twice the tolerance✕29 outside
simulation below the paper ← 0 → simulation above the paper-100%-50%0%+50%+100%Si face (0001), 1200 °C, 0.076 hoxide thicknessours 8.21 · paper 8.8 nm✓ within tolerance (-6.8%)Si face (0001), 1200 °C, 0.1459 hoxide thicknessours 10.2 · paper 11 nm✓ within tolerance (-7.3%)Si face (0001), 1200 °C, 0.2132 hoxide thicknessours 11.9 · paper 12.7 nm✓ within tolerance (-6.0%)Si face (0001), 1200 °C, 0.3744 hoxide thicknessours 15.6 · paper 16.3 nm✓ within tolerance (-4.4%)Si face (0001), 1200 °C, 0.5666 hoxide thicknessours 19.3 · paper 20.3 nm✓ within tolerance (-5.0%)Si face (0001), 1200 °C, 0.9123 hoxide thicknessours 24.9 · paper 27 nm✓ within tolerance (-7.7%)Si face (0001), 1200 °C, 1.403 hoxide thicknessours 31.5 · paper 36 nm≈ within twice the tolerance (-12%)Si face (0001), 1200 °C, 1.913 hoxide thicknessours 37.4 · paper 45 nm≈ within twice the tolerance (-17%)Si face (0001), 1200 °C, 2.3741 hoxide thicknessours 42.1 · paper 53 nm✕ outside (-21%)Si face (0001), 1200 °C, 3.1742 hoxide thicknessours 49.4 · paper 67 nm✕ outside (-26%)Si face (0001), 1200 °C, 4.8969 hoxide thicknessours 62.6 · paper 98 nm✕ outside (-36%)Si face (0001), 1150 °C, 0.0432 hoxide thicknessours 4.06 · paper 4.3 nm✓ within tolerance (-5.5%)Si face (0001), 1150 °C, 0.0788 hoxide thicknessours 4.85 · paper 5.2 nm✓ within tolerance (-6.7%)Si face (0001), 1150 °C, 0.2481 hoxide thicknessours 7.95 · paper 8.8 nm✓ within tolerance (-9.7%)Si face (0001), 1150 °C, 0.4391 hoxide thicknessours 10.7 · paper 12 nm≈ within twice the tolerance (-11%)Si face (0001), 1150 °C, 0.7002 hoxide thicknessours 13.9 · paper 15.6 nm≈ within twice the tolerance (-11%)Si face (0001), 1150 °C, 1.3817 hoxide thicknessours 20.3 · paper 24 nm≈ within twice the tolerance (-16%)Si face (0001), 1150 °C, 2.1613 hoxide thicknessours 26 · paper 33 nm✕ outside (-21%)Si face (0001), 1150 °C, 3.0583 hoxide thicknessours 31.5 · paper 43 nm✕ outside (-27%)Si face (0001), 1150 °C, 4.2145 hoxide thicknessours 37.5 · paper 56 nm✕ outside (-33%)Si face (0001), 1100 °C, 0.0567 hoxide thicknessours 5.52 · paper 5.6 nm✓ within tolerance (-1.4%)Si face (0001), 1100 °C, 0.1299 hoxide thicknessours 6.2 · paper 6.3 nm✓ within tolerance (-1.6%)Si face (0001), 1100 °C, 0.3244 hoxide thicknessours 7.8 · paper 7.9 nm✓ within tolerance (-1.2%)Si face (0001), 1100 °C, 0.5859 hoxide thicknessours 9.64 · paper 9.8 nm✓ within tolerance (-1.6%)Si face (0001), 1100 °C, 0.8392 hoxide thicknessours 11.2 · paper 11.4 nm✓ within tolerance (-1.8%)Si face (0001), 1100 °C, 1.3738 hoxide thicknessours 14 · paper 14.5 nm✓ within tolerance (-3.4%)Si face (0001), 1100 °C, 1.8204 hoxide thicknessours 16 · paper 17 nm✓ within tolerance (-5.6%)Si face (0001), 1100 °C, 2.5614 hoxide thicknessours 19 · paper 21 nm✓ within tolerance (-9.5%)Si face (0001), 1100 °C, 3.8186 hoxide thicknessours 23.3 · paper 27.6 nm≈ within twice the tolerance (-16%)Si face (0001), 1100 °C, 4.0905 hoxide thicknessours 24.1 · paper 29 nm≈ within twice the tolerance (-17%)Si face (0001), 1050 °C, 0.1229 hoxide thicknessours 3.79 · paper 4 nm✓ within tolerance (-5.3%)Si face (0001), 1050 °C, 0.1889 hoxide thicknessours 4.14 · paper 4.4 nm✓ within tolerance (-5.8%)Si face (0001), 1050 °C, 0.6145 hoxide thicknessours 6.04 · paper 6.6 nm✓ within tolerance (-8.4%)Si face (0001), 1050 °C, 1.0163 hoxide thicknessours 7.48 · paper 8.4 nm≈ within twice the tolerance (-11%)Si face (0001), 1050 °C, 1.4173 hoxide thicknessours 8.72 · paper 10 nm≈ within twice the tolerance (-13%)Si face (0001), 1050 °C, 2.0123 hoxide thicknessours 10.3 · paper 12.2 nm≈ within twice the tolerance (-15%)Si face (0001), 1050 °C, 2.4349 hoxide thicknessours 11.3 · paper 13.7 nm≈ within twice the tolerance (-17%)C face (000-1), 1200 °C, 0.0262 hoxide thicknessours 17.7 · paper 15.8 nm≈ within twice the tolerance (+12%)C face (000-1), 1200 °C, 0.0538 hoxide thicknessours 22.5 · paper 18.3 nm✕ outside (+23%)C face (000-1), 1200 °C, 0.1239 hoxide thicknessours 33.7 · paper 23.7 nm✕ outside (+42%)C face (000-1), 1200 °C, 0.2123 hoxide thicknessours 46.3 · paper 30 nm✕ outside (+54%)C face (000-1), 1200 °C, 0.3767 hoxide thicknessours 66.6 · paper 40 nm✕ outside (+66%)C face (000-1), 1200 °C, 0.6034 hoxide thicknessours 90.3 · paper 52 nm✕ outside (+74%)C face (000-1), 1200 °C, 0.9724 hoxide thicknessours 123 · paper 71 nm✕ outside (+73%)C face (000-1), 1200 °C, 1.349 hoxide thicknessours 151 · paper 90 nm✕ outside (+68%)C face (000-1), 1200 °C, 2.3345 hoxide thicknessours 211 · paper 134 nm✕ outside (+58%)C face (000-1), 1200 °C, 3.866 hoxide thicknessours 285 · paper 190 nm✕ outside (+50%)C face (000-1), 1100 °C, 0.0587 hoxide thicknessours 15.1 · paper 12.6 nm≈ within twice the tolerance (+19%)C face (000-1), 1100 °C, 0.1774 hoxide thicknessours 24.4 · paper 17.3 nm✕ outside (+41%)C face (000-1), 1100 °C, 0.3767 hoxide thicknessours 37.7 · paper 23.7 nm✕ outside (+59%)C face (000-1), 1100 °C, 0.6976 hoxide thicknessours 55.3 · paper 32.5 nm✕ outside (+70%)C face (000-1), 1100 °C, 1.1584 hoxide thicknessours 76.1 · paper 44 nm✕ outside (+73%)C face (000-1), 1100 °C, 2.2098 hoxide thicknessours 114 · paper 70 nm✕ outside (+62%)C face (000-1), 1100 °C, 3.0693 hoxide thicknessours 138 · paper 90 nm✕ outside (+54%)C face (000-1), 1100 °C, 4.718 hoxide thicknessours 178 · paper 123 nm✕ outside (+45%)C face (000-1), 1100 °C, 9.6321 hoxide thicknessours 269 · paper 205 nm✕ outside (+31%)C face (000-1), 1100 °C, 19.5858 hoxide thicknessours 398 · paper 330 nm✕ outside (+20%)C face (000-1), 1000 °C, 0.057 hoxide thicknessours 7.59 · paper 7.5 nm✓ within tolerance (+1.3%)C face (000-1), 1000 °C, 0.0858 hoxide thicknessours 8.74 · paper 8.5 nm✓ within tolerance (+2.8%)C face (000-1), 1000 °C, 0.1683 hoxide thicknessours 11.8 · paper 10.8 nm✓ within tolerance (+9.4%)C face (000-1), 1000 °C, 0.4004 hoxide thicknessours 19.3 · paper 16 nm✕ outside (+21%)C face (000-1), 1000 °C, 0.7095 hoxide thicknessours 27.7 · paper 21.8 nm✕ outside (+27%)C face (000-1), 1000 °C, 1.2127 hoxide thicknessours 39 · paper 30 nm✕ outside (+30%)C face (000-1), 1000 °C, 2.1708 hoxide thicknessours 56.3 · paper 44 nm✕ outside (+28%)C face (000-1), 1000 °C, 3.8216 hoxide thicknessours 79.5 · paper 66 nm✕ outside (+21%)C face (000-1), 1000 °C, 5.5753 hoxide thicknessours 99.6 · paper 88 nm≈ within twice the tolerance (+13%)C face (000-1), 900 °C, 0.0711 hoxide thicknessours 5.96 · paper 6.2 nm✓ within tolerance (-3.8%)C face (000-1), 900 °C, 0.1765 hoxide thicknessours 7.44 · paper 7.8 nm✓ within tolerance (-4.6%)C face (000-1), 900 °C, 0.3626 hoxide thicknessours 9.82 · paper 10.4 nm✓ within tolerance (-5.6%)C face (000-1), 900 °C, 0.7378 hoxide thicknessours 14 · paper 15 nm✓ within tolerance (-6.7%)C face (000-1), 900 °C, 1.0869 hoxide thicknessours 17.4 · paper 18.8 nm✓ within tolerance (-7.7%)C face (000-1), 900 °C, 1.7945 hoxide thicknessours 23.3 · paper 25.7 nm✓ within tolerance (-9.5%)C face (000-1), 900 °C, 3.5088 hoxide thicknessours 34.6 · paper 40 nm≈ within twice the tolerance (-13%)
The pale green band is the tolerance. Bars past ±100% are cut and carry their value.
Oxide thickness after the first read point, dry oxygen 1 atm, Si face (0001)
026.552.979.410601.222.453.674.9time in Oxidation (h)oxide thickness (nm)1200 °C1150 °C1100 °C1050 °Cour simulationthe paper
Oxide thickness after the first read point, dry oxygen 1 atm, C face (000-1)
010721532242904.99.7914.719.6time in Oxidation (h)oxide thickness (nm)1200 °C1100 °C1000 °C900 °Cour simulationthe paper
Sample and historyQuantityThe paperOur simulationDifferenceVerdictWhat the program's own evaluation saysWhere in the paper
Si face (0001), 1200 °C, 0.076 hoxide thickness8.8 nm8.21 nm-7%within (±10%)outside the tested scopeFigure 3(a), PDF p. 7, rate against thickness read from the page and integrated to thickness against time
Si face (0001), 1200 °C, 0.1459 hoxide thickness11 nm10.2 nm-7%within (±10%)outside the tested scopeFigure 3(a), PDF p. 7, rate against thickness read from the page and integrated to thickness against time
Si face (0001), 1200 °C, 0.2132 hoxide thickness12.7 nm11.9 nm-6%within (±10%)outside the tested scopeFigure 3(a), PDF p. 7, rate against thickness read from the page and integrated to thickness against time
Si face (0001), 1200 °C, 0.3744 hoxide thickness16.3 nm15.6 nm-4%within (±10%)outside the tested scopeFigure 3(a), PDF p. 7, rate against thickness read from the page and integrated to thickness against time
Si face (0001), 1200 °C, 0.5666 hoxide thickness20.3 nm19.3 nm-5%within (±10%)outside the tested scopeFigure 3(a), PDF p. 7, rate against thickness read from the page and integrated to thickness against time
Si face (0001), 1200 °C, 0.9123 hoxide thickness27 nm24.9 nm-8%within (±10%)outside the tested scopeFigure 3(a), PDF p. 7, rate against thickness read from the page and integrated to thickness against time
Si face (0001), 1200 °C, 1.403 hoxide thickness36 nm31.5 nm-12%near (±10%)outside the tested scopeFigure 3(a), PDF p. 7, rate against thickness read from the page and integrated to thickness against time
Si face (0001), 1200 °C, 1.913 hoxide thickness45 nm37.4 nm-17%near (±10%)outside the tested scopeFigure 3(a), PDF p. 7, rate against thickness read from the page and integrated to thickness against time
Si face (0001), 1200 °C, 2.3741 hoxide thickness53 nm42.1 nm-21%off (±10%)outside the tested scopeFigure 3(a), PDF p. 7, rate against thickness read from the page and integrated to thickness against time
Si face (0001), 1200 °C, 3.1742 hoxide thickness67 nm49.4 nm-26%off (±10%)outside the tested scopeFigure 3(a), PDF p. 7, rate against thickness read from the page and integrated to thickness against time
Si face (0001), 1200 °C, 4.8969 hoxide thickness98 nm62.6 nm-36%off (±10%)outside the tested scopeFigure 3(a), PDF p. 7, rate against thickness read from the page and integrated to thickness against time
Si face (0001), 1150 °C, 0.0432 hoxide thickness4.3 nm4.06 nm-6%within (±10%)outside the tested scopeFigure 3(a), PDF p. 7, rate against thickness read from the page and integrated to thickness against time
Si face (0001), 1150 °C, 0.0788 hoxide thickness5.2 nm4.85 nm-7%within (±10%)outside the tested scopeFigure 3(a), PDF p. 7, rate against thickness read from the page and integrated to thickness against time
Si face (0001), 1150 °C, 0.2481 hoxide thickness8.8 nm7.95 nm-10%within (±10%)outside the tested scopeFigure 3(a), PDF p. 7, rate against thickness read from the page and integrated to thickness against time
Si face (0001), 1150 °C, 0.4391 hoxide thickness12 nm10.7 nm-11%near (±10%)outside the tested scopeFigure 3(a), PDF p. 7, rate against thickness read from the page and integrated to thickness against time
Si face (0001), 1150 °C, 0.7002 hoxide thickness15.6 nm13.9 nm-11%near (±10%)outside the tested scopeFigure 3(a), PDF p. 7, rate against thickness read from the page and integrated to thickness against time
Si face (0001), 1150 °C, 1.3817 hoxide thickness24 nm20.3 nm-16%near (±10%)outside the tested scopeFigure 3(a), PDF p. 7, rate against thickness read from the page and integrated to thickness against time
Si face (0001), 1150 °C, 2.1613 hoxide thickness33 nm26 nm-21%off (±10%)outside the tested scopeFigure 3(a), PDF p. 7, rate against thickness read from the page and integrated to thickness against time
Si face (0001), 1150 °C, 3.0583 hoxide thickness43 nm31.5 nm-27%off (±10%)outside the tested scopeFigure 3(a), PDF p. 7, rate against thickness read from the page and integrated to thickness against time
Si face (0001), 1150 °C, 4.2145 hoxide thickness56 nm37.5 nm-33%off (±10%)outside the tested scopeFigure 3(a), PDF p. 7, rate against thickness read from the page and integrated to thickness against time
Si face (0001), 1100 °C, 0.0567 hoxide thickness5.6 nm5.52 nm-1%within (±10%)outside the tested scopeFigure 3(a), PDF p. 7, rate against thickness read from the page and integrated to thickness against time
Si face (0001), 1100 °C, 0.1299 hoxide thickness6.3 nm6.2 nm-2%within (±10%)outside the tested scopeFigure 3(a), PDF p. 7, rate against thickness read from the page and integrated to thickness against time
Si face (0001), 1100 °C, 0.3244 hoxide thickness7.9 nm7.8 nm-1%within (±10%)outside the tested scopeFigure 3(a), PDF p. 7, rate against thickness read from the page and integrated to thickness against time
Si face (0001), 1100 °C, 0.5859 hoxide thickness9.8 nm9.64 nm-2%within (±10%)outside the tested scopeFigure 3(a), PDF p. 7, rate against thickness read from the page and integrated to thickness against time
Si face (0001), 1100 °C, 0.8392 hoxide thickness11.4 nm11.2 nm-2%within (±10%)outside the tested scopeFigure 3(a), PDF p. 7, rate against thickness read from the page and integrated to thickness against time
Si face (0001), 1100 °C, 1.3738 hoxide thickness14.5 nm14 nm-3%within (±10%)outside the tested scopeFigure 3(a), PDF p. 7, rate against thickness read from the page and integrated to thickness against time
Si face (0001), 1100 °C, 1.8204 hoxide thickness17 nm16 nm-6%within (±10%)outside the tested scopeFigure 3(a), PDF p. 7, rate against thickness read from the page and integrated to thickness against time
Si face (0001), 1100 °C, 2.5614 hoxide thickness21 nm19 nm-10%within (±10%)outside the tested scopeFigure 3(a), PDF p. 7, rate against thickness read from the page and integrated to thickness against time
Si face (0001), 1100 °C, 3.8186 hoxide thickness27.6 nm23.3 nm-16%near (±10%)outside the tested scopeFigure 3(a), PDF p. 7, rate against thickness read from the page and integrated to thickness against time
Si face (0001), 1100 °C, 4.0905 hoxide thickness29 nm24.1 nm-17%near (±10%)outside the tested scopeFigure 3(a), PDF p. 7, rate against thickness read from the page and integrated to thickness against time
Si face (0001), 1050 °C, 0.1229 hoxide thickness4 nm3.79 nm-5%within (±10%)outside the tested scopeFigure 3(a), PDF p. 7, rate against thickness read from the page and integrated to thickness against time
Si face (0001), 1050 °C, 0.1889 hoxide thickness4.4 nm4.14 nm-6%within (±10%)outside the tested scopeFigure 3(a), PDF p. 7, rate against thickness read from the page and integrated to thickness against time
Si face (0001), 1050 °C, 0.6145 hoxide thickness6.6 nm6.04 nm-8%within (±10%)outside the tested scopeFigure 3(a), PDF p. 7, rate against thickness read from the page and integrated to thickness against time
Si face (0001), 1050 °C, 1.0163 hoxide thickness8.4 nm7.48 nm-11%near (±10%)outside the tested scopeFigure 3(a), PDF p. 7, rate against thickness read from the page and integrated to thickness against time
Si face (0001), 1050 °C, 1.4173 hoxide thickness10 nm8.72 nm-13%near (±10%)outside the tested scopeFigure 3(a), PDF p. 7, rate against thickness read from the page and integrated to thickness against time
Si face (0001), 1050 °C, 2.0123 hoxide thickness12.2 nm10.3 nm-15%near (±10%)outside the tested scopeFigure 3(a), PDF p. 7, rate against thickness read from the page and integrated to thickness against time
Si face (0001), 1050 °C, 2.4349 hoxide thickness13.7 nm11.3 nm-17%near (±10%)outside the tested scopeFigure 3(a), PDF p. 7, rate against thickness read from the page and integrated to thickness against time
C face (000-1), 1200 °C, 0.0262 hoxide thickness15.8 nm17.7 nm+12%near (±10%)outside the tested scopeFigure 3(c), PDF p. 7, rate against thickness read from the page and integrated to thickness against time
C face (000-1), 1200 °C, 0.0538 hoxide thickness18.3 nm22.5 nm+23%off (±10%)outside the tested scopeFigure 3(c), PDF p. 7, rate against thickness read from the page and integrated to thickness against time
C face (000-1), 1200 °C, 0.1239 hoxide thickness23.7 nm33.7 nm+42%off (±10%)outside the tested scopeFigure 3(c), PDF p. 7, rate against thickness read from the page and integrated to thickness against time
C face (000-1), 1200 °C, 0.2123 hoxide thickness30 nm46.3 nm+54%off (±10%)outside the tested scopeFigure 3(c), PDF p. 7, rate against thickness read from the page and integrated to thickness against time
C face (000-1), 1200 °C, 0.3767 hoxide thickness40 nm66.6 nm+66%off (±10%)outside the tested scopeFigure 3(c), PDF p. 7, rate against thickness read from the page and integrated to thickness against time
C face (000-1), 1200 °C, 0.6034 hoxide thickness52 nm90.3 nm+74%off (±10%)outside the tested scopeFigure 3(c), PDF p. 7, rate against thickness read from the page and integrated to thickness against time
C face (000-1), 1200 °C, 0.9724 hoxide thickness71 nm123 nm+73%off (±10%)outside the tested scopeFigure 3(c), PDF p. 7, rate against thickness read from the page and integrated to thickness against time
C face (000-1), 1200 °C, 1.349 hoxide thickness90 nm151 nm+68%off (±10%)outside the tested scopeFigure 3(c), PDF p. 7, rate against thickness read from the page and integrated to thickness against time
C face (000-1), 1200 °C, 2.3345 hoxide thickness134 nm211 nm+58%off (±10%)outside the tested scopeFigure 3(c), PDF p. 7, rate against thickness read from the page and integrated to thickness against time
C face (000-1), 1200 °C, 3.866 hoxide thickness190 nm285 nm+50%off (±10%)outside the tested scopeFigure 3(c), PDF p. 7, rate against thickness read from the page and integrated to thickness against time
C face (000-1), 1100 °C, 0.0587 hoxide thickness12.6 nm15.1 nm+19%near (±10%)outside the tested scopeFigure 3(c), PDF p. 7, rate against thickness read from the page and integrated to thickness against time
C face (000-1), 1100 °C, 0.1774 hoxide thickness17.3 nm24.4 nm+41%off (±10%)outside the tested scopeFigure 3(c), PDF p. 7, rate against thickness read from the page and integrated to thickness against time
C face (000-1), 1100 °C, 0.3767 hoxide thickness23.7 nm37.7 nm+59%off (±10%)outside the tested scopeFigure 3(c), PDF p. 7, rate against thickness read from the page and integrated to thickness against time
C face (000-1), 1100 °C, 0.6976 hoxide thickness32.5 nm55.3 nm+70%off (±10%)outside the tested scopeFigure 3(c), PDF p. 7, rate against thickness read from the page and integrated to thickness against time
C face (000-1), 1100 °C, 1.1584 hoxide thickness44 nm76.1 nm+73%off (±10%)outside the tested scopeFigure 3(c), PDF p. 7, rate against thickness read from the page and integrated to thickness against time
C face (000-1), 1100 °C, 2.2098 hoxide thickness70 nm114 nm+62%off (±10%)outside the tested scopeFigure 3(c), PDF p. 7, rate against thickness read from the page and integrated to thickness against time
C face (000-1), 1100 °C, 3.0693 hoxide thickness90 nm138 nm+54%off (±10%)outside the tested scopeFigure 3(c), PDF p. 7, rate against thickness read from the page and integrated to thickness against time
C face (000-1), 1100 °C, 4.718 hoxide thickness123 nm178 nm+45%off (±10%)outside the tested scopeFigure 3(c), PDF p. 7, rate against thickness read from the page and integrated to thickness against time
C face (000-1), 1100 °C, 9.6321 hoxide thickness205 nm268 nm+31%off (±10%)outside the tested scopeFigure 3(c), PDF p. 7, rate against thickness read from the page and integrated to thickness against time
C face (000-1), 1100 °C, 19.5858 hoxide thickness330 nm398 nm+20%off (±10%)outside the tested scopeFigure 3(c), PDF p. 7, rate against thickness read from the page and integrated to thickness against time
C face (000-1), 1000 °C, 0.057 hoxide thickness7.5 nm7.59 nm+1%within (±10%)outside the tested scopeFigure 3(c), PDF p. 7, rate against thickness read from the page and integrated to thickness against time
C face (000-1), 1000 °C, 0.0858 hoxide thickness8.5 nm8.74 nm+3%within (±10%)outside the tested scopeFigure 3(c), PDF p. 7, rate against thickness read from the page and integrated to thickness against time
C face (000-1), 1000 °C, 0.1683 hoxide thickness10.8 nm11.8 nm+9%within (±10%)outside the tested scopeFigure 3(c), PDF p. 7, rate against thickness read from the page and integrated to thickness against time
C face (000-1), 1000 °C, 0.4004 hoxide thickness16 nm19.3 nm+21%off (±10%)outside the tested scopeFigure 3(c), PDF p. 7, rate against thickness read from the page and integrated to thickness against time
C face (000-1), 1000 °C, 0.7095 hoxide thickness21.8 nm27.7 nm+27%off (±10%)outside the tested scopeFigure 3(c), PDF p. 7, rate against thickness read from the page and integrated to thickness against time
C face (000-1), 1000 °C, 1.2127 hoxide thickness30 nm39 nm+30%off (±10%)outside the tested scopeFigure 3(c), PDF p. 7, rate against thickness read from the page and integrated to thickness against time
C face (000-1), 1000 °C, 2.1708 hoxide thickness44 nm56.3 nm+28%off (±10%)outside the tested scopeFigure 3(c), PDF p. 7, rate against thickness read from the page and integrated to thickness against time
C face (000-1), 1000 °C, 3.8216 hoxide thickness66 nm79.5 nm+21%off (±10%)outside the tested scopeFigure 3(c), PDF p. 7, rate against thickness read from the page and integrated to thickness against time
C face (000-1), 1000 °C, 5.5753 hoxide thickness88 nm99.6 nm+13%near (±10%)outside the tested scopeFigure 3(c), PDF p. 7, rate against thickness read from the page and integrated to thickness against time
C face (000-1), 900 °C, 0.0711 hoxide thickness6.2 nm5.96 nm-4%within (±10%)outside the tested scopeFigure 3(c), PDF p. 7, rate against thickness read from the page and integrated to thickness against time
C face (000-1), 900 °C, 0.1765 hoxide thickness7.8 nm7.44 nm-5%within (±10%)outside the tested scopeFigure 3(c), PDF p. 7, rate against thickness read from the page and integrated to thickness against time
C face (000-1), 900 °C, 0.3626 hoxide thickness10.4 nm9.82 nm-6%within (±10%)outside the tested scopeFigure 3(c), PDF p. 7, rate against thickness read from the page and integrated to thickness against time
C face (000-1), 900 °C, 0.7378 hoxide thickness15 nm14 nm-7%within (±10%)outside the tested scopeFigure 3(c), PDF p. 7, rate against thickness read from the page and integrated to thickness against time
C face (000-1), 900 °C, 1.0869 hoxide thickness18.8 nm17.4 nm-8%within (±10%)outside the tested scopeFigure 3(c), PDF p. 7, rate against thickness read from the page and integrated to thickness against time
C face (000-1), 900 °C, 1.7945 hoxide thickness25.7 nm23.3 nm-9%within (±10%)outside the tested scopeFigure 3(c), PDF p. 7, rate against thickness read from the page and integrated to thickness against time
C face (000-1), 900 °C, 3.5088 hoxide thickness40 nm34.6 nm-13%near (±10%)outside the tested scopeFigure 3(c), PDF p. 7, rate against thickness read from the page and integrated to thickness against time

Aligning the simulation: what the unstated things would have to be

Every step whose timing or temperature the paper leaves open carries a range in the history above (VARY). scripts/align_study.py searched those ranges against the paper's numbers through the same predictor, first one unknown at a time, then all together. No parameter a program declares fitted was touched. The unknowns were chosen on C_1100, Si_1100 only; every other number is a test they played no part in.

UnknownWhat the paper saysRange searchedThe reproduction usedBest aloneScore at the reproduction's valueBest score alone
Dry oxygen up to the first read thickness (5.7 nm): durationnot stated; the time to the first read point is the program's own0.25 to 4×1×1×8 of 20 within tolerance, median error 18.2%8 of 20 within tolerance, median error 18.2%

Together: ToFirstPoint duration 1× (was 1).

As reproduced: 29 of 73 within tolerance, median error 13.5%. Aligned: 29 of 73 within tolerance, median error 13.5%. On the held-out samples only: 21 of 53 within tolerance, median error 12.8% as reproduced, 21 of 53 within tolerance, median error 12.8% aligned.

How the comparison is made. Figure 3 gives growth rate against thickness at 1 atm. The second reader read 7 to 12 points per curve; the time between points is the integral of 1/rate over thickness (trapezoid rule), which turns each curve into thickness against time measured from its first point. The history anchors that first point where the program's own constants put it (the time the program needs to grow the first read thickness, 3 to 13 nm), so the scored points test the growth from there on, not the start. Points just after the anchor agree almost by construction; the last point of each curve is the real test. Every number is labelled outside the tested scope: 1200 °C and 900 °C are outside Song's 950 to 1150 °C, and the argon heat-up trips the program's scope check (see the gaps below).

As reproduced: 29 of 73 within 10%, median error 13.5%. The two faces err in opposite directions. Si face: the program is too slow, and more so as the oxide thickens; last points −36% (1200 °C, 98 nm), −33% (1150 °C, 56 nm), −17% (1100 °C, 29 nm), −17% (1050 °C, 14 nm). At 1150 °C and 43 nm Goto and Hijikata measure 11.0 nm/h; the program's rate there is B/(2X + A) = 4.3 nm/h. C face: the program is too fast at 15 to 100 nm, by up to +74% at 1200 °C and +73% at 1100 °C; at 1100 °C and 32 nm they measure 26 nm/h, the program gives 65 nm/h. The gap closes as the oxide thickens (+20% at 330 nm, where the rates are 10.8 and 13.1 nm/h) and at low temperature (900 °C: −13% at the last point).

What was searched. One unknown: the anchor, a factor from 0.25 to 4 on the time to the first read point, shared by every curve; chosen on the 1100 °C curves (20 points), tested on the other six (53 points). It is not flat: 8 of 20 at the program's own anchor, 5 at 0.63, 4 at 1.59, 0 at 0.25. The search keeps the program's own anchor. Held-out: 21 of 53 before and after. No time offset rescues a curve whose slope is wrong in the middle, and on these two faces the slope is wrong in opposite directions.

What it says about Song's constants. On the C face, Song's B and B/A transfer to Gupta and Akhtar's furnace (their page) and not to Goto and Hijikata's in-situ data. The C-face difference is largest at 20 to 100 nm, the region Goto and Hijikata call the interface-oxidation stage with deceleration; Song's linear-parabolic fit has no deceleration and Gupta and Akhtar's first point is already 21 to 78 nm. On the Si face, both other laboratories grow faster than Song's constants allow (Gupta and Akhtar by about 1.4 times in thickness, Goto and Hijikata's 8° off-axis wafers by up to 2.5 times in rate at 40 nm). The Si-face constants are the weak part of the program.

Heating and cooling transitions (above): no number moves. The argon heat-up and the assumed nitrogen transitions grow nothing in this program, and in-situ data have no cool-down.

✓21 within tolerance≈12 within twice the tolerance✕20 outside
simulation below the paper ← 0 → simulation above the paper-100%-50%0%+50%+100%Si face (0001), 1200 °C, 0.076 hoxide thicknessours 8.21 · paper 8.8 nm✓ within tolerance (-6.8%)Si face (0001), 1200 °C, 0.1459 hoxide thicknessours 10.2 · paper 11 nm✓ within tolerance (-7.3%)Si face (0001), 1200 °C, 0.2132 hoxide thicknessours 11.9 · paper 12.7 nm✓ within tolerance (-6.0%)Si face (0001), 1200 °C, 0.3744 hoxide thicknessours 15.6 · paper 16.3 nm✓ within tolerance (-4.4%)Si face (0001), 1200 °C, 0.5666 hoxide thicknessours 19.3 · paper 20.3 nm✓ within tolerance (-5.0%)Si face (0001), 1200 °C, 0.9123 hoxide thicknessours 24.9 · paper 27 nm✓ within tolerance (-7.7%)Si face (0001), 1200 °C, 1.403 hoxide thicknessours 31.5 · paper 36 nm≈ within twice the tolerance (-12%)Si face (0001), 1200 °C, 1.913 hoxide thicknessours 37.4 · paper 45 nm≈ within twice the tolerance (-17%)Si face (0001), 1200 °C, 2.3741 hoxide thicknessours 42.1 · paper 53 nm✕ outside (-21%)Si face (0001), 1200 °C, 3.1742 hoxide thicknessours 49.4 · paper 67 nm✕ outside (-26%)Si face (0001), 1200 °C, 4.8969 hoxide thicknessours 62.6 · paper 98 nm✕ outside (-36%)Si face (0001), 1150 °C, 0.0432 hoxide thicknessours 4.06 · paper 4.3 nm✓ within tolerance (-5.5%)Si face (0001), 1150 °C, 0.0788 hoxide thicknessours 4.85 · paper 5.2 nm✓ within tolerance (-6.7%)Si face (0001), 1150 °C, 0.2481 hoxide thicknessours 7.95 · paper 8.8 nm✓ within tolerance (-9.7%)Si face (0001), 1150 °C, 0.4391 hoxide thicknessours 10.7 · paper 12 nm≈ within twice the tolerance (-11%)Si face (0001), 1150 °C, 0.7002 hoxide thicknessours 13.9 · paper 15.6 nm≈ within twice the tolerance (-11%)Si face (0001), 1150 °C, 1.3817 hoxide thicknessours 20.3 · paper 24 nm≈ within twice the tolerance (-16%)Si face (0001), 1150 °C, 2.1613 hoxide thicknessours 26 · paper 33 nm✕ outside (-21%)Si face (0001), 1150 °C, 3.0583 hoxide thicknessours 31.5 · paper 43 nm✕ outside (-27%)Si face (0001), 1150 °C, 4.2145 hoxide thicknessours 37.5 · paper 56 nm✕ outside (-33%)Si face (0001), 1050 °C, 0.1229 hoxide thicknessours 3.79 · paper 4 nm✓ within tolerance (-5.3%)Si face (0001), 1050 °C, 0.1889 hoxide thicknessours 4.14 · paper 4.4 nm✓ within tolerance (-5.8%)Si face (0001), 1050 °C, 0.6145 hoxide thicknessours 6.04 · paper 6.6 nm✓ within tolerance (-8.4%)Si face (0001), 1050 °C, 1.0163 hoxide thicknessours 7.48 · paper 8.4 nm≈ within twice the tolerance (-11%)Si face (0001), 1050 °C, 1.4173 hoxide thicknessours 8.72 · paper 10 nm≈ within twice the tolerance (-13%)Si face (0001), 1050 °C, 2.0123 hoxide thicknessours 10.3 · paper 12.2 nm≈ within twice the tolerance (-15%)Si face (0001), 1050 °C, 2.4349 hoxide thicknessours 11.3 · paper 13.7 nm≈ within twice the tolerance (-17%)C face (000-1), 1200 °C, 0.0262 hoxide thicknessours 17.7 · paper 15.8 nm≈ within twice the tolerance (+12%)C face (000-1), 1200 °C, 0.0538 hoxide thicknessours 22.5 · paper 18.3 nm✕ outside (+23%)C face (000-1), 1200 °C, 0.1239 hoxide thicknessours 33.7 · paper 23.7 nm✕ outside (+42%)C face (000-1), 1200 °C, 0.2123 hoxide thicknessours 46.3 · paper 30 nm✕ outside (+54%)C face (000-1), 1200 °C, 0.3767 hoxide thicknessours 66.6 · paper 40 nm✕ outside (+66%)C face (000-1), 1200 °C, 0.6034 hoxide thicknessours 90.3 · paper 52 nm✕ outside (+74%)C face (000-1), 1200 °C, 0.9724 hoxide thicknessours 123 · paper 71 nm✕ outside (+73%)C face (000-1), 1200 °C, 1.349 hoxide thicknessours 151 · paper 90 nm✕ outside (+68%)C face (000-1), 1200 °C, 2.3345 hoxide thicknessours 211 · paper 134 nm✕ outside (+58%)C face (000-1), 1200 °C, 3.866 hoxide thicknessours 285 · paper 190 nm✕ outside (+50%)C face (000-1), 1000 °C, 0.057 hoxide thicknessours 7.59 · paper 7.5 nm✓ within tolerance (+1.3%)C face (000-1), 1000 °C, 0.0858 hoxide thicknessours 8.74 · paper 8.5 nm✓ within tolerance (+2.8%)C face (000-1), 1000 °C, 0.1683 hoxide thicknessours 11.8 · paper 10.8 nm✓ within tolerance (+9.4%)C face (000-1), 1000 °C, 0.4004 hoxide thicknessours 19.3 · paper 16 nm✕ outside (+21%)C face (000-1), 1000 °C, 0.7095 hoxide thicknessours 27.7 · paper 21.8 nm✕ outside (+27%)C face (000-1), 1000 °C, 1.2127 hoxide thicknessours 39 · paper 30 nm✕ outside (+30%)C face (000-1), 1000 °C, 2.1708 hoxide thicknessours 56.3 · paper 44 nm✕ outside (+28%)C face (000-1), 1000 °C, 3.8216 hoxide thicknessours 79.5 · paper 66 nm✕ outside (+21%)C face (000-1), 1000 °C, 5.5753 hoxide thicknessours 99.6 · paper 88 nm≈ within twice the tolerance (+13%)C face (000-1), 900 °C, 0.0711 hoxide thicknessours 5.96 · paper 6.2 nm✓ within tolerance (-3.8%)C face (000-1), 900 °C, 0.1765 hoxide thicknessours 7.44 · paper 7.8 nm✓ within tolerance (-4.6%)C face (000-1), 900 °C, 0.3626 hoxide thicknessours 9.82 · paper 10.4 nm✓ within tolerance (-5.6%)C face (000-1), 900 °C, 0.7378 hoxide thicknessours 14 · paper 15 nm✓ within tolerance (-6.7%)C face (000-1), 900 °C, 1.0869 hoxide thicknessours 17.4 · paper 18.8 nm✓ within tolerance (-7.7%)C face (000-1), 900 °C, 1.7945 hoxide thicknessours 23.3 · paper 25.7 nm✓ within tolerance (-9.5%)C face (000-1), 900 °C, 3.5088 hoxide thicknessours 34.6 · paper 40 nm≈ within twice the tolerance (-13%)
The pale green band is the tolerance. Bars past ±100% are cut and carry their value.

21 within, 12 near, 20 off of 53 numbers with the aligned settings (the samples used to choose the unknowns are left out).

SampleQuantityThe paperAs reproduced aboveAlignedDifferenceVerdictHow
Si face (0001), 1200 °C, 0.076 hoxide thickness8.8 nm8.218.21-7%within (±10%)test
Si face (0001), 1200 °C, 0.1459 hoxide thickness11 nm10.210.2-7%within (±10%)test
Si face (0001), 1200 °C, 0.2132 hoxide thickness12.7 nm11.911.9-6%within (±10%)test
Si face (0001), 1200 °C, 0.3744 hoxide thickness16.3 nm15.615.6-4%within (±10%)test
Si face (0001), 1200 °C, 0.5666 hoxide thickness20.3 nm19.319.3-5%within (±10%)test
Si face (0001), 1200 °C, 0.9123 hoxide thickness27 nm24.924.9-8%within (±10%)test
Si face (0001), 1200 °C, 1.403 hoxide thickness36 nm31.531.5-12%near (±10%)test
Si face (0001), 1200 °C, 1.913 hoxide thickness45 nm37.437.4-17%near (±10%)test
Si face (0001), 1200 °C, 2.3741 hoxide thickness53 nm42.142.1-21%off (±10%)test
Si face (0001), 1200 °C, 3.1742 hoxide thickness67 nm49.449.4-26%off (±10%)test
Si face (0001), 1200 °C, 4.8969 hoxide thickness98 nm62.662.6-36%off (±10%)test
Si face (0001), 1150 °C, 0.0432 hoxide thickness4.3 nm4.064.06-6%within (±10%)test
Si face (0001), 1150 °C, 0.0788 hoxide thickness5.2 nm4.854.85-7%within (±10%)test
Si face (0001), 1150 °C, 0.2481 hoxide thickness8.8 nm7.957.95-10%within (±10%)test
Si face (0001), 1150 °C, 0.4391 hoxide thickness12 nm10.710.7-11%near (±10%)test
Si face (0001), 1150 °C, 0.7002 hoxide thickness15.6 nm13.913.9-11%near (±10%)test
Si face (0001), 1150 °C, 1.3817 hoxide thickness24 nm20.320.3-16%near (±10%)test
Si face (0001), 1150 °C, 2.1613 hoxide thickness33 nm2626-21%off (±10%)test
Si face (0001), 1150 °C, 3.0583 hoxide thickness43 nm31.531.5-27%off (±10%)test
Si face (0001), 1150 °C, 4.2145 hoxide thickness56 nm37.537.5-33%off (±10%)test
Si face (0001), 1050 °C, 0.1229 hoxide thickness4 nm3.793.79-5%within (±10%)test
Si face (0001), 1050 °C, 0.1889 hoxide thickness4.4 nm4.144.14-6%within (±10%)test
Si face (0001), 1050 °C, 0.6145 hoxide thickness6.6 nm6.046.04-8%within (±10%)test
Si face (0001), 1050 °C, 1.0163 hoxide thickness8.4 nm7.487.48-11%near (±10%)test
Si face (0001), 1050 °C, 1.4173 hoxide thickness10 nm8.728.72-13%near (±10%)test
Si face (0001), 1050 °C, 2.0123 hoxide thickness12.2 nm10.310.3-15%near (±10%)test
Si face (0001), 1050 °C, 2.4349 hoxide thickness13.7 nm11.311.3-17%near (±10%)test
C face (000-1), 1200 °C, 0.0262 hoxide thickness15.8 nm17.717.7+12%near (±10%)test
C face (000-1), 1200 °C, 0.0538 hoxide thickness18.3 nm22.522.5+23%off (±10%)test
C face (000-1), 1200 °C, 0.1239 hoxide thickness23.7 nm33.733.7+42%off (±10%)test
C face (000-1), 1200 °C, 0.2123 hoxide thickness30 nm46.346.3+54%off (±10%)test
C face (000-1), 1200 °C, 0.3767 hoxide thickness40 nm66.666.6+66%off (±10%)test
C face (000-1), 1200 °C, 0.6034 hoxide thickness52 nm90.390.3+74%off (±10%)test
C face (000-1), 1200 °C, 0.9724 hoxide thickness71 nm123123+73%off (±10%)test
C face (000-1), 1200 °C, 1.349 hoxide thickness90 nm151151+68%off (±10%)test
C face (000-1), 1200 °C, 2.3345 hoxide thickness134 nm211211+58%off (±10%)test
C face (000-1), 1200 °C, 3.866 hoxide thickness190 nm285285+50%off (±10%)test
C face (000-1), 1000 °C, 0.057 hoxide thickness7.5 nm7.597.59+1%within (±10%)test
C face (000-1), 1000 °C, 0.0858 hoxide thickness8.5 nm8.748.74+3%within (±10%)test
C face (000-1), 1000 °C, 0.1683 hoxide thickness10.8 nm11.811.8+9%within (±10%)test
C face (000-1), 1000 °C, 0.4004 hoxide thickness16 nm19.319.3+21%off (±10%)test
C face (000-1), 1000 °C, 0.7095 hoxide thickness21.8 nm27.727.7+27%off (±10%)test
C face (000-1), 1000 °C, 1.2127 hoxide thickness30 nm3939+30%off (±10%)test
C face (000-1), 1000 °C, 2.1708 hoxide thickness44 nm56.356.3+28%off (±10%)test
C face (000-1), 1000 °C, 3.8216 hoxide thickness66 nm79.579.5+21%off (±10%)test
C face (000-1), 1000 °C, 5.5753 hoxide thickness88 nm99.699.6+13%near (±10%)test
C face (000-1), 900 °C, 0.0711 hoxide thickness6.2 nm5.965.96-4%within (±10%)test
C face (000-1), 900 °C, 0.1765 hoxide thickness7.8 nm7.447.44-5%within (±10%)test
C face (000-1), 900 °C, 0.3626 hoxide thickness10.4 nm9.829.82-6%within (±10%)test
C face (000-1), 900 °C, 0.7378 hoxide thickness15 nm1414-7%within (±10%)test
C face (000-1), 900 °C, 1.0869 hoxide thickness18.8 nm17.417.4-8%within (±10%)test
C face (000-1), 900 °C, 1.7945 hoxide thickness25.7 nm23.323.3-9%within (±10%)test
C face (000-1), 900 °C, 3.5088 hoxide thickness40 nm34.634.6-13%near (±10%)test

The model, as printed (for a future program). Interface reaction rate (eq. 5): k = k0 (1 − C_Si^I/C_Si^0)(1 − C_C^I/C_C^0). Growth (eq. 2 with eq. 8): N0 dX/dt = k C_O^I (1 − ν_Si) + ∫ (κ1 C_Si C_O + κ2 C_Si C_O²) dx + N0 R_S exp(−X/L_S), N0 = 2.25×10²² cm⁻³. Diffusion in the oxide (eq. 6) for Si and C interstitials and O2, with absorption R1 = κ C C_O and R2 = κ C C_O², surface exchange through η and the gas-phase coefficient h. Interface fluxes (eq. 7): D_Si ∂C_Si/∂x = −ν_Si k C_O^I, D_C ∂C_C/∂x = −ν_C k C_O^I, D_O ∂C_O/∂x = (3/2 − ν_Si − ν_C/2) k C_O^I (reconstructed from a damaged text layer; check against the page). Substrate side (eqs. 9 to 12): C interstitials diffuse into SiC and recombine with C vacancies (γ C_C^b V_C), entering with flux ν_C^b N_s dX/dt, ν^b = 1.2×10⁻⁹ ν, V_C0 = 10¹³ cm⁻³, N_s = 4.8×10²² cm⁻³; Si interstitials likewise with D_Si^b = 5.8×10⁻¹⁰ exp(−1.53 eV/kT) cm²/s. Oxygen solubility C_O^0 scales with pressure.

Parameters. Printed or readable: k0 (Figure 4a; activation energy 2.02 eV on the Si face, 1.37 on the a face, 0.68 on the C face by the figure's labels; the text gives the reverse order), ν_Si and ν_C (Figure 4b; ν_Si 0.20 to 0.38 on the Si face at 1050 to 1200 °C, 0.002 to 0.30 on the C face at 900 to 1200 °C; ν_C about 0.04 to 0.10, the same on every face), R_S (Figure 5a; 18 to 100 nm/h on the Si face, 52 to 270 nm/h on the C face; 2.02 and 1.01 eV), L_S (Figure 5b; about 1.5 nm at 900 °C to 5 nm at 1200 °C, common to the faces; the text says 1.2 nm at 1100 °C). Not printed: D_Si, D_O, η, κ1, κ2, C_Si^0 (taken from Uematsu, Kageshima and Shiraishi's silicon work, refs 32 and 38), and every C-related parameter (D_C, η′, κ1′, κ2′, C_C^0) and C_O^0 (fitted, values not given). The model cannot be run from this paper alone.

Can the project's growth law carry it? Partly. (1) The steady-state limit (the paper says it is Massoud's relation) can be written today: one more term R_S exp(−X/L_S) in d(x_ox)/dt beside B/(2x + A). With Song's Si-face constants and Goto and Hijikata's R_S = 32 nm/h, L_S = 2.3 nm at 1100 °C, the rate rises from 10.3 to 13.9 nm/h at 5 nm (measured 12.5) and is unchanged above 10 nm, where the Si-face deficit is (3.6 against 5.3 nm/h at 20 nm). So the term fixes the first nanometres, not the Si face. (2) The substrate side (eqs. 9 to 12) can be written in the language as it is: a grid in SiC that travels with the front, a boundary flux ν^b N_s d(x_ox)/dt at the interface, a vacancy field and a recombination source. (3) The oxide side cannot: its fields live on a layer whose thickness is the growing state x_ox, and the language's grids have fixed length (“a layer whose own thickness changes, such as the growing oxide itself, has no grid of varying length yet”). The interface concentrations would be left(C_Si), which exists; the absorption integral ∫ κ C_Si C_O dx needs the integral of a product of two fields, which does not.

What our language and ontology cannot yet say

  • A grid whose length is a state (GRID oxide { FROM: 0; TO: x_ox; CELLS: 50 }), or a stretched coordinate with position-dependent velocity, so interstitial and oxidant profiles can live in the growing oxide. This is the one change that would let the Si and C emission model be written as a candidate structure beside the linear-parabolic law.
  • integral(expr) over a product of fields (the paper's ∫ κ C_Si C_O dx), not only integral(F) of one field.
  • A growth rate against thickness as an observable (OBSERVE rate OF x_ox AT Thickness), so in-situ rate data can be scored directly instead of integrated into times that carry every reading error.
  • A time origin at gas admission and an observation that starts later (MEASURE … FROM first_resolved_thickness): the paper's clock starts when argon is replaced by oxygen, its data at 3 to 13 nm; we had to anchor the clock with the program's own constants.
  • OFFCUT read by the growth program: this Si face is 8° off axis, Song's on axis, and Song's Si-face constants are up to 36% slow here. The C face is 0.5° off.
  • The sic_growth scope check marks a history outside its tested scope when any step is not dry oxygen, including an argon heat-up that grows nothing. It should check only the steps where oxide grows (and the temperatures of those).

With heating and cooling transitions

No paper we hold states how its wafers heated up or cooled down. The project owner specified scenarios for one Vitkavage wafer (isl_harness/vitkavage_transitions.py); isl_harness/thermal_transitions.py applies the same numbers to every sample here: a heat-up in nitrogen before the first furnace step (a hot push of 1 to 5 min, or a cold-furnace ramp of 60 to 120 min), the owner's radiative cooling knots after the last furnace step or after the paper's own pull (fast, or every time multiplied by 5), and ramps around an anneal at 300 to 500 °C. The paper's own steps are kept as written. All transitions are assumptions, written in the history with TIMING assumed.

HistoryWithin toleranceMedian errorChanged numbers
as the paper states it (above)29 of 7313.5%
heat-up A (hot push), fast cooling29 of 7313.5%0 of 73 moved by more than 2%
heat-up A (hot push), slow cooling29 of 7313.5%0 of 73 moved by more than 2%
heat-up B (cold-furnace ramp), fast cooling29 of 7313.5%0 of 73 moved by more than 2%
heat-up B (cold-furnace ramp), slow cooling29 of 7313.5%0 of 73 moved by more than 2%

The paper's own conclusions

The paper statesWhat we find
All growth rates on three faces, 900 to 1200 °C and 0.02 to 1 atm, are reproduced by the Si and C emission model with an enhanced surface growth termThe linear-parabolic program with Song's constants: Si face 17 to 36% thin at the last point, C face up to 74% thick at 15 to 100 nmmissed
A fast initial (surface) growth stage, then deceleration to a steady interface-limited rate (f = 4 to 6, independent of face and temperature)No deceleration in the linear-parabolic law; the rate falls only as 1/(2X + A)not in the program
Activation energy of k0 scales with the number of Si back-bonds (Si face highest)Not tested; Song's B/A activation energies are 1.38 eV (Si) and 1.18 eV (C) in the programnot tested
ν_C is the same on every face; ν_Si sets the interface-limited rateNo emission in the programnot modelled
C interstitials at the interface (oxide side) peak at a few tens of nm; substrate-side C rises with temperature and thickness; thinner oxides at lower temperature advisedNo interstitial fields; simulated in the paper, not measurednot modelled

What we would like Emily to check

  1. Is a time integral of rates read from a log-log figure an acceptable way to compare with a thickness-against-time model, or should the comparison stay in rates?
  2. Goto and Hijikata's Si face is 8° off axis and Song's is on axis. How much faster would you expect the off-axis Si face to oxidize?
  3. For a program that has to predict 20 to 100 nm gate oxides, is the Massoud-type surface term (R_S, L_S) enough, or are the interstitial profiles needed?