Agentic PrimitivesAP

Study reproduced ·

Reproducing Gupta and Akhtar 2011: dry and wet oxidation of both faces of 4H-SiC, a second laboratory for Song's constants

Gupta and Akhtar 2011: the sample and the timing of its process history as the paper states them, our encoding beside them item by item, the simulation in ISL, and how far it lands from the paper's numbers (17 within, 4 near, 27 off).

Richard Pedersen · Agentic Trust Labs · Rich Canvas

One of the [studies we reproduced](/writing/interface-studies-reproduced) for [Questions we need Emily to answer](/writing/questions-for-emily-testing-a-theory-of-the-interface), the companion to [the essay](/writing/testing-a-theory-of-the-interface-with-an-ontology). Generated by `scripts/reproduce_studies.py` from `reproductions/gupta_akhtar.py`. Every value from the paper was read by an AI agent and has not been checked by a person; the sample and history were re-read from the PDF alone by a second agent that had not seen our earlier transcription.

The study and why we depend on it

S. K. Gupta and J. Akhtar, “Thermal Oxidation of Silicon Carbide (SiC) – Experimentally Observed Facts”, in M. Mukherjee (ed.), Silicon Carbide – Materials, Processing and Applications in Electronic Devices, InTech (2011), chapter 9, pp. 207–230.

A second laboratory for the SiC growth program. Song 2004's constants (the only SiC growth constants we hold) are run on this chapter's dry-oxygen thickness curves for the Si and C faces at 1000, 1050, 1110 and 1150 °C (48 thicknesses read from Figure 10), and the chapter's own rate constants are set beside Song's. The wet-oxygen curves have no SiC program to run.

How well can this study be reproduced?

Moderate. The furnace cycle is described better than in most papers: load and unload at 800 °C in nitrogen, ramps at 5 °C/min, a dry or bubbler-wet oxygen hold. What is missing is the gas during the ramps, the flow of dry oxygen, and a single statement of the oxidation times: the text, Figure 3 and Figure 10 give three different sets.

Sample described2 of 5 properties we need are stated and encoded the same
History described2 of 8 steps are stated and encoded the same; 3 are stated by the paper and absent from our history; 1 are ours because the paper is silent
Timing2 of 4 simulated steps have a stated duration; 2 of 4 other steps have none; 6 timing gaps listed below
How the results are givenThickness only on Figure 10 (read from the page, about ±1 nm on the Si face and ±3 nm on the C face); rate constants and activation energies in printed tables without units (µm²/h and µm/h from the axes of Figures 15 and 16)
Repeatability stated by the authorsFour samples per condition, “statistically plotted”; no scatter or error bars given
Internal consistencyFair. The fourth temperature column of Tables 1 and 2 is printed 1050 for 1150 °C; the oxidation times differ between text and figures; the Si-face B/A at 1150 °C (0.58 µm/h) gives A ≈ 1 nm, which the straight lines of Figure 16 do not show
Is our model independent of this paper's data?Yes. Nothing in our SiC programs was fitted to this chapter. The growth program uses Song 2004's tabulated constants, so every number here tests whether Song's constants transfer to another laboratory's furnace
Outcome17 of 48 numbers within tolerance

The grade is ours and is about the paper as a source for simulation, not about the quality of the experiment: high means the sample, every step and its timing are stated well enough that a simulation needs no choices of ours; moderate that some choices are ours and are listed; low that the result depends on choices the paper does not constrain.

The sample and its history, played back

The sample is drawn from the simulation: layer heights and the read-outs are what the ISL programs compute at each moment of the history. Steps the language cannot state (a clean, a metallization, a measurement) are on the clock and marked as recorded, not simulated.

4H-SiC
Step 1 of 8 · recorded, not simulated
Degrease, RCA, piranha, HF dips
temperature 25 °C
elapsed 0 s of 8 h 20 min 01 s
timing in the paper: stated. each bath timed; time from the last HF dip to loading not stated

“The wafers were treated for all three major chemical cleaning procedures i.e. Degreasing, RCA and Piranha.” … “Finally, the wafers were thoroughly rinsed in DI- water which, is followed by 10% HF dip.”

The simulation at this moment
oxide thickness0 nm
consumed substrate0 nm
CleanLoadRampUp70 minBeforeClock1 sOxidation6 hRampDown70 minUnloadMeasur11500 °CThe same history to true scale (8 h 20 min 01 s simulated). Steps with no stated duration take no width.Temperature through the history. Step widths grow with the logarithm of duration; the bar under each step is how well our encoding matches the paper.
Drag the sample to turn it. Click the clock to move through the history.Layer heights are the simulated thicknesses, drawn to one scale within the film; the substrate is cut short.

Does our sample and history match the paper's?

Left: the paper's own words, with the page of the PDF. Right: what we simulate. 4 same, 5 approximated, 1 assumed, 3 not in ours.

✓4 same≈5 approximated?1 assumed✕3 not in ours
Sample: what the paper saysWhat we simulate
Substrate
“n-type 4H-SiC material … with maximum possible epitaxy layer (50 µm) on Si-face with lowest possible doping … CREE Research Inc. USA supplied the following structure on a 2” diameter wafer”
PDF p. 2
✓same
FAMILY: SiC_SiO2; ORIENTATION: 4H_SiC_Si_face
Off-cut and doping value are in Figure 1(a), which has no text layer; not recorded.
C face
“both faces of 4H-SiC”; which wafers carried the C face is not said
PDF p. 4
≈approximated
ORIENTATION: 4H_SiC_C_face
With a 50 µm epilayer on the Si face, the C face is presumably the substrate side of the same wafers.
Doping
n type; “lowest possible doping”
PDF p. 2
✓same
DOPING: n_type (recorded; no program reads it)
Starting oxide
final 10% HF dip before loading
PDF p. 4
≈approximated
the program's 0.2 nm native oxide (Song's)
Time from the HF dip to loading not stated.
Replicates
“four numbers of samples were oxidized at same temperature for same oxidation time”
PDF p. 8
≈approximated
one simulated sample per point
History: what the paper saysWhat we simulate
Degrease, RCA, piranha, HF dips
“The wafers were treated for all three major chemical cleaning procedures i.e. Degreasing, RCA and Piranha.” … “Finally, the wafers were thoroughly rinsed in DI- water which, is followed by 10% HF dip.”
PDF p. 4
✕not in ours
CLEAN: not_stated
Every bath has its time (10 min each solvent, SC-1 10 min, HF 1 min, SC-2 10 min, piranha 15 min); the vocabulary's cleans are silicon cleans and none is this sequence.
Loaded at 800 °C in nitrogen
“The samples of each group were loaded and unloaded at 800C in the 1.9 LPM flow of nitrogen”
PDF p. 5
✕not in ours
not in our history
Push rate and time at 800 °C before the ramp are not stated.
Ramp 800 → 1150 °C at 5 °C/min
“the ramp up and ramp down temperature of furnace 5C/min as shown in figure 3”; the gas during the ramp is not stated
PDF p. 5
≈approximated
RUN RampUp DURATION 4200 TEMP 800->1150 AMBIENT inert_N2
The rate is stated; nitrogen during the ramp is ours (the load is in nitrogen and the oxidizing gas is only said to flow during the process). A ramp in oxygen is a variant.
Oxygen at 1150 °C before the clock starts
not stated: Figure 3 draws the oxidation time as the plateau only
PDF p. 5
?assumed
RUN BeforeClock DURATION 1 TEMP 1150->1150 AMBIENT dry_O2
An offset of time zero: oxygen reaching the sample before the plotted time begins (the gas switched on during the ramp's end, or a clock started late). 1 s, i.e. none, is the reproduction's value.
Dry oxidation at 1150 °C, 0.5 to 6 h
“While in the experiment of dry oxidation, a continuous flow of constant dry oxygen is maintained throughout the process.” Times: Figure 10 axis 0.5, 2, 3, 4, 5, 6 h
PDF p. 5
✓same
RUN Oxidation DURATION 21600 TEMP 1150->1150 AMBIENT dry_O2
Dry oxygen flow not stated. The text says 30 to 180 min in 30 min steps, Figure 3 says 0.5 to 6 h in 0.5 h steps, Figure 10 plots 0.5, 2, 3, 4, 5 and 6 h; Figure 16's t/X0 values fit Figure 10's times. Figure 10's times are used; the text's are a variant.
Ramp 1150 → 800 °C at 5 °C/min
“ramp down temperature of furnace 5C/min”; gas not stated
PDF p. 5
≈approximated
RUN RampDown DURATION 4200 TEMP 1150->800 AMBIENT inert_N2
Nitrogen is ours. The curve points are taken at the end of the oxidation, so this step does not enter the scored numbers.
Unloaded at 800 °C in nitrogen
“loaded and unloaded at 800C in the 1.9 LPM flow of nitrogen”
PDF p. 5
✕not in ours
the history ends at 800 °C
Thickness by ellipsometry, checked by stylus profiler
“The thickness of thermally grown oxide on both terminating faces was experimentally captured by ellipsometry technique followed by DAKTEK surface profiler verification.”
PDF p. 5
✓same
the observable Thickness
Single-wavelength He-Ne ellipsometry. Four samples per condition, plotted “statistically”; no scatter given.

The timing of the history

Time is counted from the start of the first simulated step. A step the language cannot state takes no simulated time; where the paper gives its duration, the duration is in the last column. Stated means the paper gives the duration; partly stated that it gives a bound or a range; not stated; assumed that the duration in our history is ours.

Si face (0001), 1150 °C

#StepStarts atLastsEnds atTemperatureRateGasIs the timing in the paper?
1Degrease, RCA, piranha, HF dips0 snot simulatedstated. each bath timed; time from the last HF dip to loading not stated
2Loaded at 800 °C in nitrogen0 snot simulatednot stated. hold at 800 °C before the ramp not stated
3Ramp 800 → 1150 °C at 5 °C/min0 s1 h 10 min1 h 10 min800 → 1150 °C+0.0833 °C/sinert_N2stated. 70 min at 5 °C/min from 800 °C (derived from the stated rate); gas not stated
4Oxygen at 1150 °C before the clock starts1 h 10 min1 s1 h 10 min 01 s1150 → 1150 °Chelddry_O2not stated; assumed. Not stated; searched from 0 to 30 min
5Dry oxidation at 1150 °C, 0.5 to 6 h1 h 10 min 01 s6 h 00 min7 h 10 min 01 s1150 → 1150 °Chelddry_O2partly stated. three different statements of the times; Figure 10's used
6Ramp 1150 → 800 °C at 5 °C/min7 h 10 min 01 s1 h 10 min8 h 20 min 01 s1150 → 800 °C-0.0833 °C/sinert_N2stated. 70 min (derived); gas not stated
7Unloaded at 800 °C in nitrogen8 h 20 min 01 snot simulatednot stated. cooling from 800 °C to room temperature not stated
8Thickness by ellipsometry, checked by stylus profiler8 h 20 min 01 snot simulatedstated

Simulated time in this history: 8 h 20 min 01 s.

Across the samples

SampleRampUpBeforeClockOxidationRampDownTotal
Si face (0001), 1150 °C1 h 10 min at 800→1150 °C1 s at 1150 °C6 h 00 min at 1150 °C1 h 10 min at 1150→800 °C8 h 20 min 01 s
Si face (0001), 1110 °C1 h 02 min at 800→1110 °C1 s at 1110 °C6 h 00 min at 1110 °C1 h 02 min at 1110→800 °C8 h 04 min 01 s
Si face (0001), 1050 °C50 min at 800→1050 °C1 s at 1050 °C6 h 00 min at 1050 °C50 min at 1050→800 °C7 h 40 min 01 s
Si face (0001), 1000 °C40 min at 800→1000 °C1 s at 1000 °C6 h 00 min at 1000 °C40 min at 1000→800 °C7 h 20 min 01 s
C face (000-1), 1150 °C1 h 10 min at 800→1150 °C1 s at 1150 °C6 h 00 min at 1150 °C1 h 10 min at 1150→800 °C8 h 20 min 01 s
C face (000-1), 1110 °C1 h 02 min at 800→1110 °C1 s at 1110 °C6 h 00 min at 1110 °C1 h 02 min at 1110→800 °C8 h 04 min 01 s
C face (000-1), 1050 °C50 min at 800→1050 °C1 s at 1050 °C6 h 00 min at 1050 °C50 min at 1050→800 °C7 h 40 min 01 s
C face (000-1), 1000 °C40 min at 800→1000 °C1 s at 1000 °C6 h 00 min at 1000 °C40 min at 1000→800 °C7 h 20 min 01 s

Timing the paper does not give

  • The gas during the 5 °C/min ramps (40 to 70 min each way): not stated.
  • Whether the oxidation time includes any of the ramp: not stated; Figure 3 draws it as the plateau only.
  • The oxidation times: the text says 30 to 180 min in 30 min steps, Figure 3 says 0.5 to 6 h in 0.5 h steps, Figure 10 plots 0.5, 2, 3, 4, 5 and 6 h.
  • Time at 800 °C after loading and before unloading, and the cooling from 800 °C: not stated.
  • Time from the last HF dip to loading: not stated.
  • Dry oxygen flow: not stated (wet: 0.4 LPM through the bubbler).

What the second reading changed

  • The project held this chapter as “skimmed”, with the tables transcribed in tables_agent_read_UNVERIFIED.csv and not used “until the units are settled from the chapter's figures”. The units are settled by Figures 15 and 16 (X0 in µm, t/X0 in h/µm): B in µm²/h, B/A in µm/h. The transcription's values agree with the second reading's, entry for entry.
  • The transcription keeps the printed “1050” for the fourth column; the text (p. 15, p. 19) and Figure 10 make it 1150 °C.
  • No stored recipe exists for this chapter: there was no dataset. The thicknesses scored here are the second reader's readings of Figure 10, not a project dataset.
  • Our sample has Song's 0.2 nm native oxide at the start, since the SiC growth program does not read STARTING_OXIDE_NM.

Their terms and ours

The paper saysWe writeKind in our vocabularyNote
X0: oxide thicknessThicknessobservable (target: layer_thickness)
B: parabolic rate constant; B/A: linear rate constant (Tables 1, 2)B, B_over_APARAMETER (would be STATUS sourced)Not used by any program: the program uses Song's. Units not printed; µm²/h and µm/h from the figure axes.
τ fixed to zeroINITIAL x_oxINITIAL of the stateSame convention as Song.
Si-face, C-face (“terminating faces”)ORIENTATION: 4H_SiC_Si_face, 4H_SiC_C_facesample field; process factor orientation
dry oxidation, continuous flow of dry oxygendry_O2ambientFlow not stated and not expressible.
wet oxidation: O2 through a DI-water bubbler at 85 °C, 0.4 LPMmix:H2O=0.57,O2=0.43 (saturated at 85 °C, ours)ambient by partial pressureNo SiC program reads water.
load/unload at 800 °C in 1.9 LPM N2EVENT Load KIND load; RUN … AMBIENT inert_N2event; ambient
ramp 5 °C/minRUN RampUp DURATION … TEMP 800->Ta RUN; the rate is the durationNo statement for a rate.
GRMF (growth rate multiplication factor)(ratio of two Thickness observables)not in vocabularyA derived quantity.
initial growth rate, average growth rate (eq. 6)(none)not in vocabularyA rate against thickness is not an observable of ours.

The simulation in our language

Each sample is one history file: a SAMPLE and a CONTROL_TRAJECTORY. This is the whole input; run it with PYTHONPATH=. python -m isl_harness.predict <file>.

Si face (0001), 1150 °C

# Si face (0001), 1150 °C
SAMPLE SiC_Si_1150 {
    FAMILY: SiC_SiO2
    ORIENTATION: 4H_SiC_Si_face
    CLEAN: not_stated
    DOPING: n_type
}
CONTROL_TRAJECTORY History {
    EVENT Clean KIND clean TIMING stated                         # Degrease, RCA, piranha, HF dips
    EVENT Load KIND load TIMING assumed                          # Loaded at 800 °C in nitrogen
    RUN RampUp DURATION 4200 TEMP 800->1150 AMBIENT inert_N2 TIMING stated
    RUN BeforeClock DURATION 1 TEMP 1150->1150 AMBIENT dry_O2 TIMING assumed VARY duration 1..1800
    RUN Oxidation DURATION 21600 TEMP 1150->1150 AMBIENT dry_O2 TIMING bound
    RUN RampDown DURATION 4200 TEMP 1150->800 AMBIENT inert_N2 TIMING stated
    EVENT Unload KIND other TIMING assumed                       # Unloaded at 800 °C in nitrogen
    EVENT Measure KIND measurement TIMING stated                 # Thickness by ellipsometry, checked by stylus profiler
}

Si face (0001), 1110 °C

# Si face (0001), 1110 °C
SAMPLE SiC_Si_1110 {
    FAMILY: SiC_SiO2
    ORIENTATION: 4H_SiC_Si_face
    CLEAN: not_stated
    DOPING: n_type
}
CONTROL_TRAJECTORY History {
    EVENT Clean KIND clean TIMING stated                         # Degrease, RCA, piranha, HF dips
    EVENT Load KIND load TIMING assumed                          # Loaded at 800 °C in nitrogen
    RUN RampUp DURATION 3720 TEMP 800->1110 AMBIENT inert_N2 TIMING stated
    RUN BeforeClock DURATION 1 TEMP 1110->1110 AMBIENT dry_O2 TIMING assumed VARY duration 1..1800
    RUN Oxidation DURATION 21600 TEMP 1110->1110 AMBIENT dry_O2 TIMING bound
    RUN RampDown DURATION 3720 TEMP 1110->800 AMBIENT inert_N2 TIMING stated
    EVENT Unload KIND other TIMING assumed                       # Unloaded at 800 °C in nitrogen
    EVENT Measure KIND measurement TIMING stated                 # Thickness by ellipsometry, checked by stylus profiler
}

Si face (0001), 1050 °C

# Si face (0001), 1050 °C
SAMPLE SiC_Si_1050 {
    FAMILY: SiC_SiO2
    ORIENTATION: 4H_SiC_Si_face
    CLEAN: not_stated
    DOPING: n_type
}
CONTROL_TRAJECTORY History {
    EVENT Clean KIND clean TIMING stated                         # Degrease, RCA, piranha, HF dips
    EVENT Load KIND load TIMING assumed                          # Loaded at 800 °C in nitrogen
    RUN RampUp DURATION 3000 TEMP 800->1050 AMBIENT inert_N2 TIMING stated
    RUN BeforeClock DURATION 1 TEMP 1050->1050 AMBIENT dry_O2 TIMING assumed VARY duration 1..1800
    RUN Oxidation DURATION 21600 TEMP 1050->1050 AMBIENT dry_O2 TIMING bound
    RUN RampDown DURATION 3000 TEMP 1050->800 AMBIENT inert_N2 TIMING stated
    EVENT Unload KIND other TIMING assumed                       # Unloaded at 800 °C in nitrogen
    EVENT Measure KIND measurement TIMING stated                 # Thickness by ellipsometry, checked by stylus profiler
}

Si face (0001), 1000 °C

# Si face (0001), 1000 °C
SAMPLE SiC_Si_1000 {
    FAMILY: SiC_SiO2
    ORIENTATION: 4H_SiC_Si_face
    CLEAN: not_stated
    DOPING: n_type
}
CONTROL_TRAJECTORY History {
    EVENT Clean KIND clean TIMING stated                         # Degrease, RCA, piranha, HF dips
    EVENT Load KIND load TIMING assumed                          # Loaded at 800 °C in nitrogen
    RUN RampUp DURATION 2400 TEMP 800->1000 AMBIENT inert_N2 TIMING stated
    RUN BeforeClock DURATION 1 TEMP 1000->1000 AMBIENT dry_O2 TIMING assumed VARY duration 1..1800
    RUN Oxidation DURATION 21600 TEMP 1000->1000 AMBIENT dry_O2 TIMING bound
    RUN RampDown DURATION 2400 TEMP 1000->800 AMBIENT inert_N2 TIMING stated
    EVENT Unload KIND other TIMING assumed                       # Unloaded at 800 °C in nitrogen
    EVENT Measure KIND measurement TIMING stated                 # Thickness by ellipsometry, checked by stylus profiler
}

C face (000-1), 1150 °C

# C face (000-1), 1150 °C
SAMPLE SiC_C_1150 {
    FAMILY: SiC_SiO2
    ORIENTATION: 4H_SiC_C_face
    CLEAN: not_stated
    DOPING: n_type
}
CONTROL_TRAJECTORY History {
    EVENT Clean KIND clean TIMING stated                         # Degrease, RCA, piranha, HF dips
    EVENT Load KIND load TIMING assumed                          # Loaded at 800 °C in nitrogen
    RUN RampUp DURATION 4200 TEMP 800->1150 AMBIENT inert_N2 TIMING stated
    RUN BeforeClock DURATION 1 TEMP 1150->1150 AMBIENT dry_O2 TIMING assumed VARY duration 1..1800
    RUN Oxidation DURATION 21600 TEMP 1150->1150 AMBIENT dry_O2 TIMING bound
    RUN RampDown DURATION 4200 TEMP 1150->800 AMBIENT inert_N2 TIMING stated
    EVENT Unload KIND other TIMING assumed                       # Unloaded at 800 °C in nitrogen
    EVENT Measure KIND measurement TIMING stated                 # Thickness by ellipsometry, checked by stylus profiler
}

C face (000-1), 1110 °C

# C face (000-1), 1110 °C
SAMPLE SiC_C_1110 {
    FAMILY: SiC_SiO2
    ORIENTATION: 4H_SiC_C_face
    CLEAN: not_stated
    DOPING: n_type
}
CONTROL_TRAJECTORY History {
    EVENT Clean KIND clean TIMING stated                         # Degrease, RCA, piranha, HF dips
    EVENT Load KIND load TIMING assumed                          # Loaded at 800 °C in nitrogen
    RUN RampUp DURATION 3720 TEMP 800->1110 AMBIENT inert_N2 TIMING stated
    RUN BeforeClock DURATION 1 TEMP 1110->1110 AMBIENT dry_O2 TIMING assumed VARY duration 1..1800
    RUN Oxidation DURATION 21600 TEMP 1110->1110 AMBIENT dry_O2 TIMING bound
    RUN RampDown DURATION 3720 TEMP 1110->800 AMBIENT inert_N2 TIMING stated
    EVENT Unload KIND other TIMING assumed                       # Unloaded at 800 °C in nitrogen
    EVENT Measure KIND measurement TIMING stated                 # Thickness by ellipsometry, checked by stylus profiler
}

C face (000-1), 1050 °C

# C face (000-1), 1050 °C
SAMPLE SiC_C_1050 {
    FAMILY: SiC_SiO2
    ORIENTATION: 4H_SiC_C_face
    CLEAN: not_stated
    DOPING: n_type
}
CONTROL_TRAJECTORY History {
    EVENT Clean KIND clean TIMING stated                         # Degrease, RCA, piranha, HF dips
    EVENT Load KIND load TIMING assumed                          # Loaded at 800 °C in nitrogen
    RUN RampUp DURATION 3000 TEMP 800->1050 AMBIENT inert_N2 TIMING stated
    RUN BeforeClock DURATION 1 TEMP 1050->1050 AMBIENT dry_O2 TIMING assumed VARY duration 1..1800
    RUN Oxidation DURATION 21600 TEMP 1050->1050 AMBIENT dry_O2 TIMING bound
    RUN RampDown DURATION 3000 TEMP 1050->800 AMBIENT inert_N2 TIMING stated
    EVENT Unload KIND other TIMING assumed                       # Unloaded at 800 °C in nitrogen
    EVENT Measure KIND measurement TIMING stated                 # Thickness by ellipsometry, checked by stylus profiler
}

C face (000-1), 1000 °C

# C face (000-1), 1000 °C
SAMPLE SiC_C_1000 {
    FAMILY: SiC_SiO2
    ORIENTATION: 4H_SiC_C_face
    CLEAN: not_stated
    DOPING: n_type
}
CONTROL_TRAJECTORY History {
    EVENT Clean KIND clean TIMING stated                         # Degrease, RCA, piranha, HF dips
    EVENT Load KIND load TIMING assumed                          # Loaded at 800 °C in nitrogen
    RUN RampUp DURATION 2400 TEMP 800->1000 AMBIENT inert_N2 TIMING stated
    RUN BeforeClock DURATION 1 TEMP 1000->1000 AMBIENT dry_O2 TIMING assumed VARY duration 1..1800
    RUN Oxidation DURATION 21600 TEMP 1000->1000 AMBIENT dry_O2 TIMING bound
    RUN RampDown DURATION 2400 TEMP 1000->800 AMBIENT inert_N2 TIMING stated
    EVENT Unload KIND other TIMING assumed                       # Unloaded at 800 °C in nitrogen
    EVENT Measure KIND measurement TIMING stated                 # Thickness by ellipsometry, checked by stylus profiler
}

The programs the predictor ran on these histories: experiments/sic_interface_states/one_way_anneal.isl.template, experiments/song_sic/oxide_growth_sic.isl.template.

The model itself, experiments/song_sic/oxide_growth_sic.isl.template, as it is written. Every equation the simulation uses is in this text; the runtime holds no physics.

# ==============================================================================
# ISL MODEL: DRY THERMAL OXIDATION OF 4H-SiC (growth sector on a second material)
#
# The OPERATOR and OBSERVATION_MODEL blocks below are copied character for character
# from experiments/vitkavage_dit/oxide_growth.isl.template, the silicon program; a test
# checks that they are identical. Only the declared parameters differ.
#
# Song et al. (2004) fit their SiC data with the same linear-parabolic law, reading its
# two constants as including out-diffusion of the carbon product. The constants here are
# Arrhenius fits to that paper's Tables I and II, per crystal face
# (scripts/build_song_dataset.py). Nothing is fitted by us.
# Fields in {{braces}} are filled by scripts/run_song_sic.py.
# ==============================================================================
SAMPLE {sample_id} {{
    FAMILY: SiC_SiO2
    ORIENTATION: 4H_SiC_{face}_face
}}
STATE x_ox {{
    UNIT: cm
    INITIAL: x_i
    MIN: 0
    MAX: 1.0e-3
}}
CONTROL T {{ UNIT: K }}
CONTROL p_O2 {{ UNIT: atm }}
PARAMETER B0 {{ VALUE: {B0}; UNIT: cm^2 s^-1; STATUS: sourced; SOURCE: {source} }}
PARAMETER E_B {{ VALUE: {E_B}; UNIT: eV; STATUS: sourced; SOURCE: {source} }}
PARAMETER BA0 {{ VALUE: {BA0}; UNIT: cm s^-1; STATUS: sourced; SOURCE: {source} }}
PARAMETER E_BA {{ VALUE: {E_BA}; UNIT: eV; STATUS: sourced; SOURCE: {source} }}
# The constants above are already specific to the crystal face, so no further factor is applied.
PARAMETER r_or {{ VALUE: 1.0; UNIT: 1; STATUS: constant }}
# The paper sets the time offset to zero and reports a native oxide of about 2 angstrom.
PARAMETER x_i {{ VALUE: 2.0e-8; UNIT: cm; STATUS: sourced; SOURCE: Song et al., J. Appl. Phys. 95, 4953 (2004), native oxide about 2 angstrom, agent-read }}
PARAMETER p_ref {{ VALUE: 1.0; UNIT: atm; STATUS: constant }}
PARAMETER k_B {{ VALUE: 8.617333262e-5; UNIT: eV K^-1; STATUS: constant }}
CONTROL_TRAJECTORY {trajectory_id} {{
    RUN Oxidation DURATION {duration_s} TEMP {T_C}->{T_C} AMBIENT dry_O2
}}
# dx/dt = B / (2x + A), with A = B / (B/A).
OPERATOR F_LinearParabolicGrowth : OxideGrowth {{
    EQUATION: d(x_ox)/dt = (p_O2 / p_ref) * B0 * exp(-E_B / (k_B * T)) / (2 * x_ox + B0 * exp(-E_B / (k_B * T)) / (r_or * BA0 * exp(-E_BA / (k_B * T))))
}}
OBSERVATION_MODEL Obs_Oxide_Thickness {{
    TARGET: Thickness
    UNIT: cm
    EQUATION: Thickness = x_ox
}}
EVALUATION_CONTRACT {contract_id} {{
    FROZEN: true
    DATASET: data/derived/song_2004_sic_thickness.csv
    DATASET_DIGEST: sha256:{dataset_sha256}
    SPLIT: {split}
{targets}
}}

Our simulation against the paper

17 within, 4 near, 27 off of 48 numbers. Tolerance is stated per row; nothing was fitted for this page.

✓17 within tolerance≈4 within twice the tolerance✕27 outside
simulation below the paper ← 0 → simulation above the paper-100%-50%0%+50%+100%Si face (0001), 1150 °C, 0.5 hoxide thicknessours 10.4 · paper 21.2 nm✕ outside (-51%)Si face (0001), 1150 °C, 2 hoxide thicknessours 24.3 · paper 33.6 nm✕ outside (-28%)Si face (0001), 1150 °C, 3 hoxide thicknessours 30.6 · paper 43.8 nm✕ outside (-30%)Si face (0001), 1150 °C, 4 hoxide thicknessours 36 · paper 50.1 nm✕ outside (-28%)Si face (0001), 1150 °C, 5 hoxide thicknessours 40.8 · paper 58.2 nm✕ outside (-30%)Si face (0001), 1150 °C, 6 hoxide thicknessours 45.1 · paper 62.7 nm✕ outside (-28%)Si face (0001), 1110 °C, 0.5 hoxide thicknessours 7.29 · paper 12.6 nm✕ outside (-42%)Si face (0001), 1110 °C, 2 hoxide thicknessours 16.9 · paper 24.2 nm✕ outside (-30%)Si face (0001), 1110 °C, 3 hoxide thicknessours 21.4 · paper 27.1 nm✕ outside (-21%)Si face (0001), 1110 °C, 4 hoxide thicknessours 25.1 · paper 33.8 nm✕ outside (-26%)Si face (0001), 1110 °C, 5 hoxide thicknessours 28.4 · paper 37.2 nm✕ outside (-24%)Si face (0001), 1110 °C, 6 hoxide thicknessours 31.4 · paper 42.6 nm✕ outside (-26%)Si face (0001), 1050 °C, 0.5 hoxide thicknessours 4.14 · paper 8 nm✕ outside (-48%)Si face (0001), 1050 °C, 2 hoxide thicknessours 9.48 · paper 13.2 nm✕ outside (-28%)Si face (0001), 1050 °C, 3 hoxide thicknessours 11.9 · paper 15.6 nm✕ outside (-24%)Si face (0001), 1050 °C, 4 hoxide thicknessours 14 · paper 19.6 nm✕ outside (-29%)Si face (0001), 1050 °C, 5 hoxide thicknessours 15.8 · paper 20.4 nm✕ outside (-23%)Si face (0001), 1050 °C, 6 hoxide thicknessours 17.4 · paper 21.2 nm≈ within twice the tolerance (-18%)Si face (0001), 1000 °C, 0.5 hoxide thicknessours 2.49 · paper 7 nm✕ outside (-64%)Si face (0001), 1000 °C, 2 hoxide thicknessours 5.61 · paper 12.3 nm✕ outside (-54%)Si face (0001), 1000 °C, 3 hoxide thicknessours 7.03 · paper 14.1 nm✕ outside (-50%)Si face (0001), 1000 °C, 4 hoxide thicknessours 8.24 · paper 17.1 nm✕ outside (-52%)Si face (0001), 1000 °C, 5 hoxide thicknessours 9.3 · paper 18 nm✕ outside (-48%)Si face (0001), 1000 °C, 6 hoxide thicknessours 10.3 · paper 18.4 nm✕ outside (-44%)C face (000-1), 1150 °C, 0.5 hoxide thicknessours 54.5 · paper 77.9 nm✕ outside (-30%)C face (000-1), 1150 °C, 2 hoxide thicknessours 142 · paper 141 nm✓ within tolerance (+0.6%)C face (000-1), 1150 °C, 3 hoxide thicknessours 182 · paper 176 nm✓ within tolerance (+3.5%)C face (000-1), 1150 °C, 4 hoxide thicknessours 217 · paper 228 nm✓ within tolerance (-4.9%)C face (000-1), 1150 °C, 5 hoxide thicknessours 248 · paper 249 nm✓ within tolerance (-0.5%)C face (000-1), 1150 °C, 6 hoxide thicknessours 275 · paper 262 nm✓ within tolerance (+5.1%)C face (000-1), 1110 °C, 0.5 hoxide thicknessours 42.2 · paper 53 nm✕ outside (-20%)C face (000-1), 1110 °C, 2 hoxide thicknessours 111 · paper 112 nm✓ within tolerance (-1.3%)C face (000-1), 1110 °C, 3 hoxide thicknessours 143 · paper 150 nm✓ within tolerance (-4.9%)C face (000-1), 1110 °C, 4 hoxide thicknessours 170 · paper 183 nm✓ within tolerance (-7.0%)C face (000-1), 1110 °C, 5 hoxide thicknessours 194 · paper 205 nm✓ within tolerance (-5.2%)C face (000-1), 1110 °C, 6 hoxide thicknessours 216 · paper 231 nm✓ within tolerance (-6.2%)C face (000-1), 1050 °C, 0.5 hoxide thicknessours 27.9 · paper 40 nm✕ outside (-30%)C face (000-1), 1050 °C, 2 hoxide thicknessours 74.3 · paper 66.8 nm≈ within twice the tolerance (+11%)C face (000-1), 1050 °C, 3 hoxide thicknessours 96.2 · paper 99.7 nm✓ within tolerance (-3.5%)C face (000-1), 1050 °C, 4 hoxide thicknessours 115 · paper 113 nm✓ within tolerance (+2.0%)C face (000-1), 1050 °C, 5 hoxide thicknessours 132 · paper 133 nm✓ within tolerance (-0.8%)C face (000-1), 1050 °C, 6 hoxide thicknessours 147 · paper 156 nm✓ within tolerance (-6.0%)C face (000-1), 1000 °C, 0.5 hoxide thicknessours 19.2 · paper 21.4 nm≈ within twice the tolerance (-10%)C face (000-1), 1000 °C, 2 hoxide thicknessours 51.7 · paper 47.6 nm✓ within tolerance (+8.7%)C face (000-1), 1000 °C, 3 hoxide thicknessours 67.2 · paper 51.2 nm✕ outside (+31%)C face (000-1), 1000 °C, 4 hoxide thicknessours 80.5 · paper 75.7 nm✓ within tolerance (+6.3%)C face (000-1), 1000 °C, 5 hoxide thicknessours 92.2 · paper 89.5 nm✓ within tolerance (+3.0%)C face (000-1), 1000 °C, 6 hoxide thicknessours 103 · paper 122 nm≈ within twice the tolerance (-16%)
The pale green band is the tolerance. Bars past ±100% are cut and carry their value.
Oxide thickness against time, dry oxygen, Si face (0001)
016.933.950.867.701.534.56time in Oxidation (h)oxide thickness (nm)1150 °C1110 °C1050 °C1000 °Cour simulationthe paper
Oxide thickness against time, dry oxygen, C face (000-1)
074.414922329701.534.56time in Oxidation (h)oxide thickness (nm)1150 °C1110 °C1050 °C1000 °Cour simulationthe paper
Sample and historyQuantityThe paperOur simulationDifferenceVerdictWhat the program's own evaluation saysWhere in the paper
Si face (0001), 1150 °C, 0.5 hoxide thickness21.2 nm10.4 nm-51%off (±10%)outside the tested scopeFigure 10(b) (Si face) or 10(d) (C face), PDF p. 11, read from the page by the second reader (about ±1 nm Si face, ±3 nm C face)
Si face (0001), 1150 °C, 2 hoxide thickness33.6 nm24.3 nm-28%off (±10%)outside the tested scopeFigure 10(b) (Si face) or 10(d) (C face), PDF p. 11, read from the page by the second reader (about ±1 nm Si face, ±3 nm C face)
Si face (0001), 1150 °C, 3 hoxide thickness43.8 nm30.6 nm-30%off (±10%)outside the tested scopeFigure 10(b) (Si face) or 10(d) (C face), PDF p. 11, read from the page by the second reader (about ±1 nm Si face, ±3 nm C face)
Si face (0001), 1150 °C, 4 hoxide thickness50.1 nm36 nm-28%off (±10%)outside the tested scopeFigure 10(b) (Si face) or 10(d) (C face), PDF p. 11, read from the page by the second reader (about ±1 nm Si face, ±3 nm C face)
Si face (0001), 1150 °C, 5 hoxide thickness58.2 nm40.8 nm-30%off (±10%)outside the tested scopeFigure 10(b) (Si face) or 10(d) (C face), PDF p. 11, read from the page by the second reader (about ±1 nm Si face, ±3 nm C face)
Si face (0001), 1150 °C, 6 hoxide thickness62.7 nm45.1 nm-28%off (±10%)outside the tested scopeFigure 10(b) (Si face) or 10(d) (C face), PDF p. 11, read from the page by the second reader (about ±1 nm Si face, ±3 nm C face)
Si face (0001), 1110 °C, 0.5 hoxide thickness12.6 nm7.29 nm-42%off (±10%)outside the tested scopeFigure 10(b) (Si face) or 10(d) (C face), PDF p. 11, read from the page by the second reader (about ±1 nm Si face, ±3 nm C face)
Si face (0001), 1110 °C, 2 hoxide thickness24.2 nm16.9 nm-30%off (±10%)outside the tested scopeFigure 10(b) (Si face) or 10(d) (C face), PDF p. 11, read from the page by the second reader (about ±1 nm Si face, ±3 nm C face)
Si face (0001), 1110 °C, 3 hoxide thickness27.1 nm21.4 nm-21%off (±10%)outside the tested scopeFigure 10(b) (Si face) or 10(d) (C face), PDF p. 11, read from the page by the second reader (about ±1 nm Si face, ±3 nm C face)
Si face (0001), 1110 °C, 4 hoxide thickness33.8 nm25.1 nm-26%off (±10%)outside the tested scopeFigure 10(b) (Si face) or 10(d) (C face), PDF p. 11, read from the page by the second reader (about ±1 nm Si face, ±3 nm C face)
Si face (0001), 1110 °C, 5 hoxide thickness37.2 nm28.4 nm-24%off (±10%)outside the tested scopeFigure 10(b) (Si face) or 10(d) (C face), PDF p. 11, read from the page by the second reader (about ±1 nm Si face, ±3 nm C face)
Si face (0001), 1110 °C, 6 hoxide thickness42.6 nm31.4 nm-26%off (±10%)outside the tested scopeFigure 10(b) (Si face) or 10(d) (C face), PDF p. 11, read from the page by the second reader (about ±1 nm Si face, ±3 nm C face)
Si face (0001), 1050 °C, 0.5 hoxide thickness8 nm4.14 nm-48%off (±10%)outside the tested scopeFigure 10(b) (Si face) or 10(d) (C face), PDF p. 11, read from the page by the second reader (about ±1 nm Si face, ±3 nm C face)
Si face (0001), 1050 °C, 2 hoxide thickness13.2 nm9.48 nm-28%off (±10%)outside the tested scopeFigure 10(b) (Si face) or 10(d) (C face), PDF p. 11, read from the page by the second reader (about ±1 nm Si face, ±3 nm C face)
Si face (0001), 1050 °C, 3 hoxide thickness15.6 nm11.9 nm-24%off (±10%)outside the tested scopeFigure 10(b) (Si face) or 10(d) (C face), PDF p. 11, read from the page by the second reader (about ±1 nm Si face, ±3 nm C face)
Si face (0001), 1050 °C, 4 hoxide thickness19.6 nm14 nm-29%off (±10%)outside the tested scopeFigure 10(b) (Si face) or 10(d) (C face), PDF p. 11, read from the page by the second reader (about ±1 nm Si face, ±3 nm C face)
Si face (0001), 1050 °C, 5 hoxide thickness20.4 nm15.8 nm-23%off (±10%)outside the tested scopeFigure 10(b) (Si face) or 10(d) (C face), PDF p. 11, read from the page by the second reader (about ±1 nm Si face, ±3 nm C face)
Si face (0001), 1050 °C, 6 hoxide thickness21.2 nm17.4 nm-18%near (±10%)outside the tested scopeFigure 10(b) (Si face) or 10(d) (C face), PDF p. 11, read from the page by the second reader (about ±1 nm Si face, ±3 nm C face)
Si face (0001), 1000 °C, 0.5 hoxide thickness7 nm2.49 nm-64%off (±10%)outside the tested scopeFigure 10(b) (Si face) or 10(d) (C face), PDF p. 11, read from the page by the second reader (about ±1 nm Si face, ±3 nm C face)
Si face (0001), 1000 °C, 2 hoxide thickness12.3 nm5.61 nm-54%off (±10%)outside the tested scopeFigure 10(b) (Si face) or 10(d) (C face), PDF p. 11, read from the page by the second reader (about ±1 nm Si face, ±3 nm C face)
Si face (0001), 1000 °C, 3 hoxide thickness14.1 nm7.03 nm-50%off (±10%)outside the tested scopeFigure 10(b) (Si face) or 10(d) (C face), PDF p. 11, read from the page by the second reader (about ±1 nm Si face, ±3 nm C face)
Si face (0001), 1000 °C, 4 hoxide thickness17.1 nm8.24 nm-52%off (±10%)outside the tested scopeFigure 10(b) (Si face) or 10(d) (C face), PDF p. 11, read from the page by the second reader (about ±1 nm Si face, ±3 nm C face)
Si face (0001), 1000 °C, 5 hoxide thickness18 nm9.3 nm-48%off (±10%)outside the tested scopeFigure 10(b) (Si face) or 10(d) (C face), PDF p. 11, read from the page by the second reader (about ±1 nm Si face, ±3 nm C face)
Si face (0001), 1000 °C, 6 hoxide thickness18.4 nm10.3 nm-44%off (±10%)outside the tested scopeFigure 10(b) (Si face) or 10(d) (C face), PDF p. 11, read from the page by the second reader (about ±1 nm Si face, ±3 nm C face)
C face (000-1), 1150 °C, 0.5 hoxide thickness77.9 nm54.5 nm-30%off (±10%)outside the tested scopeFigure 10(b) (Si face) or 10(d) (C face), PDF p. 11, read from the page by the second reader (about ±1 nm Si face, ±3 nm C face)
C face (000-1), 1150 °C, 2 hoxide thickness141 nm142 nm+1%within (±10%)outside the tested scopeFigure 10(b) (Si face) or 10(d) (C face), PDF p. 11, read from the page by the second reader (about ±1 nm Si face, ±3 nm C face)
C face (000-1), 1150 °C, 3 hoxide thickness176 nm182 nm+4%within (±10%)outside the tested scopeFigure 10(b) (Si face) or 10(d) (C face), PDF p. 11, read from the page by the second reader (about ±1 nm Si face, ±3 nm C face)
C face (000-1), 1150 °C, 4 hoxide thickness228 nm217 nm-5%within (±10%)outside the tested scopeFigure 10(b) (Si face) or 10(d) (C face), PDF p. 11, read from the page by the second reader (about ±1 nm Si face, ±3 nm C face)
C face (000-1), 1150 °C, 5 hoxide thickness249 nm248 nm-0%within (±10%)outside the tested scopeFigure 10(b) (Si face) or 10(d) (C face), PDF p. 11, read from the page by the second reader (about ±1 nm Si face, ±3 nm C face)
C face (000-1), 1150 °C, 6 hoxide thickness262 nm275 nm+5%within (±10%)outside the tested scopeFigure 10(b) (Si face) or 10(d) (C face), PDF p. 11, read from the page by the second reader (about ±1 nm Si face, ±3 nm C face)
C face (000-1), 1110 °C, 0.5 hoxide thickness53 nm42.2 nm-20%off (±10%)outside the tested scopeFigure 10(b) (Si face) or 10(d) (C face), PDF p. 11, read from the page by the second reader (about ±1 nm Si face, ±3 nm C face)
C face (000-1), 1110 °C, 2 hoxide thickness112 nm111 nm-1%within (±10%)outside the tested scopeFigure 10(b) (Si face) or 10(d) (C face), PDF p. 11, read from the page by the second reader (about ±1 nm Si face, ±3 nm C face)
C face (000-1), 1110 °C, 3 hoxide thickness150 nm143 nm-5%within (±10%)outside the tested scopeFigure 10(b) (Si face) or 10(d) (C face), PDF p. 11, read from the page by the second reader (about ±1 nm Si face, ±3 nm C face)
C face (000-1), 1110 °C, 4 hoxide thickness183 nm170 nm-7%within (±10%)outside the tested scopeFigure 10(b) (Si face) or 10(d) (C face), PDF p. 11, read from the page by the second reader (about ±1 nm Si face, ±3 nm C face)
C face (000-1), 1110 °C, 5 hoxide thickness205 nm194 nm-5%within (±10%)outside the tested scopeFigure 10(b) (Si face) or 10(d) (C face), PDF p. 11, read from the page by the second reader (about ±1 nm Si face, ±3 nm C face)
C face (000-1), 1110 °C, 6 hoxide thickness231 nm216 nm-6%within (±10%)outside the tested scopeFigure 10(b) (Si face) or 10(d) (C face), PDF p. 11, read from the page by the second reader (about ±1 nm Si face, ±3 nm C face)
C face (000-1), 1050 °C, 0.5 hoxide thickness40 nm27.9 nm-30%off (±10%)outside the tested scopeFigure 10(b) (Si face) or 10(d) (C face), PDF p. 11, read from the page by the second reader (about ±1 nm Si face, ±3 nm C face)
C face (000-1), 1050 °C, 2 hoxide thickness66.8 nm74.3 nm+11%near (±10%)outside the tested scopeFigure 10(b) (Si face) or 10(d) (C face), PDF p. 11, read from the page by the second reader (about ±1 nm Si face, ±3 nm C face)
C face (000-1), 1050 °C, 3 hoxide thickness99.7 nm96.2 nm-4%within (±10%)outside the tested scopeFigure 10(b) (Si face) or 10(d) (C face), PDF p. 11, read from the page by the second reader (about ±1 nm Si face, ±3 nm C face)
C face (000-1), 1050 °C, 4 hoxide thickness113 nm115 nm+2%within (±10%)outside the tested scopeFigure 10(b) (Si face) or 10(d) (C face), PDF p. 11, read from the page by the second reader (about ±1 nm Si face, ±3 nm C face)
C face (000-1), 1050 °C, 5 hoxide thickness133 nm132 nm-1%within (±10%)outside the tested scopeFigure 10(b) (Si face) or 10(d) (C face), PDF p. 11, read from the page by the second reader (about ±1 nm Si face, ±3 nm C face)
C face (000-1), 1050 °C, 6 hoxide thickness156 nm146 nm-6%within (±10%)outside the tested scopeFigure 10(b) (Si face) or 10(d) (C face), PDF p. 11, read from the page by the second reader (about ±1 nm Si face, ±3 nm C face)
C face (000-1), 1000 °C, 0.5 hoxide thickness21.4 nm19.2 nm-10%near (±10%)outside the tested scopeFigure 10(b) (Si face) or 10(d) (C face), PDF p. 11, read from the page by the second reader (about ±1 nm Si face, ±3 nm C face)
C face (000-1), 1000 °C, 2 hoxide thickness47.6 nm51.7 nm+9%within (±10%)outside the tested scopeFigure 10(b) (Si face) or 10(d) (C face), PDF p. 11, read from the page by the second reader (about ±1 nm Si face, ±3 nm C face)
C face (000-1), 1000 °C, 3 hoxide thickness51.2 nm67.2 nm+31%off (±10%)outside the tested scopeFigure 10(b) (Si face) or 10(d) (C face), PDF p. 11, read from the page by the second reader (about ±1 nm Si face, ±3 nm C face)
C face (000-1), 1000 °C, 4 hoxide thickness75.7 nm80.5 nm+6%within (±10%)outside the tested scopeFigure 10(b) (Si face) or 10(d) (C face), PDF p. 11, read from the page by the second reader (about ±1 nm Si face, ±3 nm C face)
C face (000-1), 1000 °C, 5 hoxide thickness89.5 nm92.2 nm+3%within (±10%)outside the tested scopeFigure 10(b) (Si face) or 10(d) (C face), PDF p. 11, read from the page by the second reader (about ±1 nm Si face, ±3 nm C face)
C face (000-1), 1000 °C, 6 hoxide thickness122 nm103 nm-16%near (±10%)outside the tested scopeFigure 10(b) (Si face) or 10(d) (C face), PDF p. 11, read from the page by the second reader (about ±1 nm Si face, ±3 nm C face)

Aligning the simulation: what the unstated things would have to be

Every step whose timing or temperature the paper leaves open carries a range in the history above (VARY). scripts/align_study.py searched those ranges against the paper's numbers through the same predictor, first one unknown at a time, then all together. No parameter a program declares fitted was touched. The unknowns were chosen on C_1000, C_1150, Si_1000, Si_1150 only; every other number is a test they played no part in.

UnknownWhat the paper saysRange searchedThe reproduction usedBest aloneScore at the reproduction's valueBest score alone
Oxygen at 1150 °C before the clock starts: durationNot stated; searched from 0 to 30 min1 to 1800 s1 s12.16 s8 of 24 within tolerance, median error 28.1%9 of 24 within tolerance, median error 28.0%

Together: BeforeClock duration 12.16 s (was 1).

As reproduced: 17 of 48 within tolerance, median error 23.1%. Aligned: 18 of 48 within tolerance, median error 23.0%. On the held-out samples only: 9 of 24 within tolerance, median error 20.7% as reproduced, 9 of 24 within tolerance, median error 20.5% aligned.

Choices of program or material property, each scored on its own and on top of the aligned history:

VariantAloneWith the aligned history
ramps in dry oxygen instead of nitrogen15 of 48 within tolerance, median error 20.7%15 of 48 within tolerance, median error 20.7%
the text's times (30 to 180 min) instead of Figure 10's (0.5 to 6 h)0 of 48 within tolerance, median error 42.9%1 of 48 within tolerance, median error 42.8%

What was run. The SiC growth program (Song 2004's tabulated constants, Arrhenius-interpolated to 1110 °C and, on the Si face, extrapolated to 1000 °C) on the chapter's dry-oxygen curves: load at 800 °C, a 5 °C/min ramp in nitrogen, the oxidation, a ramp down. As reproduced: 17 of 48 within 10%, median error 23.6%. The two faces part completely. C face: 17 of 24, median signed error −2.4%, and −0.7% from 2 h on; the misses are the 0.5 h points (−10 to −30%, the program grows too little at first) and three single points at 1000 and 1050 °C. Si face: 0 of 24, every point low, median signed −29%: about −28% at 1050 to 1150 °C and −44 to −64% at 1000 °C, where Song has no Si-face constants and the program extrapolates.

What was searched. One unknown, oxygen at temperature before the clock starts (1 s to 30 min), chosen on the 1000 and 1150 °C curves (24 points); the 1050 and 1110 °C curves (24 points) are the test. Two variants: both ramps in dry oxygen, and the text's times (30 to 180 min) in place of Figure 10's (0.5 to 6 h).

The offset cannot fix it. On the chosen points the count stays at 8 or 9 of 24 from 1 s to 8.6 min and falls to 3 of 24 at 30 min, where the C face overshoots while the Si face is still 15 to 20% low. The search kept 12 s (9 of 24, a tie broken on median error). On the held-out 1050 and 1110 °C curves: 9 of 24 before and after, median error 20.7% and 20.5%. Ramps in oxygen add 40 to 70 min of oxide before the clock: 15 of 48 (median 20.7%); the Si face stays low (median signed −26%) and the C face goes high (+5%). The text's times are ruled out: 0 of 48 (median 42.9%). Figure 10's times are the ones that agree with the program on the C face, as they agree with the chapter's own Figure 16.

Song's constants against Gupta and Akhtar's, same faces and temperatures (a test of transfer between laboratories). Parabolic B, C face: 1.40, 0.96 and 0.95 times Song's printed value at 1000, 1050 and 1150 °C (1.14 times the Arrhenius value at 1110 °C). Si face: 1.85 and 1.61 times Song's printed value at 1050 and 1150 °C (1.53 times at 1110 °C; 3.6 times the extrapolation at 1000 °C). The activation energies of B agree: 2.03 eV against Song's 1.98 eV (C face), 2.86 against 3.12 eV (Si face). The linear constants B/A do not transfer: 0.76 and 1.31 times Song's at 1000 and 1050 °C on the C face but 5.8 times at 1150 °C, and 1.5 times (1050 °C) rising to 13.8 times (1150 °C) on the Si face; activation energies 2.27 and 2.81 eV against Song's 1.29 and 1.34 eV. The chapter fits with τ = 0 and no point below 7 nm, so B/A, which is set by the thin end, is poorly determined in both papers. The thickness curves say the same thing as the B comparison: Song's C face transfers to this laboratory within 10% after 2 h, Song's Si face is 1.5 to 1.9 times too slow in B.

Heating and cooling transitions (the section above): none of the four scenarios moves any number by more than 2%, because every assumed heat-up and cool-down is in nitrogen, which grows nothing in this program. The chapter's own ramps are also in nitrogen in our history, so the same holds for them.

✓9 within tolerance≈3 within twice the tolerance✕12 outside
simulation below the paper ← 0 → simulation above the paper-100%-50%0%+50%+100%Si face (0001), 1110 °C, 0.5 hoxide thicknessours 7.32 · paper 12.6 nm✕ outside (-42%)Si face (0001), 1110 °C, 2 hoxide thicknessours 17 · paper 24.2 nm✕ outside (-30%)Si face (0001), 1110 °C, 3 hoxide thicknessours 21.4 · paper 27.1 nm✕ outside (-21%)Si face (0001), 1110 °C, 4 hoxide thicknessours 25.1 · paper 33.8 nm✕ outside (-26%)Si face (0001), 1110 °C, 5 hoxide thicknessours 28.4 · paper 37.2 nm✕ outside (-24%)Si face (0001), 1110 °C, 6 hoxide thicknessours 31.4 · paper 42.6 nm✕ outside (-26%)Si face (0001), 1050 °C, 0.5 hoxide thicknessours 4.16 · paper 8 nm✕ outside (-48%)Si face (0001), 1050 °C, 2 hoxide thicknessours 9.49 · paper 13.2 nm✕ outside (-28%)Si face (0001), 1050 °C, 3 hoxide thicknessours 11.9 · paper 15.6 nm✕ outside (-24%)Si face (0001), 1050 °C, 4 hoxide thicknessours 14 · paper 19.6 nm✕ outside (-29%)Si face (0001), 1050 °C, 5 hoxide thicknessours 15.8 · paper 20.4 nm✕ outside (-22%)Si face (0001), 1050 °C, 6 hoxide thicknessours 17.5 · paper 21.2 nm≈ within twice the tolerance (-18%)C face (000-1), 1110 °C, 0.5 hoxide thicknessours 42.4 · paper 53 nm≈ within twice the tolerance (-20%)C face (000-1), 1110 °C, 2 hoxide thicknessours 111 · paper 112 nm✓ within tolerance (-1.2%)C face (000-1), 1110 °C, 3 hoxide thicknessours 143 · paper 150 nm✓ within tolerance (-4.8%)C face (000-1), 1110 °C, 4 hoxide thicknessours 170 · paper 183 nm✓ within tolerance (-7.0%)C face (000-1), 1110 °C, 5 hoxide thicknessours 195 · paper 205 nm✓ within tolerance (-5.1%)C face (000-1), 1110 °C, 6 hoxide thicknessours 217 · paper 231 nm✓ within tolerance (-6.1%)C face (000-1), 1050 °C, 0.5 hoxide thicknessours 28.1 · paper 40 nm✕ outside (-30%)C face (000-1), 1050 °C, 2 hoxide thicknessours 74.3 · paper 66.8 nm≈ within twice the tolerance (+11%)C face (000-1), 1050 °C, 3 hoxide thicknessours 96.3 · paper 99.7 nm✓ within tolerance (-3.5%)C face (000-1), 1050 °C, 4 hoxide thicknessours 115 · paper 113 nm✓ within tolerance (+2.0%)C face (000-1), 1050 °C, 5 hoxide thicknessours 132 · paper 133 nm✓ within tolerance (-0.8%)C face (000-1), 1050 °C, 6 hoxide thicknessours 147 · paper 156 nm✓ within tolerance (-5.9%)
The pale green band is the tolerance. Bars past ±100% are cut and carry their value.

9 within, 3 near, 12 off of 24 numbers with the aligned settings (the samples used to choose the unknowns are left out).

SampleQuantityThe paperAs reproduced aboveAlignedDifferenceVerdictHow
Si face (0001), 1110 °C, 0.5 hoxide thickness12.6 nm7.297.32-42%off (±10%)test
Si face (0001), 1110 °C, 2 hoxide thickness24.2 nm16.917-30%off (±10%)test
Si face (0001), 1110 °C, 3 hoxide thickness27.1 nm21.421.4-21%off (±10%)test
Si face (0001), 1110 °C, 4 hoxide thickness33.8 nm25.125.1-26%off (±10%)test
Si face (0001), 1110 °C, 5 hoxide thickness37.2 nm28.428.4-24%off (±10%)test
Si face (0001), 1110 °C, 6 hoxide thickness42.6 nm31.431.4-26%off (±10%)test
Si face (0001), 1050 °C, 0.5 hoxide thickness8 nm4.144.16-48%off (±10%)test
Si face (0001), 1050 °C, 2 hoxide thickness13.2 nm9.489.49-28%off (±10%)test
Si face (0001), 1050 °C, 3 hoxide thickness15.6 nm11.911.9-24%off (±10%)test
Si face (0001), 1050 °C, 4 hoxide thickness19.6 nm1414-29%off (±10%)test
Si face (0001), 1050 °C, 5 hoxide thickness20.4 nm15.815.8-22%off (±10%)test
Si face (0001), 1050 °C, 6 hoxide thickness21.2 nm17.417.5-18%near (±10%)test
C face (000-1), 1110 °C, 0.5 hoxide thickness53 nm42.242.4-20%near (±10%)test
C face (000-1), 1110 °C, 2 hoxide thickness112 nm111111-1%within (±10%)test
C face (000-1), 1110 °C, 3 hoxide thickness150 nm143143-5%within (±10%)test
C face (000-1), 1110 °C, 4 hoxide thickness183 nm170170-7%within (±10%)test
C face (000-1), 1110 °C, 5 hoxide thickness205 nm194194-5%within (±10%)test
C face (000-1), 1110 °C, 6 hoxide thickness231 nm216216-6%within (±10%)test
C face (000-1), 1050 °C, 0.5 hoxide thickness40 nm27.928.1-30%off (±10%)test
C face (000-1), 1050 °C, 2 hoxide thickness66.8 nm74.374.3+11%near (±10%)test
C face (000-1), 1050 °C, 3 hoxide thickness99.7 nm96.296.2-3%within (±10%)test
C face (000-1), 1050 °C, 4 hoxide thickness113 nm115115+2%within (±10%)test
C face (000-1), 1050 °C, 5 hoxide thickness133 nm132132-1%within (±10%)test
C face (000-1), 1050 °C, 6 hoxide thickness156 nm146147-6%within (±10%)test

The Si-face deficit is in the constants, not the history: no offset or ramp gas reaches 10% on the Si face without putting the C face 10% high. The program has one set of Si-face constants, from Song's three temperatures on on-axis wafers. This chapter does not state its off-cut (Figure 1(a) has no text layer); Goto and Hijikata's 8° off-axis Si face is also faster than Song's (see their page). OFFCUT read by the program, with constants per off-cut, is what this would need.

The 0.5 h points are 10 to 30% low on the C face and 42 to 64% low on the Si face: the linear-parabolic law with Song's B/A has no fast initial regime. A thin-oxide term (Massoud's, or Goto and Hijikata's R_S exp(−X/L_S)) is the structural change this asks for; no history change reaches it.

Wet oxidation has no SiC program. The chapter gives what one needs: B and B/A for both faces at four temperatures in 85 °C-bubbler wet oxygen (Tables 1 and 2). Its Si-face wet constants at 1150 °C (B = 1.2×10⁻³ µm²/h, B/A = 0.885 µm/h) give 48.3 nm after 2 h; Yano et al. 2002 measured 45 nm after 120 min of wet oxidation at 1150 °C on (0001), another laboratory. A wet SiC program would be the growth operator with these constants, scaled by water pressure the way the silicon wet operator is (WET_GROWTH in isl_harness/predict.py), with the bubbler temperature written as the water partial pressure. The (03-38) and a faces would still have none.

What our language and ontology cannot yet say

  • OFFCUT read by the SiC growth program (constants per face and off-cut). Song's Si face is on axis, Goto and Hijikata's is 8° off, this chapter's is unrecorded, and the Si-face constants do not transfer between them (28 to 64% low here). The field exists on samples and no program reads it.
  • A ramp rate as a statement (RAMP RATE 5 C/min FROM 800 TO 1150), so the chapter's stated rate is written as the paper gives it, not as a duration we derive.
  • The sic_growth program's scope check labels a history outside its tested scope whenever any step is not dry oxygen, so a load and ramp in nitrogen, which grows nothing, marks every number here “outside the tested scope”. The check should look only at the steps that grow oxide.
  • Bubbler temperature as an ambient statement (H2O FROM bubbler AT 85 C) that the runtime turns into a water partial pressure, so a wet recipe is written as the paper states it rather than as our computed mixture.
  • A cumulative or replicate series: REPLICATES 4 on a measurement, so the four samples per point are part of the record (and their scatter, if a paper gives it, becomes the tolerance).

With heating and cooling transitions

No paper we hold states how its wafers heated up or cooled down. The project owner specified scenarios for one Vitkavage wafer (isl_harness/vitkavage_transitions.py); isl_harness/thermal_transitions.py applies the same numbers to every sample here: a heat-up in nitrogen before the first furnace step (a hot push of 1 to 5 min, or a cold-furnace ramp of 60 to 120 min), the owner's radiative cooling knots after the last furnace step or after the paper's own pull (fast, or every time multiplied by 5), and ramps around an anneal at 300 to 500 °C. The paper's own steps are kept as written. All transitions are assumptions, written in the history with TIMING assumed.

HistoryWithin toleranceMedian errorChanged numbers
as the paper states it (above)17 of 4823.6%
heat-up A (hot push), fast cooling17 of 4823.6%0 of 48 moved by more than 2%
heat-up A (hot push), slow cooling17 of 4823.6%0 of 48 moved by more than 2%
heat-up B (cold-furnace ramp), fast cooling17 of 4823.6%0 of 48 moved by more than 2%
heat-up B (cold-furnace ramp), slow cooling17 of 4823.6%0 of 48 moved by more than 2%

The paper's own conclusions

The paper statesWhat we find
Dry oxidation: the C face oxidizes 4 to 6 times faster than the Si face (GRMF)Program at 6 h: 6.1 times at 1150 °C, 10 times at 1000 °C; read from Figure 10: 4.2 and 6.6 times. The ratio is too large because the Si face is too slowdirection right, size too large
Dry B (Table 1), C face: 3.09×10⁻³ to 1.71×10⁻² µm²/h at 1000 to 1150 °CSong's: 0.95 to 1.40 times thesetransfers
Dry B, Si face: 7.48×10⁻⁵ to 6.13×10⁻⁴ µm²/hSong's printed values are 1.6 to 1.9 times smaller (1050, 1150 °C)does not transfer
Dry B/A (Table 2): 0.015 to 0.58 µm/h (Si face), 0.051 to 0.93 µm/h (C face)Song's: 0.018 to 0.042 and 0.067 to 0.16 µm/h; ratio up to 14 at 1150 °Cdoes not transfer
Activation energy of B, dry: 2.86 eV (Si face), 2.03 eV (C face)Song's: 3.12 and 1.98 eVagrees
Wet oxidation: faster than dry; GRMF 8 to 12; wet B and B/A for both faces (Tables 1, 2)No SiC program for wet oxidationnot modelled
Growth rate rises as the oxide thins (“oxide growth rate enhancement occur at any temperature”)The program has no thin-oxide regime: 0.5 h points 10 to 64% lowmissed

What we would like Emily to check

  1. In a furnace that loads at 800 °C in nitrogen and ramps at 5 °C/min, would the oxygen normally be switched on at the start of the ramp or at the plateau?
  2. Figure 10 and the text disagree on the times (6 h against 3 h for the longest). Which would you trust?
  3. The chapter's Si-face B/A at 1150 °C is 14 times Song's. Is a linear constant from a fit with τ = 0 and no thin-oxide points worth comparing at all?