Agentic PrimitivesAP

Study reproduced ·

Reproducing Hijikata et al. 2013: growth rate against thickness on both faces of 4H-SiC

Hijikata, Yagi, Yaguchi and Yoshida 2013: the sample and the timing of its process history as the paper states them, our encoding beside them item by item, the simulation in ISL, and how far it lands from the paper's numbers (21 within, 16 near, 66 off).

Richard Pedersen · Agentic Trust Labs · Rich Canvas

One of the [studies we reproduced](/writing/interface-studies-reproduced) for [Questions we need Emily to answer](/writing/questions-for-emily-testing-a-theory-of-the-interface), the companion to [the essay](/writing/testing-a-theory-of-the-interface-with-an-ontology). Generated by `scripts/reproduce_studies.py` from `reproductions/hijikata_2013.py`. Every value from the paper was read by an AI agent and has not been checked by a person; the sample and history were re-read from the PDF alone by a second agent that had not seen our earlier transcription.

The study and why we depend on it

Y. Hijikata, S. Yagi, H. Yaguchi and S. Yoshida, “Thermal Oxidation Mechanism of Silicon Carbide”, chapter 7 in Physics and Technology of Silicon Carbide Devices (InTech, 2013), doi:10.5772/50748.

The second SiC growth source for challenge system 3, and the only one that measures the thin-oxide regime. Song 2004, whose constants the SiC growth program uses, measured thickness ex situ at 0.25 to 6 h; Hijikata's group measured the growth rate continuously by in-situ ellipsometry and found it higher below about 20 nm than a Deal-Grove law fitted to the thick part. This page runs the SiC growth program (Song's constants, dry, 950 to 1150 °C) on each in-situ run and compares thickness against time, rebuilt from the measured rates, and the rate itself at each thickness read.

How well can this study be reproduced?

Moderate. A review chapter: the process is one sentence (dry O2, 1 atm, a temperature, a face) and every experimental detail is deferred to the authors' earlier papers. What it gives that no other source in our library does is the growth rate measured in situ against thickness, from about 1 nm, on both faces at 4 to 8 temperatures. No times are given: thickness against time has to be rebuilt by integrating the rates, from an unknown time zero.

Sample described2 of 4 properties we need are stated and encoded the same
History described1 of 4 steps are stated and encoded the same; 1 are stated by the paper and absent from our history; 1 are ours because the paper is silent
Timing0 of 2 simulated steps have a stated duration; 2 of 2 other steps have none; 4 timing gaps listed below
How the results are givenGraphs only (raster): Figure 1 (C face, 8 temperatures, linear axes), Figure 3 (log-log, C 1090 °C and Si 1100 °C), Figure 5 (Si face, 4 temperatures; only 10⁻⁶ µm/s is labelled). Read point by point, about ±3% in rate
Repeatability stated by the authorsNot stated; the scatter between neighbouring points is about ±10% on the C face and ±20% on the Si face below 15 nm
Internal consistencyGood where figures overlap: Figure 1 and Figure 3 agree on the C face at 1090 °C (about 40 nm/h at 50 nm), Figure 3 and Figure 5 on the Si face at 1100 °C (14.5 nm/h at 1.2 nm, 4.0 nm/h at 10 to 40 nm)
Is our model independent of this paper's data?Yes: the growth program's constants are Song 2004's, from another laboratory's ex-situ data. Nothing was fitted to this chapter
Outcome21 of 103 numbers within tolerance

The grade is ours and is about the paper as a source for simulation, not about the quality of the experiment: high means the sample, every step and its timing are stated well enough that a simulation needs no choices of ours; moderate that some choices are ours and are listed; low that the result depends on choices the paper does not constrain.

The sample and its history, played back

The sample is drawn from the simulation: layer heights and the read-outs are what the ISL programs compute at each moment of the history. Steps the language cannot state (a clean, a metallization, a measurement) are on the clock and marked as recorded, not simulated.

4H-SiC
Step 1 of 4 · recorded, not simulated
Loaded into the in-situ ellipsometry furnace and heated
temperature 25 °C
elapsed 0 s of 17 h 43 min 03 s
timing in the paper: not stated

not stated in the chapter: “The experimental details can be found in the references [8, 9, 10].”

The simulation at this moment
oxide thickness0 nm
consumed substrate0 nm
LoadToFirstPoint22.5 minOxidation17.3 hMeasure8900 °CThe same history to true scale (17 h 43 min 03 s simulated). Steps with no stated duration take no width.Temperature through the history. Step widths grow with the logarithm of duration; the bar under each step is how well our encoding matches the paper.
Drag the sample to turn it. Click the clock to move through the history.Layer heights are the simulated thicknesses, drawn to one scale within the film; the substrate is cut short.

Does our sample and history match the paper's?

Left: the paper's own words, with the page of the PDF. Right: what we simulate. 3 same, 1 approximated, 2 assumed, 2 not in ours.

✓3 same≈1 approximated?2 assumed✕2 not in ours
Sample: what the paper saysWhat we simulate
Substrate
“4H-SiC C face” and “Si face”; Figure 1 caption “(0001¯) C-face”; Figure 5 “(0001)Si-face”
PDF p. 8
✓same
FAMILY: SiC_SiO2; ORIENTATION: 4H_SiC_C_face | 4H_SiC_Si_face
Doping, off-cut, epilayer
not stated in the chapter (refs [8, 9, 10])
PDF p. 8
✕not in ours
not in our sample
Song's constants are for on-axis research-grade wafers.
Starting oxide
not stated; the C-face data at 1 atm start at 5 to 12 nm “since the oxide growth in thin thickness region was too fast to follow”
PDF p. 16
?assumed
the program's 0.2 nm, plus the assumed time to the first point
Gas
“dry oxygen ambient at a pressure of 1 atm”
PDF p. 8
✓same
AMBIENT dry_O2
History: what the paper saysWhat we simulate
Loaded into the in-situ ellipsometry furnace and heated
not stated in the chapter: “The experimental details can be found in the references [8, 9, 10].”
PDF p. 8
✕not in ours
not in our history
Heat-up gas and time, and when the oxygen is admitted, are in the cited papers, not here.
Dry oxygen until the first point read (2.6 nm)
not stated: the first rate read on Figure 1 is 6.9 nm/h at 2.6 nm; time zero is not given
PDF p. 8
?assumed
RUN ToFirstPoint DURATION 1348.04 TEMP 890->890 AMBIENT dry_O2
The time to grow the first 2.6 nm is unknown. 2.6 nm at the first measured rate (22 min) is ours: a rate that was at least this high before means it is an upper bound. Searched from 1 s to 2 h.
Dry oxidation at 890 °C, 1 atm, from the first to the last point read
“The oxide growths were executed under dry oxygen ambient at a pressure of 1 atm.”
PDF p. 8
≈approximated
RUN Oxidation DURATION 62435.3 TEMP 890->890 AMBIENT dry_O2
The duration is reconstructed: the time to go from 2.6 to 78 nm at the measured rates, integrated over the points read from Figure 1 (17.34 h). The chapter gives no times.
Growth rate measured in situ by spectroscopic ellipsometry
“we have, for the first time, performed real-time observation of SiC thermal oxidation using an in-situ ellipsometer [4, 5]”
PDF p. 2
✓same
the observable Thickness, at the reconstructed times

The timing of the history

Time is counted from the start of the first simulated step. A step the language cannot state takes no simulated time; where the paper gives its duration, the duration is in the last column. Stated means the paper gives the duration; partly stated that it gives a bound or a range; not stated; assumed that the duration in our history is ours.

C face (000-1), 890 °C

#StepStarts atLastsEnds atTemperatureRateGasIs the timing in the paper?
1Loaded into the in-situ ellipsometry furnace and heated0 snot simulatednot stated
2Dry oxygen until the first point read (2.6 nm)0 s22 min 28 s22 min 28 s890 → 890 °Chelddry_O2not stated; assumed. Not stated; 22 min assumed, 1 s to 2 h searched
3Dry oxidation at 890 °C, 1 atm, from the first to the last point read22 min 28 s17 h 20 min 35 s17 h 43 min 03 s890 → 890 °Chelddry_O2partly stated. Not given; 17.34 h reconstructed from the measured rates
4Growth rate measured in situ by spectroscopic ellipsometry17 h 43 min 03 snot simulatednot stated

Simulated time in this history: 17 h 43 min 03 s.

Across the samples

SampleToFirstPointOxidationTotal
C face (000-1), 890 °C22 min 28 s at 890 °C17 h 20 min 35 s at 890 °C17 h 43 min 03 s
C face (000-1), 930 °C4 min 25 s at 930 °C12 h 25 min 22 s at 930 °C12 h 29 min 47 s
C face (000-1), 970 °C2 min 30 s at 970 °C8 h 06 min 54 s at 970 °C8 h 09 min 24 s
C face (000-1), 1000 °C12 min 02 s at 1000 °C5 h 41 min 34 s at 1000 °C5 h 53 min 36 s
C face (000-1), 1050 °C14 min 45 s at 1050 °C4 h 06 min 46 s at 1050 °C4 h 21 min 32 s
C face (000-1), 1090 °C12 min 13 s at 1090 °C4 h 44 min 37 s at 1090 °C4 h 56 min 50 s
C face (000-1), 1150 °C9 min 40 s at 1150 °C4 h 48 min 25 s at 1150 °C4 h 58 min 05 s
C face (000-1), 1220 °C2 min 46 s at 1220 °C1 h 24 min 39 s at 1220 °C1 h 27 min 24 s
C face (000-1), 1090 °C (Figure 3)10 min 05 s at 1090 °C20 h 24 min 52 s at 1090 °C20 h 34 min 57 s
Si face (0001), 1050 °C15 min 28 s at 1050 °C7 h 41 min 31 s at 1050 °C7 h 56 min 59 s
Si face (0001), 1080 °C5 min 40 s at 1080 °C8 h 49 min 04 s at 1080 °C8 h 54 min 44 s
Si face (0001), 1100 °C4 min 39 s at 1100 °C8 h 45 min 27 s at 1100 °C8 h 50 min 06 s
Si face (0001), 1200 °C4 min 16 s at 1200 °C9 h 21 min 50 s at 1200 °C9 h 26 min 06 s

Timing the paper does not give

  • No time axis anywhere: every run's duration and time zero are unknown; the durations here are reconstructed by integrating the measured rates.
  • Heat-up gas and time before oxygen is admitted (in refs [4, 5, 8-10]).
  • The C-face 1 atm runs begin at 5 to 12 nm because the early growth was too fast to follow (p. 16): the time to reach the first point is unknown.
  • Cooling and unload: not described (the measurement is in situ, so they do not affect the data).

What the second reading changed

  • There is no stored recipe or dataset for this chapter (ontology/library.json: status skimmed, used by nothing). SOURCE.md lists Figures 3, 5, 7 and 9 as the ones with data; Figure 1 (C face at 8 temperatures, linear axes) is the most complete and is used here.
  • Figure 3's Si face at 1100 °C and Figure 5's 1100 °C curve agree point for point; they are taken to be the same run and only Figure 5 is used.
  • Figure 5's y axis labels only 10⁻⁶ µm/s; the decade was taken from the minor-tick spacing and checked against Figure 3 at 1100 °C (both give 4.0 nm/h at 10 to 40 nm).
  • The temperature of Figures 7 to 9 (partial pressures) is not printed in their captions; they are not used.

Their terms and ours

The paper saysWe writeKind in our vocabularyNote
oxide growth rate dX/dt against oxide thickness (in-situ ellipsometry)(none): Thickness at reconstructed timesobservable (target: layer_thickness)The language has no rate observable; the rate is compared by integrating it to thickness.
Deal-Grove B, B/AB0, E_B, BA0, E_BAPARAMETER, STATUS sourced (Song 2004)Hijikata's own D-G fits (Figure 1, solid lines) are not printed.
Massoud term C exp(-X/L)(none)no operatorThe silicon thin-oxide program has a fitted term of this kind; the SiC program does not.
Si and C emission ratios ν_Si, ν_C(none)no operator in the SiC programEmission into the oxide is a boundary flux; a FIELD with a FLUX can write it (Eq. 9 to 10).
interstitial Si and C in SiO2, C_Si, C_C, with D_Si, D_C, κ, η(none)FIELD + Transport + Exchange: writable, not writtenTable 1 gives D_C, κ′, C_C⁰.
interfacial reaction k = k0 (1 − C_Si/C_Si⁰)(1 − C_C/C_C⁰)(none)OxideGrowth whose rate reads left(F)
oxygen partial pressure 0.02 to 1 atmmix:O2=p,N2=1-pambientThe program scales its whole rate with p_O2; Hijikata finds the initial rate R_r nearly independent of p (Figure 8).
C face / Si faceORIENTATION: 4H_SiC_C_face / 4H_SiC_Si_facesample field
interface layer (1.5 nm, SiC side)(none)no observable

The simulation in our language

Each sample is one history file: a SAMPLE and a CONTROL_TRAJECTORY. This is the whole input; run it with PYTHONPATH=. python -m isl_harness.predict <file>.

C face (000-1), 890 °C

# C face (000-1), 890 °C
SAMPLE SiC_C_890 {
    FAMILY: SiC_SiO2
    ORIENTATION: 4H_SiC_C_face
    CLEAN: not_stated
}
CONTROL_TRAJECTORY History {
    EVENT Load KIND load TIMING assumed                          # Loaded into the in-situ ellipsometry furnace and heated
    RUN ToFirstPoint DURATION 1348.04 TEMP 890->890 AMBIENT dry_O2 TIMING assumed VARY duration 1..7200
    RUN Oxidation DURATION 62435.3 TEMP 890->890 AMBIENT dry_O2 TIMING bound
    EVENT Measure KIND measurement TIMING assumed                # Growth rate measured in situ by spectroscopic ellipsometry
}

890 °C is outside the 950 to 1150 °C of the growth program's constants. Thickness against time reconstructed from Figure 1's growth rates (8 points read; 7 scored).

C face (000-1), 930 °C

# C face (000-1), 930 °C
SAMPLE SiC_C_930 {
    FAMILY: SiC_SiO2
    ORIENTATION: 4H_SiC_C_face
    CLEAN: not_stated
}
CONTROL_TRAJECTORY History {
    EVENT Load KIND load TIMING assumed                          # Loaded into the in-situ ellipsometry furnace and heated
    RUN ToFirstPoint DURATION 265.148 TEMP 930->930 AMBIENT dry_O2 TIMING assumed VARY duration 1..7200
    RUN Oxidation DURATION 44722 TEMP 930->930 AMBIENT dry_O2 TIMING bound
    EVENT Measure KIND measurement TIMING assumed                # Growth rate measured in situ by spectroscopic ellipsometry
}

930 °C is outside the 950 to 1150 °C of the growth program's constants. Thickness against time reconstructed from Figure 1's growth rates (15 points read; 8 scored).

C face (000-1), 970 °C

# C face (000-1), 970 °C
SAMPLE SiC_C_970 {
    FAMILY: SiC_SiO2
    ORIENTATION: 4H_SiC_C_face
    CLEAN: not_stated
}
CONTROL_TRAJECTORY History {
    EVENT Load KIND load TIMING assumed                          # Loaded into the in-situ ellipsometry furnace and heated
    RUN ToFirstPoint DURATION 149.871 TEMP 970->970 AMBIENT dry_O2 TIMING assumed VARY duration 1..7200
    RUN Oxidation DURATION 29214.5 TEMP 970->970 AMBIENT dry_O2 TIMING bound
    EVENT Measure KIND measurement TIMING assumed                # Growth rate measured in situ by spectroscopic ellipsometry
}

Thickness against time reconstructed from Figure 1's growth rates (23 points read; 8 scored).

C face (000-1), 1000 °C

# C face (000-1), 1000 °C
SAMPLE SiC_C_1000 {
    FAMILY: SiC_SiO2
    ORIENTATION: 4H_SiC_C_face
    CLEAN: not_stated
}
CONTROL_TRAJECTORY History {
    EVENT Load KIND load TIMING assumed                          # Loaded into the in-situ ellipsometry furnace and heated
    RUN ToFirstPoint DURATION 721.739 TEMP 1000->1000 AMBIENT dry_O2 TIMING assumed VARY duration 1..7200
    RUN Oxidation DURATION 20494.3 TEMP 1000->1000 AMBIENT dry_O2 TIMING bound
    EVENT Measure KIND measurement TIMING assumed                # Growth rate measured in situ by spectroscopic ellipsometry
}

Thickness against time reconstructed from Figure 1's growth rates (18 points read; 8 scored).

C face (000-1), 1050 °C

# C face (000-1), 1050 °C
SAMPLE SiC_C_1050 {
    FAMILY: SiC_SiO2
    ORIENTATION: 4H_SiC_C_face
    CLEAN: not_stated
}
CONTROL_TRAJECTORY History {
    EVENT Load KIND load TIMING assumed                          # Loaded into the in-situ ellipsometry furnace and heated
    RUN ToFirstPoint DURATION 885.321 TEMP 1050->1050 AMBIENT dry_O2 TIMING assumed VARY duration 1..7200
    RUN Oxidation DURATION 14806.2 TEMP 1050->1050 AMBIENT dry_O2 TIMING bound
    EVENT Measure KIND measurement TIMING assumed                # Growth rate measured in situ by spectroscopic ellipsometry
}

Thickness against time reconstructed from Figure 1's growth rates (16 points read; 8 scored).

C face (000-1), 1090 °C

# C face (000-1), 1090 °C
SAMPLE SiC_C_1090 {
    FAMILY: SiC_SiO2
    ORIENTATION: 4H_SiC_C_face
    CLEAN: not_stated
}
CONTROL_TRAJECTORY History {
    EVENT Load KIND load TIMING assumed                          # Loaded into the in-situ ellipsometry furnace and heated
    RUN ToFirstPoint DURATION 732.69 TEMP 1090->1090 AMBIENT dry_O2 TIMING assumed VARY duration 1..7200
    RUN Oxidation DURATION 17077.4 TEMP 1090->1090 AMBIENT dry_O2 TIMING bound
    EVENT Measure KIND measurement TIMING assumed                # Growth rate measured in situ by spectroscopic ellipsometry
}

Thickness against time reconstructed from Figure 1's growth rates (18 points read; 8 scored).

C face (000-1), 1150 °C

# C face (000-1), 1150 °C
SAMPLE SiC_C_1150 {
    FAMILY: SiC_SiO2
    ORIENTATION: 4H_SiC_C_face
    CLEAN: not_stated
}
CONTROL_TRAJECTORY History {
    EVENT Load KIND load TIMING assumed                          # Loaded into the in-situ ellipsometry furnace and heated
    RUN ToFirstPoint DURATION 580.05 TEMP 1150->1150 AMBIENT dry_O2 TIMING assumed VARY duration 1..7200
    RUN Oxidation DURATION 17304.6 TEMP 1150->1150 AMBIENT dry_O2 TIMING bound
    EVENT Measure KIND measurement TIMING assumed                # Growth rate measured in situ by spectroscopic ellipsometry
}

Thickness against time reconstructed from Figure 1's growth rates (19 points read; 8 scored).

C face (000-1), 1220 °C

# C face (000-1), 1220 °C
SAMPLE SiC_C_1220 {
    FAMILY: SiC_SiO2
    ORIENTATION: 4H_SiC_C_face
    CLEAN: not_stated
}
CONTROL_TRAJECTORY History {
    EVENT Load KIND load TIMING assumed                          # Loaded into the in-situ ellipsometry furnace and heated
    RUN ToFirstPoint DURATION 165.675 TEMP 1220->1220 AMBIENT dry_O2 TIMING assumed VARY duration 1..7200
    RUN Oxidation DURATION 5078.68 TEMP 1220->1220 AMBIENT dry_O2 TIMING bound
    EVENT Measure KIND measurement TIMING assumed                # Growth rate measured in situ by spectroscopic ellipsometry
}

1220 °C is outside the 950 to 1150 °C of the growth program's constants. Thickness against time reconstructed from Figure 1's growth rates (20 points read; 8 scored).

C face (000-1), 1090 °C (Figure 3)

# C face (000-1), 1090 °C (Figure 3)
SAMPLE SiC_C_1090_fig3 {
    FAMILY: SiC_SiO2
    ORIENTATION: 4H_SiC_C_face
    CLEAN: not_stated
}
CONTROL_TRAJECTORY History {
    EVENT Load KIND load TIMING assumed                          # Loaded into the in-situ ellipsometry furnace and heated
    RUN ToFirstPoint DURATION 604.544 TEMP 1090->1090 AMBIENT dry_O2 TIMING assumed VARY duration 1..7200
    RUN Oxidation DURATION 73492.1 TEMP 1090->1090 AMBIENT dry_O2 TIMING bound
    EVENT Measure KIND measurement TIMING assumed                # Growth rate measured in situ by spectroscopic ellipsometry
}

Thickness against time reconstructed from Figure 3's growth rates (26 points read; 8 scored).

Si face (0001), 1050 °C

# Si face (0001), 1050 °C
SAMPLE SiC_Si_1050 {
    FAMILY: SiC_SiO2
    ORIENTATION: 4H_SiC_Si_face
    CLEAN: not_stated
}
CONTROL_TRAJECTORY History {
    EVENT Load KIND load TIMING assumed                          # Loaded into the in-situ ellipsometry furnace and heated
    RUN ToFirstPoint DURATION 927.924 TEMP 1050->1050 AMBIENT dry_O2 TIMING assumed VARY duration 1..7200
    RUN Oxidation DURATION 27691.2 TEMP 1050->1050 AMBIENT dry_O2 TIMING bound
    EVENT Measure KIND measurement TIMING assumed                # Growth rate measured in situ by spectroscopic ellipsometry
}

Thickness against time reconstructed from Figure 5's growth rates (22 points read; 8 scored).

Si face (0001), 1080 °C

# Si face (0001), 1080 °C
SAMPLE SiC_Si_1080 {
    FAMILY: SiC_SiO2
    ORIENTATION: 4H_SiC_Si_face
    CLEAN: not_stated
}
CONTROL_TRAJECTORY History {
    EVENT Load KIND load TIMING assumed                          # Loaded into the in-situ ellipsometry furnace and heated
    RUN ToFirstPoint DURATION 340.479 TEMP 1080->1080 AMBIENT dry_O2 TIMING assumed VARY duration 1..7200
    RUN Oxidation DURATION 31744 TEMP 1080->1080 AMBIENT dry_O2 TIMING bound
    EVENT Measure KIND measurement TIMING assumed                # Growth rate measured in situ by spectroscopic ellipsometry
}

Thickness against time reconstructed from Figure 5's growth rates (26 points read; 8 scored).

Si face (0001), 1100 °C

# Si face (0001), 1100 °C
SAMPLE SiC_Si_1100 {
    FAMILY: SiC_SiO2
    ORIENTATION: 4H_SiC_Si_face
    CLEAN: not_stated
}
CONTROL_TRAJECTORY History {
    EVENT Load KIND load TIMING assumed                          # Loaded into the in-situ ellipsometry furnace and heated
    RUN ToFirstPoint DURATION 278.856 TEMP 1100->1100 AMBIENT dry_O2 TIMING assumed VARY duration 1..7200
    RUN Oxidation DURATION 31527 TEMP 1100->1100 AMBIENT dry_O2 TIMING bound
    EVENT Measure KIND measurement TIMING assumed                # Growth rate measured in situ by spectroscopic ellipsometry
}

Thickness against time reconstructed from Figure 5's growth rates (26 points read; 8 scored).

Si face (0001), 1200 °C

# Si face (0001), 1200 °C
SAMPLE SiC_Si_1200 {
    FAMILY: SiC_SiO2
    ORIENTATION: 4H_SiC_Si_face
    CLEAN: not_stated
}
CONTROL_TRAJECTORY History {
    EVENT Load KIND load TIMING assumed                          # Loaded into the in-situ ellipsometry furnace and heated
    RUN ToFirstPoint DURATION 255.687 TEMP 1200->1200 AMBIENT dry_O2 TIMING assumed VARY duration 1..7200
    RUN Oxidation DURATION 33710 TEMP 1200->1200 AMBIENT dry_O2 TIMING bound
    EVENT Measure KIND measurement TIMING assumed                # Growth rate measured in situ by spectroscopic ellipsometry
}

1200 °C is outside the 950 to 1150 °C of the growth program's constants. Thickness against time reconstructed from Figure 5's growth rates (29 points read; 8 scored).

The programs the predictor ran on these histories: experiments/sic_interface_states/one_way_anneal.isl.template, experiments/song_sic/oxide_growth_sic.isl.template.

The model itself, experiments/song_sic/oxide_growth_sic.isl.template, as it is written. Every equation the simulation uses is in this text; the runtime holds no physics.

# ==============================================================================
# ISL MODEL: DRY THERMAL OXIDATION OF 4H-SiC (growth sector on a second material)
#
# The OPERATOR and OBSERVATION_MODEL blocks below are copied character for character
# from experiments/vitkavage_dit/oxide_growth.isl.template, the silicon program; a test
# checks that they are identical. Only the declared parameters differ.
#
# Song et al. (2004) fit their SiC data with the same linear-parabolic law, reading its
# two constants as including out-diffusion of the carbon product. The constants here are
# Arrhenius fits to that paper's Tables I and II, per crystal face
# (scripts/build_song_dataset.py). Nothing is fitted by us.
# Fields in {{braces}} are filled by scripts/run_song_sic.py.
# ==============================================================================
SAMPLE {sample_id} {{
    FAMILY: SiC_SiO2
    ORIENTATION: 4H_SiC_{face}_face
}}
STATE x_ox {{
    UNIT: cm
    INITIAL: x_i
    MIN: 0
    MAX: 1.0e-3
}}
CONTROL T {{ UNIT: K }}
CONTROL p_O2 {{ UNIT: atm }}
PARAMETER B0 {{ VALUE: {B0}; UNIT: cm^2 s^-1; STATUS: sourced; SOURCE: {source} }}
PARAMETER E_B {{ VALUE: {E_B}; UNIT: eV; STATUS: sourced; SOURCE: {source} }}
PARAMETER BA0 {{ VALUE: {BA0}; UNIT: cm s^-1; STATUS: sourced; SOURCE: {source} }}
PARAMETER E_BA {{ VALUE: {E_BA}; UNIT: eV; STATUS: sourced; SOURCE: {source} }}
# The constants above are already specific to the crystal face, so no further factor is applied.
PARAMETER r_or {{ VALUE: 1.0; UNIT: 1; STATUS: constant }}
# The paper sets the time offset to zero and reports a native oxide of about 2 angstrom.
PARAMETER x_i {{ VALUE: 2.0e-8; UNIT: cm; STATUS: sourced; SOURCE: Song et al., J. Appl. Phys. 95, 4953 (2004), native oxide about 2 angstrom, agent-read }}
PARAMETER p_ref {{ VALUE: 1.0; UNIT: atm; STATUS: constant }}
PARAMETER k_B {{ VALUE: 8.617333262e-5; UNIT: eV K^-1; STATUS: constant }}
CONTROL_TRAJECTORY {trajectory_id} {{
    RUN Oxidation DURATION {duration_s} TEMP {T_C}->{T_C} AMBIENT dry_O2
}}
# dx/dt = B / (2x + A), with A = B / (B/A).
OPERATOR F_LinearParabolicGrowth : OxideGrowth {{
    EQUATION: d(x_ox)/dt = (p_O2 / p_ref) * B0 * exp(-E_B / (k_B * T)) / (2 * x_ox + B0 * exp(-E_B / (k_B * T)) / (r_or * BA0 * exp(-E_BA / (k_B * T))))
}}
OBSERVATION_MODEL Obs_Oxide_Thickness {{
    TARGET: Thickness
    UNIT: cm
    EQUATION: Thickness = x_ox
}}
EVALUATION_CONTRACT {contract_id} {{
    FROZEN: true
    DATASET: data/derived/song_2004_sic_thickness.csv
    DATASET_DIGEST: sha256:{dataset_sha256}
    SPLIT: {split}
{targets}
}}

Our simulation against the paper

21 within, 16 near, 66 off of 103 numbers. Tolerance is stated per row; nothing was fitted for this page.

✓21 within tolerance≈16 within twice the tolerance✕66 outside
simulation below the paper ← 0 → simulation above the paper-100%-50%0%+50%+100%C face (000-1), 890 °C, 1.3742 hoxide thicknessours 19 · paper 11.6 nm✕ outside (+64%)C face (000-1), 890 °C, 2.3322 hoxide thicknessours 25.5 · paper 17.1 nm✕ outside (+49%)C face (000-1), 890 °C, 3.6514 hoxide thicknessours 33 · paper 23.6 nm✕ outside (+40%)C face (000-1), 890 °C, 5.798 hoxide thicknessours 43.1 · paper 33.2 nm✕ outside (+30%)C face (000-1), 890 °C, 9.4538 hoxide thicknessours 56.9 · paper 49.4 nm≈ within twice the tolerance (+15%)C face (000-1), 890 °C, 13.2949 hoxide thicknessours 68.9 · paper 65.5 nm✓ within tolerance (+5.3%)C face (000-1), 890 °C, 17.3431 hoxide thicknessours 80 · paper 78.4 nm✓ within tolerance (+2.0%)C face (000-1), 930 °C, 0.658 hoxide thicknessours 14.4 · paper 9.03 nm✕ outside (+60%)C face (000-1), 930 °C, 1.7203 hoxide thicknessours 27.5 · paper 20.3 nm✕ outside (+35%)C face (000-1), 930 °C, 2.4589 hoxide thicknessours 34.6 · paper 26.8 nm✕ outside (+29%)C face (000-1), 930 °C, 3.4448 hoxide thicknessours 42.8 · paper 34.5 nm✕ outside (+24%)C face (000-1), 930 °C, 5.2429 hoxide thicknessours 55.4 · paper 48.7 nm≈ within twice the tolerance (+14%)C face (000-1), 930 °C, 6.8823 hoxide thicknessours 65.2 · paper 64.2 nm✓ within tolerance (+1.5%)C face (000-1), 930 °C, 8.3892 hoxide thicknessours 73.2 · paper 77.7 nm✓ within tolerance (-5.8%)C face (000-1), 930 °C, 12.4228 hoxide thicknessours 91.8 · paper 107 nm≈ within twice the tolerance (-15%)C face (000-1), 970 °C, 0.1197 hoxide thicknessours 5.93 · paper 3.55 nm✕ outside (+67%)C face (000-1), 970 °C, 0.5582 hoxide thicknessours 17.4 · paper 12.3 nm✕ outside (+42%)C face (000-1), 970 °C, 1.1104 hoxide thicknessours 28.1 · paper 22.3 nm✕ outside (+26%)C face (000-1), 970 °C, 1.7387 hoxide thicknessours 38 · paper 31.6 nm✕ outside (+20%)C face (000-1), 970 °C, 2.6686 hoxide thicknessours 50.1 · paper 45.2 nm≈ within twice the tolerance (+11%)C face (000-1), 970 °C, 3.3375 hoxide thicknessours 57.6 · paper 55.2 nm✓ within tolerance (+4.5%)C face (000-1), 970 °C, 4.7239 hoxide thicknessours 71.4 · paper 72.9 nm✓ within tolerance (-2.1%)C face (000-1), 970 °C, 8.1151 hoxide thicknessours 98.5 · paper 106 nm✓ within tolerance (-7.5%)C face (000-1), 1000 °C, 0.0333 hoxide thicknessours 10.4 · paper 6.77 nm✕ outside (+53%)C face (000-1), 1000 °C, 0.4071 hoxide thicknessours 22.3 · paper 16.4 nm✕ outside (+35%)C face (000-1), 1000 °C, 0.8921 hoxide thicknessours 34.2 · paper 27.1 nm✕ outside (+26%)C face (000-1), 1000 °C, 1.2005 hoxide thicknessours 40.7 · paper 33.2 nm✕ outside (+22%)C face (000-1), 1000 °C, 1.6504 hoxide thicknessours 49.1 · paper 42.3 nm≈ within twice the tolerance (+16%)C face (000-1), 1000 °C, 2.3865 hoxide thicknessours 61.2 · paper 57.1 nm✓ within tolerance (+7.1%)C face (000-1), 1000 °C, 4.7707 hoxide thicknessours 91.9 · paper 99.7 nm✓ within tolerance (-7.8%)C face (000-1), 1000 °C, 5.6929 hoxide thicknessours 102 · paper 114 nm≈ within twice the tolerance (-11%)C face (000-1), 1050 °C, 0.0803 hoxide thicknessours 20 · paper 15.5 nm✕ outside (+29%)C face (000-1), 1050 °C, 0.3217 hoxide thicknessours 30.7 · paper 25.5 nm✕ outside (+21%)C face (000-1), 1050 °C, 0.6346 hoxide thicknessours 42.4 · paper 36.5 nm≈ within twice the tolerance (+16%)C face (000-1), 1050 °C, 0.9659 hoxide thicknessours 53.1 · paper 48.1 nm≈ within twice the tolerance (+10%)C face (000-1), 1050 °C, 1.3163 hoxide thicknessours 63.1 · paper 59 nm✓ within tolerance (+6.9%)C face (000-1), 1050 °C, 2.5055 hoxide thicknessours 91.1 · paper 92.3 nm✓ within tolerance (-1.3%)C face (000-1), 1050 °C, 3.6243 hoxide thicknessours 113 · paper 117 nm✓ within tolerance (-4.1%)C face (000-1), 1050 °C, 4.1128 hoxide thicknessours 121 · paper 127 nm✓ within tolerance (-5.0%)C face (000-1), 1090 °C, 0.09 hoxide thicknessours 24.4 · paper 15.8 nm✕ outside (+54%)C face (000-1), 1090 °C, 0.5479 hoxide thicknessours 49.9 · paper 36.1 nm✕ outside (+38%)C face (000-1), 1090 °C, 1.0565 hoxide thicknessours 71.6 · paper 56.8 nm✕ outside (+26%)C face (000-1), 1090 °C, 1.3896 hoxide thicknessours 83.8 · paper 69.7 nm✕ outside (+20%)C face (000-1), 1090 °C, 1.691 hoxide thicknessours 93.9 · paper 79.3 nm≈ within twice the tolerance (+18%)C face (000-1), 1090 °C, 2.4997 hoxide thicknessours 118 · paper 106 nm≈ within twice the tolerance (+11%)C face (000-1), 1090 °C, 3.7531 hoxide thicknessours 149 · paper 142 nm✓ within tolerance (+4.9%)C face (000-1), 1090 °C, 4.7437 hoxide thicknessours 170 · paper 168 nm✓ within tolerance (+1.3%)C face (000-1), 1150 °C, 0.0551 hoxide thicknessours 28.3 · paper 16.4 nm✕ outside (+72%)C face (000-1), 1150 °C, 0.4309 hoxide thicknessours 61.8 · paper 40.3 nm✕ outside (+53%)C face (000-1), 1150 °C, 0.9206 hoxide thicknessours 94.4 · paper 68.4 nm✕ outside (+38%)C face (000-1), 1150 °C, 1.3887 hoxide thicknessours 120 · paper 92.9 nm✕ outside (+29%)C face (000-1), 1150 °C, 2.053 hoxide thicknessours 151 · paper 120 nm✕ outside (+25%)C face (000-1), 1150 °C, 2.5702 hoxide thicknessours 172 · paper 141 nm✕ outside (+22%)C face (000-1), 1150 °C, 3.7828 hoxide thicknessours 215 · paper 188 nm≈ within twice the tolerance (+15%)C face (000-1), 1150 °C, 4.8068 hoxide thicknessours 247 · paper 220 nm≈ within twice the tolerance (+12%)C face (000-1), 1220 °C, 0.029 hoxide thickness+126% ▸ours 17.5 · paper 7.74 nm✕ outsideC face (000-1), 1220 °C, 0.1827 hoxide thickness+112% ▸ours 45.2 · paper 21.3 nm✕ outsideC face (000-1), 1220 °C, 0.3426 hoxide thicknessours 68.3 · paper 34.5 nm✕ outside (+98%)C face (000-1), 1220 °C, 0.5916 hoxide thicknessours 98.3 · paper 53.9 nm✕ outside (+82%)C face (000-1), 1220 °C, 0.7609 hoxide thicknessours 116 · paper 66.1 nm✕ outside (+75%)C face (000-1), 1220 °C, 1.0129 hoxide thicknessours 140 · paper 83.2 nm✕ outside (+68%)C face (000-1), 1220 °C, 1.1721 hoxide thicknessours 153 · paper 93.5 nm✕ outside (+64%)C face (000-1), 1220 °C, 1.4107 hoxide thicknessours 172 · paper 109 nm✕ outside (+58%)C face (000-1), 1090 °C (Figure 3), 0.0582 hoxide thicknessours 19.7 · paper 12 nm✕ outside (+65%)C face (000-1), 1090 °C (Figure 3), 0.3286 hoxide thicknessours 36.7 · paper 24.5 nm✕ outside (+50%)C face (000-1), 1090 °C (Figure 3), 0.9567 hoxide thicknessours 66.3 · paper 49.7 nm✕ outside (+33%)C face (000-1), 1090 °C (Figure 3), 1.7132 hoxide thicknessours 93.4 · paper 78.1 nm≈ within twice the tolerance (+20%)C face (000-1), 1090 °C (Figure 3), 2.8941 hoxide thicknessours 127 · paper 118 nm✓ within tolerance (+8.2%)C face (000-1), 1090 °C (Figure 3), 5.1905 hoxide thicknessours 179 · paper 182 nm✓ within tolerance (-1.7%)C face (000-1), 1090 °C (Figure 3), 14.0899 hoxide thicknessours 313 · paper 359 nm≈ within twice the tolerance (-13%)C face (000-1), 1090 °C (Figure 3), 20.4145 hoxide thicknessours 383 · paper 441 nm≈ within twice the tolerance (-13%)Si face (0001), 1050 °C, 0.0791 hoxide thickness+132% ▸ours 3.22 · paper 1.39 nm✕ outsideSi face (0001), 1050 °C, 0.399 hoxide thickness+111% ▸ours 4.91 · paper 2.32 nm✕ outsideSi face (0001), 1050 °C, 0.8717 hoxide thicknessours 6.8 · paper 3.61 nm✕ outside (+88%)Si face (0001), 1050 °C, 1.7079 hoxide thicknessours 9.39 · paper 5.9 nm✕ outside (+59%)Si face (0001), 1050 °C, 2.3256 hoxide thicknessours 11 · paper 7.35 nm✕ outside (+49%)Si face (0001), 1050 °C, 3.6514 hoxide thicknessours 13.8 · paper 10.3 nm✕ outside (+34%)Si face (0001), 1050 °C, 5.1566 hoxide thicknessours 16.5 · paper 13.5 nm✕ outside (+22%)Si face (0001), 1050 °C, 7.692 hoxide thicknessours 20.3 · paper 19.1 nm✓ within tolerance (+6.2%)Si face (0001), 1080 °C, 0.0367 hoxide thickness+122% ▸ours 2.25 · paper 1.01 nm✕ outsideSi face (0001), 1080 °C, 0.1879 hoxide thickness+116% ▸ours 3.81 · paper 1.76 nm✕ outsideSi face (0001), 1080 °C, 0.4978 hoxide thicknessours 6.15 · paper 3.1 nm✕ outside (+98%)Si face (0001), 1080 °C, 0.8107 hoxide thicknessours 7.99 · paper 4.3 nm✕ outside (+86%)Si face (0001), 1080 °C, 1.4163 hoxide thicknessours 10.8 · paper 6.56 nm✕ outside (+65%)Si face (0001), 1080 °C, 2.4272 hoxide thicknessours 14.6 · paper 9.87 nm✕ outside (+48%)Si face (0001), 1080 °C, 5.0161 hoxide thicknessours 21.6 · paper 17.9 nm✕ outside (+20%)Si face (0001), 1080 °C, 8.8178 hoxide thicknessours 29.2 · paper 30.3 nm✓ within tolerance (-3.6%)Si face (0001), 1100 °C, 0.0373 hoxide thicknessours 2.43 · paper 1.61 nm✕ outside (+51%)Si face (0001), 1100 °C, 0.1606 hoxide thicknessours 4.07 · paper 2.91 nm✕ outside (+40%)Si face (0001), 1100 °C, 0.4081 hoxide thicknessours 6.53 · paper 4.73 nm✕ outside (+38%)Si face (0001), 1100 °C, 0.7327 hoxide thicknessours 9.02 · paper 6.44 nm✕ outside (+40%)Si face (0001), 1100 °C, 1.5643 hoxide thicknessours 13.8 · paper 10.8 nm✕ outside (+27%)Si face (0001), 1100 °C, 2.5032 hoxide thicknessours 17.9 · paper 14.9 nm✕ outside (+20%)Si face (0001), 1100 °C, 4.9848 hoxide thicknessours 26 · paper 25.4 nm✓ within tolerance (+2.5%)Si face (0001), 1100 °C, 8.7575 hoxide thicknessours 35.2 · paper 40.7 nm≈ within twice the tolerance (-13%)Si face (0001), 1200 °C, 0.0361 hoxide thickness+151% ▸ours 5.17 · paper 2.06 nm✕ outsideSi face (0001), 1200 °C, 0.2112 hoxide thickness+124% ▸ours 10.6 · paper 4.73 nm✕ outsideSi face (0001), 1200 °C, 0.4878 hoxide thickness+117% ▸ours 16.9 · paper 7.78 nm✕ outsideSi face (0001), 1200 °C, 0.8428 hoxide thickness+106% ▸ours 23.1 · paper 11.2 nm✕ outsideSi face (0001), 1200 °C, 1.2414 hoxide thicknessours 28.8 · paper 14.9 nm✕ outside (+94%)Si face (0001), 1200 °C, 2.3318 hoxide thicknessours 41.2 · paper 23.8 nm✕ outside (+73%)Si face (0001), 1200 °C, 5.2029 hoxide thicknessours 64.3 · paper 47.6 nm✕ outside (+35%)Si face (0001), 1200 °C, 9.3639 hoxide thicknessours 88.4 · paper 81.3 nm✓ within tolerance (+8.8%)
The pale green band is the tolerance. Bars past ±100% are cut and carry their value.
Oxide thickness against time after the first point read, C face (000-1)
011923835747605.110.215.320.4time in Oxidation (h)oxide thickness (nm)890 °C930 °C970 °C1000 °C1050 °C1090 °C1150 °C1220 °C1090 °C_fig3our simulationthe paper
Oxide thickness against time after the first point read, Si face (0001)
023.947.771.695.502.344.687.029.36time in Oxidation (h)oxide thickness (nm)1050 °C1080 °C1100 °C1200 °Cour simulationthe paper
Sample and historyQuantityThe paperOur simulationDifferenceVerdictWhat the program's own evaluation saysWhere in the paper
C face (000-1), 890 °C, 1.3742 hoxide thickness11.6 nm19 nm+64%off (±10%)outside the tested scopeFigure 1, growth rate read point by point and integrated to thickness against time (reconstruction ours)
C face (000-1), 890 °C, 2.3322 hoxide thickness17.1 nm25.5 nm+49%off (±10%)outside the tested scopeFigure 1, growth rate read point by point and integrated to thickness against time (reconstruction ours)
C face (000-1), 890 °C, 3.6514 hoxide thickness23.6 nm33 nm+40%off (±10%)outside the tested scopeFigure 1, growth rate read point by point and integrated to thickness against time (reconstruction ours)
C face (000-1), 890 °C, 5.798 hoxide thickness33.2 nm43.1 nm+30%off (±10%)outside the tested scopeFigure 1, growth rate read point by point and integrated to thickness against time (reconstruction ours)
C face (000-1), 890 °C, 9.4538 hoxide thickness49.4 nm56.9 nm+15%near (±10%)outside the tested scopeFigure 1, growth rate read point by point and integrated to thickness against time (reconstruction ours)
C face (000-1), 890 °C, 13.2949 hoxide thickness65.5 nm68.9 nm+5%within (±10%)outside the tested scopeFigure 1, growth rate read point by point and integrated to thickness against time (reconstruction ours)
C face (000-1), 890 °C, 17.3431 hoxide thickness78.4 nm80 nm+2%within (±10%)outside the tested scopeFigure 1, growth rate read point by point and integrated to thickness against time (reconstruction ours)
C face (000-1), 930 °C, 0.658 hoxide thickness9.03 nm14.4 nm+60%off (±10%)outside the tested scopeFigure 1, growth rate read point by point and integrated to thickness against time (reconstruction ours)
C face (000-1), 930 °C, 1.7203 hoxide thickness20.3 nm27.5 nm+35%off (±10%)outside the tested scopeFigure 1, growth rate read point by point and integrated to thickness against time (reconstruction ours)
C face (000-1), 930 °C, 2.4589 hoxide thickness26.8 nm34.6 nm+29%off (±10%)outside the tested scopeFigure 1, growth rate read point by point and integrated to thickness against time (reconstruction ours)
C face (000-1), 930 °C, 3.4448 hoxide thickness34.5 nm42.8 nm+24%off (±10%)outside the tested scopeFigure 1, growth rate read point by point and integrated to thickness against time (reconstruction ours)
C face (000-1), 930 °C, 5.2429 hoxide thickness48.7 nm55.4 nm+14%near (±10%)outside the tested scopeFigure 1, growth rate read point by point and integrated to thickness against time (reconstruction ours)
C face (000-1), 930 °C, 6.8823 hoxide thickness64.2 nm65.2 nm+1%within (±10%)outside the tested scopeFigure 1, growth rate read point by point and integrated to thickness against time (reconstruction ours)
C face (000-1), 930 °C, 8.3892 hoxide thickness77.7 nm73.2 nm-6%within (±10%)outside the tested scopeFigure 1, growth rate read point by point and integrated to thickness against time (reconstruction ours)
C face (000-1), 930 °C, 12.4228 hoxide thickness107 nm91.8 nm-15%near (±10%)outside the tested scopeFigure 1, growth rate read point by point and integrated to thickness against time (reconstruction ours)
C face (000-1), 970 °C, 0.1197 hoxide thickness3.55 nm5.93 nm+67%off (±10%)supported within scopeFigure 1, growth rate read point by point and integrated to thickness against time (reconstruction ours)
C face (000-1), 970 °C, 0.5582 hoxide thickness12.3 nm17.4 nm+42%off (±10%)supported within scopeFigure 1, growth rate read point by point and integrated to thickness against time (reconstruction ours)
C face (000-1), 970 °C, 1.1104 hoxide thickness22.3 nm28.1 nm+26%off (±10%)supported within scopeFigure 1, growth rate read point by point and integrated to thickness against time (reconstruction ours)
C face (000-1), 970 °C, 1.7387 hoxide thickness31.6 nm38 nm+20%off (±10%)supported within scopeFigure 1, growth rate read point by point and integrated to thickness against time (reconstruction ours)
C face (000-1), 970 °C, 2.6686 hoxide thickness45.2 nm50.1 nm+11%near (±10%)supported within scopeFigure 1, growth rate read point by point and integrated to thickness against time (reconstruction ours)
C face (000-1), 970 °C, 3.3375 hoxide thickness55.2 nm57.6 nm+4%within (±10%)supported within scopeFigure 1, growth rate read point by point and integrated to thickness against time (reconstruction ours)
C face (000-1), 970 °C, 4.7239 hoxide thickness72.9 nm71.4 nm-2%within (±10%)supported within scopeFigure 1, growth rate read point by point and integrated to thickness against time (reconstruction ours)
C face (000-1), 970 °C, 8.1151 hoxide thickness106 nm98.5 nm-8%within (±10%)supported within scopeFigure 1, growth rate read point by point and integrated to thickness against time (reconstruction ours)
C face (000-1), 1000 °C, 0.0333 hoxide thickness6.77 nm10.4 nm+53%off (±10%)supported within scopeFigure 1, growth rate read point by point and integrated to thickness against time (reconstruction ours)
C face (000-1), 1000 °C, 0.4071 hoxide thickness16.4 nm22.3 nm+35%off (±10%)supported within scopeFigure 1, growth rate read point by point and integrated to thickness against time (reconstruction ours)
C face (000-1), 1000 °C, 0.8921 hoxide thickness27.1 nm34.2 nm+26%off (±10%)supported within scopeFigure 1, growth rate read point by point and integrated to thickness against time (reconstruction ours)
C face (000-1), 1000 °C, 1.2005 hoxide thickness33.2 nm40.7 nm+22%off (±10%)supported within scopeFigure 1, growth rate read point by point and integrated to thickness against time (reconstruction ours)
C face (000-1), 1000 °C, 1.6504 hoxide thickness42.3 nm49.1 nm+16%near (±10%)supported within scopeFigure 1, growth rate read point by point and integrated to thickness against time (reconstruction ours)
C face (000-1), 1000 °C, 2.3865 hoxide thickness57.1 nm61.2 nm+7%within (±10%)supported within scopeFigure 1, growth rate read point by point and integrated to thickness against time (reconstruction ours)
C face (000-1), 1000 °C, 4.7707 hoxide thickness99.7 nm91.9 nm-8%within (±10%)supported within scopeFigure 1, growth rate read point by point and integrated to thickness against time (reconstruction ours)
C face (000-1), 1000 °C, 5.6929 hoxide thickness114 nm102 nm-11%near (±10%)supported within scopeFigure 1, growth rate read point by point and integrated to thickness against time (reconstruction ours)
C face (000-1), 1050 °C, 0.0803 hoxide thickness15.5 nm20 nm+29%off (±10%)supported within scopeFigure 1, growth rate read point by point and integrated to thickness against time (reconstruction ours)
C face (000-1), 1050 °C, 0.3217 hoxide thickness25.5 nm30.7 nm+21%off (±10%)supported within scopeFigure 1, growth rate read point by point and integrated to thickness against time (reconstruction ours)
C face (000-1), 1050 °C, 0.6346 hoxide thickness36.5 nm42.4 nm+16%near (±10%)supported within scopeFigure 1, growth rate read point by point and integrated to thickness against time (reconstruction ours)
C face (000-1), 1050 °C, 0.9659 hoxide thickness48.1 nm53.1 nm+10%near (±10%)supported within scopeFigure 1, growth rate read point by point and integrated to thickness against time (reconstruction ours)
C face (000-1), 1050 °C, 1.3163 hoxide thickness59 nm63.1 nm+7%within (±10%)supported within scopeFigure 1, growth rate read point by point and integrated to thickness against time (reconstruction ours)
C face (000-1), 1050 °C, 2.5055 hoxide thickness92.3 nm91.1 nm-1%within (±10%)supported within scopeFigure 1, growth rate read point by point and integrated to thickness against time (reconstruction ours)
C face (000-1), 1050 °C, 3.6243 hoxide thickness117 nm113 nm-4%within (±10%)supported within scopeFigure 1, growth rate read point by point and integrated to thickness against time (reconstruction ours)
C face (000-1), 1050 °C, 4.1128 hoxide thickness127 nm121 nm-5%within (±10%)supported within scopeFigure 1, growth rate read point by point and integrated to thickness against time (reconstruction ours)
C face (000-1), 1090 °C, 0.09 hoxide thickness15.8 nm24.4 nm+54%off (±10%)supported within scopeFigure 1, growth rate read point by point and integrated to thickness against time (reconstruction ours)
C face (000-1), 1090 °C, 0.5479 hoxide thickness36.1 nm49.9 nm+38%off (±10%)supported within scopeFigure 1, growth rate read point by point and integrated to thickness against time (reconstruction ours)
C face (000-1), 1090 °C, 1.0565 hoxide thickness56.8 nm71.6 nm+26%off (±10%)supported within scopeFigure 1, growth rate read point by point and integrated to thickness against time (reconstruction ours)
C face (000-1), 1090 °C, 1.3896 hoxide thickness69.7 nm83.8 nm+20%off (±10%)supported within scopeFigure 1, growth rate read point by point and integrated to thickness against time (reconstruction ours)
C face (000-1), 1090 °C, 1.691 hoxide thickness79.3 nm93.9 nm+18%near (±10%)supported within scopeFigure 1, growth rate read point by point and integrated to thickness against time (reconstruction ours)
C face (000-1), 1090 °C, 2.4997 hoxide thickness106 nm118 nm+11%near (±10%)supported within scopeFigure 1, growth rate read point by point and integrated to thickness against time (reconstruction ours)
C face (000-1), 1090 °C, 3.7531 hoxide thickness142 nm149 nm+5%within (±10%)supported within scopeFigure 1, growth rate read point by point and integrated to thickness against time (reconstruction ours)
C face (000-1), 1090 °C, 4.7437 hoxide thickness168 nm170 nm+1%within (±10%)supported within scopeFigure 1, growth rate read point by point and integrated to thickness against time (reconstruction ours)
C face (000-1), 1150 °C, 0.0551 hoxide thickness16.4 nm28.3 nm+72%off (±10%)supported within scopeFigure 1, growth rate read point by point and integrated to thickness against time (reconstruction ours)
C face (000-1), 1150 °C, 0.4309 hoxide thickness40.3 nm61.8 nm+53%off (±10%)supported within scopeFigure 1, growth rate read point by point and integrated to thickness against time (reconstruction ours)
C face (000-1), 1150 °C, 0.9206 hoxide thickness68.4 nm94.4 nm+38%off (±10%)supported within scopeFigure 1, growth rate read point by point and integrated to thickness against time (reconstruction ours)
C face (000-1), 1150 °C, 1.3887 hoxide thickness92.9 nm120 nm+29%off (±10%)supported within scopeFigure 1, growth rate read point by point and integrated to thickness against time (reconstruction ours)
C face (000-1), 1150 °C, 2.053 hoxide thickness120 nm151 nm+25%off (±10%)supported within scopeFigure 1, growth rate read point by point and integrated to thickness against time (reconstruction ours)
C face (000-1), 1150 °C, 2.5702 hoxide thickness141 nm172 nm+22%off (±10%)supported within scopeFigure 1, growth rate read point by point and integrated to thickness against time (reconstruction ours)
C face (000-1), 1150 °C, 3.7828 hoxide thickness188 nm215 nm+15%near (±10%)supported within scopeFigure 1, growth rate read point by point and integrated to thickness against time (reconstruction ours)
C face (000-1), 1150 °C, 4.8068 hoxide thickness220 nm247 nm+12%near (±10%)supported within scopeFigure 1, growth rate read point by point and integrated to thickness against time (reconstruction ours)
C face (000-1), 1220 °C, 0.029 hoxide thickness7.74 nm17.5 nm+126%off (±10%)outside the tested scopeFigure 1, growth rate read point by point and integrated to thickness against time (reconstruction ours)
C face (000-1), 1220 °C, 0.1827 hoxide thickness21.3 nm45.2 nm+112%off (±10%)outside the tested scopeFigure 1, growth rate read point by point and integrated to thickness against time (reconstruction ours)
C face (000-1), 1220 °C, 0.3426 hoxide thickness34.5 nm68.3 nm+98%off (±10%)outside the tested scopeFigure 1, growth rate read point by point and integrated to thickness against time (reconstruction ours)
C face (000-1), 1220 °C, 0.5916 hoxide thickness53.9 nm98.2 nm+82%off (±10%)outside the tested scopeFigure 1, growth rate read point by point and integrated to thickness against time (reconstruction ours)
C face (000-1), 1220 °C, 0.7609 hoxide thickness66.1 nm116 nm+75%off (±10%)outside the tested scopeFigure 1, growth rate read point by point and integrated to thickness against time (reconstruction ours)
C face (000-1), 1220 °C, 1.0129 hoxide thickness83.2 nm140 nm+68%off (±10%)outside the tested scopeFigure 1, growth rate read point by point and integrated to thickness against time (reconstruction ours)
C face (000-1), 1220 °C, 1.1721 hoxide thickness93.5 nm153 nm+64%off (±10%)outside the tested scopeFigure 1, growth rate read point by point and integrated to thickness against time (reconstruction ours)
C face (000-1), 1220 °C, 1.4107 hoxide thickness109 nm172 nm+58%off (±10%)outside the tested scopeFigure 1, growth rate read point by point and integrated to thickness against time (reconstruction ours)
C face (000-1), 1090 °C (Figure 3), 0.0582 hoxide thickness12 nm19.7 nm+65%off (±10%)supported within scopeFigure 3, growth rate read point by point and integrated to thickness against time (reconstruction ours)
C face (000-1), 1090 °C (Figure 3), 0.3286 hoxide thickness24.5 nm36.7 nm+50%off (±10%)supported within scopeFigure 3, growth rate read point by point and integrated to thickness against time (reconstruction ours)
C face (000-1), 1090 °C (Figure 3), 0.9567 hoxide thickness49.7 nm66.3 nm+33%off (±10%)supported within scopeFigure 3, growth rate read point by point and integrated to thickness against time (reconstruction ours)
C face (000-1), 1090 °C (Figure 3), 1.7132 hoxide thickness78.1 nm93.4 nm+20%near (±10%)supported within scopeFigure 3, growth rate read point by point and integrated to thickness against time (reconstruction ours)
C face (000-1), 1090 °C (Figure 3), 2.8941 hoxide thickness118 nm127 nm+8%within (±10%)supported within scopeFigure 3, growth rate read point by point and integrated to thickness against time (reconstruction ours)
C face (000-1), 1090 °C (Figure 3), 5.1905 hoxide thickness182 nm178 nm-2%within (±10%)supported within scopeFigure 3, growth rate read point by point and integrated to thickness against time (reconstruction ours)
C face (000-1), 1090 °C (Figure 3), 14.0899 hoxide thickness359 nm313 nm-13%near (±10%)supported within scopeFigure 3, growth rate read point by point and integrated to thickness against time (reconstruction ours)
C face (000-1), 1090 °C (Figure 3), 20.4145 hoxide thickness441 nm383 nm-13%near (±10%)supported within scopeFigure 3, growth rate read point by point and integrated to thickness against time (reconstruction ours)
Si face (0001), 1050 °C, 0.0791 hoxide thickness1.39 nm3.22 nm+132%off (±10%)supported within scopeFigure 5, growth rate read point by point and integrated to thickness against time (reconstruction ours)
Si face (0001), 1050 °C, 0.399 hoxide thickness2.32 nm4.91 nm+111%off (±10%)supported within scopeFigure 5, growth rate read point by point and integrated to thickness against time (reconstruction ours)
Si face (0001), 1050 °C, 0.8717 hoxide thickness3.61 nm6.8 nm+88%off (±10%)supported within scopeFigure 5, growth rate read point by point and integrated to thickness against time (reconstruction ours)
Si face (0001), 1050 °C, 1.7079 hoxide thickness5.9 nm9.39 nm+59%off (±10%)supported within scopeFigure 5, growth rate read point by point and integrated to thickness against time (reconstruction ours)
Si face (0001), 1050 °C, 2.3256 hoxide thickness7.35 nm11 nm+49%off (±10%)supported within scopeFigure 5, growth rate read point by point and integrated to thickness against time (reconstruction ours)
Si face (0001), 1050 °C, 3.6514 hoxide thickness10.3 nm13.8 nm+34%off (±10%)supported within scopeFigure 5, growth rate read point by point and integrated to thickness against time (reconstruction ours)
Si face (0001), 1050 °C, 5.1566 hoxide thickness13.5 nm16.5 nm+22%off (±10%)supported within scopeFigure 5, growth rate read point by point and integrated to thickness against time (reconstruction ours)
Si face (0001), 1050 °C, 7.692 hoxide thickness19.1 nm20.3 nm+6%within (±10%)supported within scopeFigure 5, growth rate read point by point and integrated to thickness against time (reconstruction ours)
Si face (0001), 1080 °C, 0.0367 hoxide thickness1.01 nm2.25 nm+122%off (±10%)supported within scopeFigure 5, growth rate read point by point and integrated to thickness against time (reconstruction ours)
Si face (0001), 1080 °C, 0.1879 hoxide thickness1.76 nm3.81 nm+116%off (±10%)supported within scopeFigure 5, growth rate read point by point and integrated to thickness against time (reconstruction ours)
Si face (0001), 1080 °C, 0.4978 hoxide thickness3.1 nm6.15 nm+98%off (±10%)supported within scopeFigure 5, growth rate read point by point and integrated to thickness against time (reconstruction ours)
Si face (0001), 1080 °C, 0.8107 hoxide thickness4.3 nm7.99 nm+86%off (±10%)supported within scopeFigure 5, growth rate read point by point and integrated to thickness against time (reconstruction ours)
Si face (0001), 1080 °C, 1.4163 hoxide thickness6.56 nm10.8 nm+65%off (±10%)supported within scopeFigure 5, growth rate read point by point and integrated to thickness against time (reconstruction ours)
Si face (0001), 1080 °C, 2.4272 hoxide thickness9.87 nm14.6 nm+48%off (±10%)supported within scopeFigure 5, growth rate read point by point and integrated to thickness against time (reconstruction ours)
Si face (0001), 1080 °C, 5.0161 hoxide thickness17.9 nm21.6 nm+20%off (±10%)supported within scopeFigure 5, growth rate read point by point and integrated to thickness against time (reconstruction ours)
Si face (0001), 1080 °C, 8.8178 hoxide thickness30.3 nm29.2 nm-4%within (±10%)supported within scopeFigure 5, growth rate read point by point and integrated to thickness against time (reconstruction ours)
Si face (0001), 1100 °C, 0.0373 hoxide thickness1.61 nm2.43 nm+51%off (±10%)supported within scopeFigure 5, growth rate read point by point and integrated to thickness against time (reconstruction ours)
Si face (0001), 1100 °C, 0.1606 hoxide thickness2.91 nm4.07 nm+40%off (±10%)supported within scopeFigure 5, growth rate read point by point and integrated to thickness against time (reconstruction ours)
Si face (0001), 1100 °C, 0.4081 hoxide thickness4.73 nm6.53 nm+38%off (±10%)supported within scopeFigure 5, growth rate read point by point and integrated to thickness against time (reconstruction ours)
Si face (0001), 1100 °C, 0.7327 hoxide thickness6.44 nm9.02 nm+40%off (±10%)supported within scopeFigure 5, growth rate read point by point and integrated to thickness against time (reconstruction ours)
Si face (0001), 1100 °C, 1.5643 hoxide thickness10.8 nm13.8 nm+27%off (±10%)supported within scopeFigure 5, growth rate read point by point and integrated to thickness against time (reconstruction ours)
Si face (0001), 1100 °C, 2.5032 hoxide thickness14.9 nm17.9 nm+20%off (±10%)supported within scopeFigure 5, growth rate read point by point and integrated to thickness against time (reconstruction ours)
Si face (0001), 1100 °C, 4.9848 hoxide thickness25.4 nm26 nm+3%within (±10%)supported within scopeFigure 5, growth rate read point by point and integrated to thickness against time (reconstruction ours)
Si face (0001), 1100 °C, 8.7575 hoxide thickness40.7 nm35.2 nm-13%near (±10%)supported within scopeFigure 5, growth rate read point by point and integrated to thickness against time (reconstruction ours)
Si face (0001), 1200 °C, 0.0361 hoxide thickness2.06 nm5.17 nm+151%off (±10%)outside the tested scopeFigure 5, growth rate read point by point and integrated to thickness against time (reconstruction ours)
Si face (0001), 1200 °C, 0.2112 hoxide thickness4.73 nm10.6 nm+124%off (±10%)outside the tested scopeFigure 5, growth rate read point by point and integrated to thickness against time (reconstruction ours)
Si face (0001), 1200 °C, 0.4878 hoxide thickness7.78 nm16.9 nm+117%off (±10%)outside the tested scopeFigure 5, growth rate read point by point and integrated to thickness against time (reconstruction ours)
Si face (0001), 1200 °C, 0.8428 hoxide thickness11.2 nm23.1 nm+106%off (±10%)outside the tested scopeFigure 5, growth rate read point by point and integrated to thickness against time (reconstruction ours)
Si face (0001), 1200 °C, 1.2414 hoxide thickness14.9 nm28.8 nm+94%off (±10%)outside the tested scopeFigure 5, growth rate read point by point and integrated to thickness against time (reconstruction ours)
Si face (0001), 1200 °C, 2.3318 hoxide thickness23.8 nm41.2 nm+73%off (±10%)outside the tested scopeFigure 5, growth rate read point by point and integrated to thickness against time (reconstruction ours)
Si face (0001), 1200 °C, 5.2029 hoxide thickness47.6 nm64.3 nm+35%off (±10%)outside the tested scopeFigure 5, growth rate read point by point and integrated to thickness against time (reconstruction ours)
Si face (0001), 1200 °C, 9.3639 hoxide thickness81.2 nm88.4 nm+9%within (±10%)outside the tested scopeFigure 5, growth rate read point by point and integrated to thickness against time (reconstruction ours)

Aligning the simulation: what the unstated things would have to be

Every step whose timing or temperature the paper leaves open carries a range in the history above (VARY). scripts/align_study.py searched those ranges against the paper's numbers through the same predictor, first one unknown at a time, then all together. No parameter a program declares fitted was touched. There are no held-out samples here: the unknowns were chosen on the same numbers they are scored on, so the aligned score is an upper bound, not a test.

UnknownWhat the paper saysRange searchedThe reproduction usedBest aloneScore at the reproduction's valueBest score alone
Dry oxygen until the first point read (2.6 nm): duration (C_890)Not stated; 22 min assumed, 1 s to 2 h searched1 to 7200 s1348.04 s1 s21 of 103 within tolerance, median error 29.0%21 of 103 within tolerance, median error 26.9%
Dry oxygen until the first point read (1.0 nm): duration (C_930)Not stated; 22 min assumed, 1 s to 2 h searched1 to 7200 s265.148 s1 s21 of 103 within tolerance, median error 29.0%21 of 103 within tolerance, median error 26.9%
Dry oxygen until the first point read (1.0 nm): duration (C_970)Not stated; 22 min assumed, 1 s to 2 h searched1 to 7200 s149.871 s1 s21 of 103 within tolerance, median error 29.0%22 of 103 within tolerance, median error 29.0%
Dry oxygen until the first point read (5.8 nm): duration (C_1000)Not stated; 22 min assumed, 1 s to 2 h searched1 to 7200 s721.739 s1 s21 of 103 within tolerance, median error 29.0%23 of 103 within tolerance, median error 26.9%
Dry oxygen until the first point read (11.6 nm): duration (C_1050)Not stated; 22 min assumed, 1 s to 2 h searched1 to 7200 s885.321 s372.9 s21 of 103 within tolerance, median error 29.0%24 of 103 within tolerance, median error 26.9%
Dry oxygen until the first point read (11.0 nm): duration (C_1090)Not stated; 22 min assumed, 1 s to 2 h searched1 to 7200 s732.69 s1 s21 of 103 within tolerance, median error 29.0%25 of 103 within tolerance, median error 26.9%
Dry oxygen until the first point read (12.3 nm): duration (C_1150)Not stated; 22 min assumed, 1 s to 2 h searched1 to 7200 s580.05 s1 s21 of 103 within tolerance, median error 29.0%21 of 103 within tolerance, median error 26.2%
Dry oxygen until the first point read (4.8 nm): duration (C_1220)Not stated; 22 min assumed, 1 s to 2 h searched1 to 7200 s165.675 s1 s21 of 103 within tolerance, median error 29.0%22 of 103 within tolerance, median error 26.9%
Dry oxygen until the first point read (8.9 nm): duration (C_1090_fig3)Not stated; 22 min assumed, 1 s to 2 h searched1 to 7200 s604.544 s1 s21 of 103 within tolerance, median error 29.0%22 of 103 within tolerance, median error 26.3%
Dry oxygen until the first point read (1.1 nm): duration (Si_1050)Not stated; 22 min assumed, 1 s to 2 h searched1 to 7200 s927.924 s19.31 s21 of 103 within tolerance, median error 29.0%22 of 103 within tolerance, median error 26.9%
Dry oxygen until the first point read (0.8 nm): duration (Si_1080)Not stated; 22 min assumed, 1 s to 2 h searched1 to 7200 s340.479 s1 s21 of 103 within tolerance, median error 29.0%22 of 103 within tolerance, median error 26.9%
Dry oxygen until the first point read (1.1 nm): duration (Si_1100)Not stated; 22 min assumed, 1 s to 2 h searched1 to 7200 s278.856 s84.85 s21 of 103 within tolerance, median error 29.0%22 of 103 within tolerance, median error 26.2%
Dry oxygen until the first point read (1.4 nm): duration (Si_1200)Not stated; 22 min assumed, 1 s to 2 h searched1 to 7200 s255.687 s1 s21 of 103 within tolerance, median error 29.0%22 of 103 within tolerance, median error 26.9%

Together: ToFirstPoint duration 1 s (was 1348.04); ToFirstPoint duration 1 s (was 265.148); ToFirstPoint duration 1 s (was 149.871); ToFirstPoint duration 1 s (was 721.739); ToFirstPoint duration 372.9 s (was 885.321); ToFirstPoint duration 1 s (was 732.69); ToFirstPoint duration 1 s (was 580.05); ToFirstPoint duration 1 s (was 165.675); ToFirstPoint duration 1 s (was 604.544); ToFirstPoint duration 19.31 s (was 927.924); ToFirstPoint duration 1 s (was 340.479); ToFirstPoint duration 84.85 s (was 278.856); ToFirstPoint duration 1 s (was 255.687).

As reproduced: 21 of 103 within tolerance, median error 29.0%. Aligned: 37 of 103 within tolerance, median error 17.7%.

What was searched. The chapter gives no times. Each run's thickness against time was rebuilt by integrating 1/rate over the points read, so the only unknown is when the first point was reached: the time in dry oxygen before it, one unknown per run (13), from 1 s to 2 h, starting from the first thickness over the first rate. Each unknown moves only its own run. There are no held-out runs: the unknowns are chosen on the numbers they are scored on, so the aligned score is an upper bound.

The data want no time before the first point, and that is not enough. Ten of 13 unknowns go to the 1 s minimum; the C face at 1050 °C keeps 6 min (assumed 15), the Si face at 1050 °C 19 s and at 1100 °C 85 s. With Song's constants the program reaches each run's first measured thickness sooner than any time zero allows: it grows thin oxide too fast. As reproduced: 21 of 103 within 10%, median error 29.0%; aligned: 37 of 103, median 17.7%. Inside the program's 950 to 1150 °C: 16 of 72 (median 22.4%) as reproduced, 30 of 72 (12.6%) aligned; outside it (890, 930, 1220 °C C face, 1200 °C Si face): 5 of 31, then 7 of 31.

Where it stays wrong. Inside the range, points of 50 nm and above: 15 of 27 within, median error 9.8%, median signed +1.7%. Points below 20 nm: 5 of 29 within, median 34%, signed +24%. The C face at 1050 °C is the best run (7 of 8) and 1150 °C the worst (0 of 8, +10 to +24% from 20 nm on). On the Si face the error changes sign along each run: at 1100 °C +17 to +34% in the first 15 nm, −14% at 41 nm. Song's Si-face constants put the change from linear to parabolic growth at A = 5.8 nm (1100 °C), so the program slows to 1.9 nm/h at 40 nm while the measured rate stays at 4.0 nm/h from 10 to 40 nm (Figure 5; Hijikata: reaction-limited “up to several μm”). On the C face A is 80 nm at 1090 °C.

The rate itself (table under “What the reproduction shows”): below 10 nm the program's rate is 1.5 to 2.7 times the measured one on both faces inside the range, and 2.3 to 3.1 times at 1200 to 1220 °C. Above 100 nm on the C face the ratio rises with temperature, 0.55 at 930 °C to 1.14 at 1150 °C and 1.67 at 1220 °C: Song's parabolic activation energy (1.98 eV) is steeper than these data.

With heating and cooling transitions no number moves by more than 2% in any of the four scenarios: the added heat-up is in nitrogen, where the growth program grows nothing, and the cooling comes after the last point, which in situ data do not see. There is no hydrogen step, so no Quantum ESPRESSO comparison.

✓37 within tolerance≈22 within twice the tolerance✕44 outside
simulation below the paper ← 0 → simulation above the paper-100%-50%0%+50%+100%C face (000-1), 890 °C, 1.3742 hoxide thicknessours 16 · paper 11.6 nm✕ outside (+38%)C face (000-1), 890 °C, 2.3322 hoxide thicknessours 23.1 · paper 17.1 nm✕ outside (+35%)C face (000-1), 890 °C, 3.6514 hoxide thicknessours 31 · paper 23.6 nm✕ outside (+32%)C face (000-1), 890 °C, 5.798 hoxide thicknessours 41.4 · paper 33.2 nm✕ outside (+25%)C face (000-1), 890 °C, 9.4538 hoxide thicknessours 55.6 · paper 49.4 nm≈ within twice the tolerance (+13%)C face (000-1), 890 °C, 13.2949 hoxide thicknessours 67.8 · paper 65.5 nm✓ within tolerance (+3.6%)C face (000-1), 890 °C, 17.3431 hoxide thicknessours 79 · paper 78.4 nm✓ within tolerance (+0.8%)C face (000-1), 930 °C, 0.658 hoxide thicknessours 13.3 · paper 9.03 nm✕ outside (+47%)C face (000-1), 930 °C, 1.7203 hoxide thicknessours 26.7 · paper 20.3 nm✕ outside (+31%)C face (000-1), 930 °C, 2.4589 hoxide thicknessours 34 · paper 26.8 nm✕ outside (+27%)C face (000-1), 930 °C, 3.4448 hoxide thicknessours 42.2 · paper 34.5 nm✕ outside (+22%)C face (000-1), 930 °C, 5.2429 hoxide thicknessours 54.9 · paper 48.7 nm≈ within twice the tolerance (+13%)C face (000-1), 930 °C, 6.8823 hoxide thicknessours 64.7 · paper 64.2 nm✓ within tolerance (+0.9%)C face (000-1), 930 °C, 8.3892 hoxide thicknessours 72.8 · paper 77.7 nm✓ within tolerance (-6.3%)C face (000-1), 930 °C, 12.4228 hoxide thicknessours 91.5 · paper 107 nm≈ within twice the tolerance (-15%)C face (000-1), 970 °C, 0.1197 hoxide thicknessours 4.58 · paper 3.55 nm✕ outside (+29%)C face (000-1), 970 °C, 0.5582 hoxide thicknessours 16.4 · paper 12.3 nm✕ outside (+34%)C face (000-1), 970 °C, 1.1104 hoxide thicknessours 27.4 · paper 22.3 nm✕ outside (+23%)C face (000-1), 970 °C, 1.7387 hoxide thicknessours 37.4 · paper 31.6 nm≈ within twice the tolerance (+18%)C face (000-1), 970 °C, 2.6686 hoxide thicknessours 49.6 · paper 45.2 nm✓ within tolerance (+9.8%)C face (000-1), 970 °C, 3.3375 hoxide thicknessours 57.2 · paper 55.2 nm✓ within tolerance (+3.7%)C face (000-1), 970 °C, 4.7239 hoxide thicknessours 71 · paper 72.9 nm✓ within tolerance (-2.6%)C face (000-1), 970 °C, 8.1151 hoxide thicknessours 98.2 · paper 106 nm✓ within tolerance (-7.8%)C face (000-1), 1000 °C, 0.0333 hoxide thicknessours 1.9 · paper 6.77 nm✕ outside (-72%)C face (000-1), 1000 °C, 0.4071 hoxide thicknessours 16.3 · paper 16.4 nm✓ within tolerance (-0.7%)C face (000-1), 1000 °C, 0.8921 hoxide thicknessours 29.6 · paper 27.1 nm✓ within tolerance (+9.3%)C face (000-1), 1000 °C, 1.2005 hoxide thicknessours 36.6 · paper 33.2 nm≈ within twice the tolerance (+10%)C face (000-1), 1000 °C, 1.6504 hoxide thicknessours 45.5 · paper 42.3 nm✓ within tolerance (+7.7%)C face (000-1), 1000 °C, 2.3865 hoxide thicknessours 58.1 · paper 57.1 nm✓ within tolerance (+1.7%)C face (000-1), 1000 °C, 4.7707 hoxide thicknessours 89.6 · paper 99.7 nm≈ within twice the tolerance (-10%)C face (000-1), 1000 °C, 5.6929 hoxide thicknessours 99.7 · paper 114 nm≈ within twice the tolerance (-13%)C face (000-1), 1050 °C, 0.0803 hoxide thicknessours 12.4 · paper 15.5 nm≈ within twice the tolerance (-20%)C face (000-1), 1050 °C, 0.3217 hoxide thicknessours 24.6 · paper 25.5 nm✓ within tolerance (-3.3%)C face (000-1), 1050 °C, 0.6346 hoxide thicknessours 37.4 · paper 36.5 nm✓ within tolerance (+2.5%)C face (000-1), 1050 °C, 0.9659 hoxide thicknessours 48.7 · paper 48.1 nm✓ within tolerance (+1.3%)C face (000-1), 1050 °C, 1.3163 hoxide thicknessours 59.1 · paper 59 nm✓ within tolerance (+0.2%)C face (000-1), 1050 °C, 2.5055 hoxide thicknessours 88.1 · paper 92.3 nm✓ within tolerance (-4.5%)C face (000-1), 1050 °C, 3.6243 hoxide thicknessours 110 · paper 117 nm✓ within tolerance (-6.3%)C face (000-1), 1050 °C, 4.1128 hoxide thicknessours 119 · paper 127 nm✓ within tolerance (-6.9%)C face (000-1), 1090 °C, 0.09 hoxide thicknessours 8.92 · paper 15.8 nm✕ outside (-44%)C face (000-1), 1090 °C, 0.5479 hoxide thicknessours 39.6 · paper 36.1 nm✓ within tolerance (+9.6%)C face (000-1), 1090 °C, 1.0565 hoxide thicknessours 63.5 · paper 56.8 nm≈ within twice the tolerance (+12%)C face (000-1), 1090 °C, 1.3896 hoxide thicknessours 76.5 · paper 69.7 nm✓ within tolerance (+9.8%)C face (000-1), 1090 °C, 1.691 hoxide thicknessours 87.2 · paper 79.3 nm✓ within tolerance (+9.9%)C face (000-1), 1090 °C, 2.4997 hoxide thicknessours 112 · paper 106 nm✓ within tolerance (+5.6%)C face (000-1), 1090 °C, 3.7531 hoxide thicknessours 144 · paper 142 nm✓ within tolerance (+1.6%)C face (000-1), 1090 °C, 4.7437 hoxide thicknessours 166 · paper 168 nm✓ within tolerance (-1.2%)C face (000-1), 1150 °C, 0.0551 hoxide thicknessours 8.61 · paper 16.4 nm✕ outside (-48%)C face (000-1), 1150 °C, 0.4309 hoxide thicknessours 48.8 · paper 40.3 nm✕ outside (+21%)C face (000-1), 1150 °C, 0.9206 hoxide thicknessours 84.6 · paper 68.4 nm✕ outside (+24%)C face (000-1), 1150 °C, 1.3887 hoxide thicknessours 112 · paper 92.9 nm✕ outside (+20%)C face (000-1), 1150 °C, 2.053 hoxide thicknessours 144 · paper 120 nm≈ within twice the tolerance (+20%)C face (000-1), 1150 °C, 2.5702 hoxide thicknessours 166 · paper 141 nm≈ within twice the tolerance (+18%)C face (000-1), 1150 °C, 3.7828 hoxide thicknessours 210 · paper 188 nm≈ within twice the tolerance (+12%)C face (000-1), 1150 °C, 4.8068 hoxide thicknessours 242 · paper 220 nm≈ within twice the tolerance (+10%)C face (000-1), 1220 °C, 0.029 hoxide thicknessours 7.38 · paper 7.74 nm✓ within tolerance (-4.6%)C face (000-1), 1220 °C, 0.1827 hoxide thicknessours 37.7 · paper 21.3 nm✕ outside (+77%)C face (000-1), 1220 °C, 0.3426 hoxide thicknessours 62.1 · paper 34.5 nm✕ outside (+80%)C face (000-1), 1220 °C, 0.5916 hoxide thicknessours 93.2 · paper 53.9 nm✕ outside (+73%)C face (000-1), 1220 °C, 0.7609 hoxide thicknessours 111 · paper 66.1 nm✕ outside (+68%)C face (000-1), 1220 °C, 1.0129 hoxide thicknessours 135 · paper 83.2 nm✕ outside (+63%)C face (000-1), 1220 °C, 1.1721 hoxide thicknessours 149 · paper 93.5 nm✕ outside (+59%)C face (000-1), 1220 °C, 1.4107 hoxide thicknessours 169 · paper 109 nm✕ outside (+55%)C face (000-1), 1090 °C (Figure 3), 0.0582 hoxide thicknessours 6.04 · paper 12 nm✕ outside (-50%)C face (000-1), 1090 °C (Figure 3), 0.3286 hoxide thicknessours 26.7 · paper 24.5 nm✓ within tolerance (+9.0%)C face (000-1), 1090 °C (Figure 3), 0.9567 hoxide thicknessours 59.3 · paper 49.7 nm≈ within twice the tolerance (+19%)C face (000-1), 1090 °C (Figure 3), 1.7132 hoxide thicknessours 87.9 · paper 78.1 nm≈ within twice the tolerance (+13%)C face (000-1), 1090 °C (Figure 3), 2.8941 hoxide thicknessours 123 · paper 118 nm✓ within tolerance (+4.5%)C face (000-1), 1090 °C (Figure 3), 5.1905 hoxide thicknessours 175 · paper 182 nm✓ within tolerance (-3.6%)C face (000-1), 1090 °C (Figure 3), 14.0899 hoxide thicknessours 311 · paper 359 nm≈ within twice the tolerance (-14%)C face (000-1), 1090 °C (Figure 3), 20.4145 hoxide thicknessours 381 · paper 441 nm≈ within twice the tolerance (-14%)Si face (0001), 1050 °C, 0.0791 hoxide thicknessours 1.27 · paper 1.39 nm✓ within tolerance (-8.9%)Si face (0001), 1050 °C, 0.399 hoxide thicknessours 3.62 · paper 2.32 nm✕ outside (+56%)Si face (0001), 1050 °C, 0.8717 hoxide thicknessours 5.85 · paper 3.61 nm✕ outside (+62%)Si face (0001), 1050 °C, 1.7079 hoxide thicknessours 8.68 · paper 5.9 nm✕ outside (+47%)Si face (0001), 1050 °C, 2.3256 hoxide thicknessours 10.3 · paper 7.35 nm✕ outside (+41%)Si face (0001), 1050 °C, 3.6514 hoxide thicknessours 13.3 · paper 10.3 nm✕ outside (+29%)Si face (0001), 1050 °C, 5.1566 hoxide thicknessours 16.1 · paper 13.5 nm≈ within twice the tolerance (+19%)Si face (0001), 1050 °C, 7.692 hoxide thicknessours 20 · paper 19.1 nm✓ within tolerance (+4.4%)Si face (0001), 1080 °C, 0.0367 hoxide thicknessours 0.91 · paper 1.01 nm✓ within tolerance (-9.9%)Si face (0001), 1080 °C, 0.1879 hoxide thicknessours 2.89 · paper 1.76 nm✕ outside (+64%)Si face (0001), 1080 °C, 0.4978 hoxide thicknessours 5.51 · paper 3.1 nm✕ outside (+78%)Si face (0001), 1080 °C, 0.8107 hoxide thicknessours 7.47 · paper 4.3 nm✕ outside (+74%)Si face (0001), 1080 °C, 1.4163 hoxide thicknessours 10.4 · paper 6.56 nm✕ outside (+59%)Si face (0001), 1080 °C, 2.4272 hoxide thicknessours 14.3 · paper 9.87 nm✕ outside (+44%)Si face (0001), 1080 °C, 5.0161 hoxide thicknessours 21.4 · paper 17.9 nm≈ within twice the tolerance (+19%)Si face (0001), 1080 °C, 8.8178 hoxide thicknessours 29 · paper 30.3 nm✓ within tolerance (-4.2%)Si face (0001), 1100 °C, 0.0373 hoxide thicknessours 1.52 · paper 1.61 nm✓ within tolerance (-5.3%)Si face (0001), 1100 °C, 0.1606 hoxide thicknessours 3.4 · paper 2.91 nm≈ within twice the tolerance (+17%)Si face (0001), 1100 °C, 0.4081 hoxide thicknessours 6.05 · paper 4.73 nm✕ outside (+28%)Si face (0001), 1100 °C, 0.7327 hoxide thicknessours 8.64 · paper 6.44 nm✕ outside (+34%)Si face (0001), 1100 °C, 1.5643 hoxide thicknessours 13.5 · paper 10.8 nm✕ outside (+24%)Si face (0001), 1100 °C, 2.5032 hoxide thicknessours 17.6 · paper 14.9 nm≈ within twice the tolerance (+19%)Si face (0001), 1100 °C, 4.9848 hoxide thicknessours 25.9 · paper 25.4 nm✓ within tolerance (+1.9%)Si face (0001), 1100 °C, 8.7575 hoxide thicknessours 35.1 · paper 40.7 nm≈ within twice the tolerance (-14%)Si face (0001), 1200 °C, 0.0361 hoxide thicknessours 2.17 · paper 2.06 nm✓ within tolerance (+5.2%)Si face (0001), 1200 °C, 0.2112 hoxide thicknessours 8.62 · paper 4.73 nm✕ outside (+82%)Si face (0001), 1200 °C, 0.4878 hoxide thicknessours 15.4 · paper 7.78 nm✕ outside (+98%)Si face (0001), 1200 °C, 0.8428 hoxide thicknessours 21.9 · paper 11.2 nm✕ outside (+96%)Si face (0001), 1200 °C, 1.2414 hoxide thicknessours 27.9 · paper 14.9 nm✕ outside (+88%)Si face (0001), 1200 °C, 2.3318 hoxide thicknessours 40.5 · paper 23.8 nm✕ outside (+70%)Si face (0001), 1200 °C, 5.2029 hoxide thicknessours 63.8 · paper 47.6 nm✕ outside (+34%)Si face (0001), 1200 °C, 9.3639 hoxide thicknessours 88 · paper 81.3 nm✓ within tolerance (+8.3%)
The pale green band is the tolerance. Bars past ±100% are cut and carry their value.

37 within, 22 near, 44 off of 103 numbers with the aligned settings.

SampleQuantityThe paperAs reproduced aboveAlignedDifferenceVerdictHow
C face (000-1), 890 °C, 1.3742 hoxide thickness11.6 nm1916+38%off (±10%)chosen on these numbers
C face (000-1), 890 °C, 2.3322 hoxide thickness17.1 nm25.523.1+35%off (±10%)chosen on these numbers
C face (000-1), 890 °C, 3.6514 hoxide thickness23.6 nm3331+32%off (±10%)chosen on these numbers
C face (000-1), 890 °C, 5.798 hoxide thickness33.2 nm43.141.4+25%off (±10%)chosen on these numbers
C face (000-1), 890 °C, 9.4538 hoxide thickness49.4 nm56.955.6+13%near (±10%)chosen on these numbers
C face (000-1), 890 °C, 13.2949 hoxide thickness65.5 nm68.967.8+4%within (±10%)chosen on these numbers
C face (000-1), 890 °C, 17.3431 hoxide thickness78.4 nm8079+1%within (±10%)chosen on these numbers
C face (000-1), 930 °C, 0.658 hoxide thickness9.03 nm14.413.3+47%off (±10%)chosen on these numbers
C face (000-1), 930 °C, 1.7203 hoxide thickness20.3 nm27.526.7+31%off (±10%)chosen on these numbers
C face (000-1), 930 °C, 2.4589 hoxide thickness26.8 nm34.634+27%off (±10%)chosen on these numbers
C face (000-1), 930 °C, 3.4448 hoxide thickness34.5 nm42.842.2+22%off (±10%)chosen on these numbers
C face (000-1), 930 °C, 5.2429 hoxide thickness48.7 nm55.454.9+13%near (±10%)chosen on these numbers
C face (000-1), 930 °C, 6.8823 hoxide thickness64.2 nm65.264.7+1%within (±10%)chosen on these numbers
C face (000-1), 930 °C, 8.3892 hoxide thickness77.7 nm73.272.8-6%within (±10%)chosen on these numbers
C face (000-1), 930 °C, 12.4228 hoxide thickness107 nm91.891.5-15%near (±10%)chosen on these numbers
C face (000-1), 970 °C, 0.1197 hoxide thickness3.55 nm5.934.58+29%off (±10%)chosen on these numbers
C face (000-1), 970 °C, 0.5582 hoxide thickness12.3 nm17.416.4+34%off (±10%)chosen on these numbers
C face (000-1), 970 °C, 1.1104 hoxide thickness22.3 nm28.127.4+23%off (±10%)chosen on these numbers
C face (000-1), 970 °C, 1.7387 hoxide thickness31.6 nm3837.4+18%near (±10%)chosen on these numbers
C face (000-1), 970 °C, 2.6686 hoxide thickness45.2 nm50.149.6+10%within (±10%)chosen on these numbers
C face (000-1), 970 °C, 3.3375 hoxide thickness55.2 nm57.657.2+4%within (±10%)chosen on these numbers
C face (000-1), 970 °C, 4.7239 hoxide thickness72.9 nm71.471-3%within (±10%)chosen on these numbers
C face (000-1), 970 °C, 8.1151 hoxide thickness106 nm98.598.2-8%within (±10%)chosen on these numbers
C face (000-1), 1000 °C, 0.0333 hoxide thickness6.77 nm10.41.9-72%off (±10%)chosen on these numbers
C face (000-1), 1000 °C, 0.4071 hoxide thickness16.4 nm22.316.3-1%within (±10%)chosen on these numbers
C face (000-1), 1000 °C, 0.8921 hoxide thickness27.1 nm34.229.6+9%within (±10%)chosen on these numbers
C face (000-1), 1000 °C, 1.2005 hoxide thickness33.2 nm40.736.6+10%near (±10%)chosen on these numbers
C face (000-1), 1000 °C, 1.6504 hoxide thickness42.3 nm49.145.5+8%within (±10%)chosen on these numbers
C face (000-1), 1000 °C, 2.3865 hoxide thickness57.1 nm61.258.1+2%within (±10%)chosen on these numbers
C face (000-1), 1000 °C, 4.7707 hoxide thickness99.7 nm91.989.6-10%near (±10%)chosen on these numbers
C face (000-1), 1000 °C, 5.6929 hoxide thickness114 nm10299.7-13%near (±10%)chosen on these numbers
C face (000-1), 1050 °C, 0.0803 hoxide thickness15.5 nm2012.4-20%near (±10%)chosen on these numbers
C face (000-1), 1050 °C, 0.3217 hoxide thickness25.5 nm30.724.6-3%within (±10%)chosen on these numbers
C face (000-1), 1050 °C, 0.6346 hoxide thickness36.5 nm42.437.4+2%within (±10%)chosen on these numbers
C face (000-1), 1050 °C, 0.9659 hoxide thickness48.1 nm53.148.7+1%within (±10%)chosen on these numbers
C face (000-1), 1050 °C, 1.3163 hoxide thickness59 nm63.159.1+0%within (±10%)chosen on these numbers
C face (000-1), 1050 °C, 2.5055 hoxide thickness92.3 nm91.188.1-5%within (±10%)chosen on these numbers
C face (000-1), 1050 °C, 3.6243 hoxide thickness117 nm113110-6%within (±10%)chosen on these numbers
C face (000-1), 1050 °C, 4.1128 hoxide thickness127 nm121119-7%within (±10%)chosen on these numbers
C face (000-1), 1090 °C, 0.09 hoxide thickness15.8 nm24.48.92-44%off (±10%)chosen on these numbers
C face (000-1), 1090 °C, 0.5479 hoxide thickness36.1 nm49.939.6+10%within (±10%)chosen on these numbers
C face (000-1), 1090 °C, 1.0565 hoxide thickness56.8 nm71.663.5+12%near (±10%)chosen on these numbers
C face (000-1), 1090 °C, 1.3896 hoxide thickness69.7 nm83.876.5+10%within (±10%)chosen on these numbers
C face (000-1), 1090 °C, 1.691 hoxide thickness79.3 nm93.987.2+10%within (±10%)chosen on these numbers
C face (000-1), 1090 °C, 2.4997 hoxide thickness106 nm118112+6%within (±10%)chosen on these numbers
C face (000-1), 1090 °C, 3.7531 hoxide thickness142 nm149144+2%within (±10%)chosen on these numbers
C face (000-1), 1090 °C, 4.7437 hoxide thickness168 nm170166-1%within (±10%)chosen on these numbers
C face (000-1), 1150 °C, 0.0551 hoxide thickness16.4 nm28.38.61-48%off (±10%)chosen on these numbers
C face (000-1), 1150 °C, 0.4309 hoxide thickness40.3 nm61.848.8+21%off (±10%)chosen on these numbers
C face (000-1), 1150 °C, 0.9206 hoxide thickness68.4 nm94.484.6+24%off (±10%)chosen on these numbers
C face (000-1), 1150 °C, 1.3887 hoxide thickness92.9 nm120112+20%off (±10%)chosen on these numbers
C face (000-1), 1150 °C, 2.053 hoxide thickness120 nm151144+20%near (±10%)chosen on these numbers
C face (000-1), 1150 °C, 2.5702 hoxide thickness141 nm172166+18%near (±10%)chosen on these numbers
C face (000-1), 1150 °C, 3.7828 hoxide thickness188 nm215210+12%near (±10%)chosen on these numbers
C face (000-1), 1150 °C, 4.8068 hoxide thickness220 nm247242+10%near (±10%)chosen on these numbers
C face (000-1), 1220 °C, 0.029 hoxide thickness7.74 nm17.57.38-5%within (±10%)chosen on these numbers
C face (000-1), 1220 °C, 0.1827 hoxide thickness21.3 nm45.237.7+77%off (±10%)chosen on these numbers
C face (000-1), 1220 °C, 0.3426 hoxide thickness34.5 nm68.362.1+80%off (±10%)chosen on these numbers
C face (000-1), 1220 °C, 0.5916 hoxide thickness53.9 nm98.293.2+73%off (±10%)chosen on these numbers
C face (000-1), 1220 °C, 0.7609 hoxide thickness66.1 nm116111+68%off (±10%)chosen on these numbers
C face (000-1), 1220 °C, 1.0129 hoxide thickness83.2 nm140135+63%off (±10%)chosen on these numbers
C face (000-1), 1220 °C, 1.1721 hoxide thickness93.5 nm153149+59%off (±10%)chosen on these numbers
C face (000-1), 1220 °C, 1.4107 hoxide thickness109 nm172168+55%off (±10%)chosen on these numbers
C face (000-1), 1090 °C (Figure 3), 0.0582 hoxide thickness12 nm19.76.04-50%off (±10%)chosen on these numbers
C face (000-1), 1090 °C (Figure 3), 0.3286 hoxide thickness24.5 nm36.726.7+9%within (±10%)chosen on these numbers
C face (000-1), 1090 °C (Figure 3), 0.9567 hoxide thickness49.7 nm66.359.3+19%near (±10%)chosen on these numbers
C face (000-1), 1090 °C (Figure 3), 1.7132 hoxide thickness78.1 nm93.487.9+13%near (±10%)chosen on these numbers
C face (000-1), 1090 °C (Figure 3), 2.8941 hoxide thickness118 nm127123+5%within (±10%)chosen on these numbers
C face (000-1), 1090 °C (Figure 3), 5.1905 hoxide thickness182 nm178175-4%within (±10%)chosen on these numbers
C face (000-1), 1090 °C (Figure 3), 14.0899 hoxide thickness359 nm313310-14%near (±10%)chosen on these numbers
C face (000-1), 1090 °C (Figure 3), 20.4145 hoxide thickness441 nm383381-14%near (±10%)chosen on these numbers
Si face (0001), 1050 °C, 0.0791 hoxide thickness1.39 nm3.221.27-9%within (±10%)chosen on these numbers
Si face (0001), 1050 °C, 0.399 hoxide thickness2.32 nm4.913.62+56%off (±10%)chosen on these numbers
Si face (0001), 1050 °C, 0.8717 hoxide thickness3.61 nm6.85.85+62%off (±10%)chosen on these numbers
Si face (0001), 1050 °C, 1.7079 hoxide thickness5.9 nm9.398.68+47%off (±10%)chosen on these numbers
Si face (0001), 1050 °C, 2.3256 hoxide thickness7.35 nm1110.3+41%off (±10%)chosen on these numbers
Si face (0001), 1050 °C, 3.6514 hoxide thickness10.3 nm13.813.3+29%off (±10%)chosen on these numbers
Si face (0001), 1050 °C, 5.1566 hoxide thickness13.5 nm16.516.1+19%near (±10%)chosen on these numbers
Si face (0001), 1050 °C, 7.692 hoxide thickness19.1 nm20.320+4%within (±10%)chosen on these numbers
Si face (0001), 1080 °C, 0.0367 hoxide thickness1.01 nm2.250.91-10%within (±10%)chosen on these numbers
Si face (0001), 1080 °C, 0.1879 hoxide thickness1.76 nm3.812.89+64%off (±10%)chosen on these numbers
Si face (0001), 1080 °C, 0.4978 hoxide thickness3.1 nm6.155.51+78%off (±10%)chosen on these numbers
Si face (0001), 1080 °C, 0.8107 hoxide thickness4.3 nm7.997.47+74%off (±10%)chosen on these numbers
Si face (0001), 1080 °C, 1.4163 hoxide thickness6.56 nm10.810.4+59%off (±10%)chosen on these numbers
Si face (0001), 1080 °C, 2.4272 hoxide thickness9.87 nm14.614.2+44%off (±10%)chosen on these numbers
Si face (0001), 1080 °C, 5.0161 hoxide thickness17.9 nm21.621.4+19%near (±10%)chosen on these numbers
Si face (0001), 1080 °C, 8.8178 hoxide thickness30.3 nm29.229-4%within (±10%)chosen on these numbers
Si face (0001), 1100 °C, 0.0373 hoxide thickness1.61 nm2.431.52-5%within (±10%)chosen on these numbers
Si face (0001), 1100 °C, 0.1606 hoxide thickness2.91 nm4.073.4+17%near (±10%)chosen on these numbers
Si face (0001), 1100 °C, 0.4081 hoxide thickness4.73 nm6.536.05+28%off (±10%)chosen on these numbers
Si face (0001), 1100 °C, 0.7327 hoxide thickness6.44 nm9.028.64+34%off (±10%)chosen on these numbers
Si face (0001), 1100 °C, 1.5643 hoxide thickness10.8 nm13.813.5+24%off (±10%)chosen on these numbers
Si face (0001), 1100 °C, 2.5032 hoxide thickness14.9 nm17.917.6+19%near (±10%)chosen on these numbers
Si face (0001), 1100 °C, 4.9848 hoxide thickness25.4 nm2625.9+2%within (±10%)chosen on these numbers
Si face (0001), 1100 °C, 8.7575 hoxide thickness40.7 nm35.235.1-14%near (±10%)chosen on these numbers
Si face (0001), 1200 °C, 0.0361 hoxide thickness2.06 nm5.172.17+5%within (±10%)chosen on these numbers
Si face (0001), 1200 °C, 0.2112 hoxide thickness4.73 nm10.68.62+82%off (±10%)chosen on these numbers
Si face (0001), 1200 °C, 0.4878 hoxide thickness7.78 nm16.915.4+98%off (±10%)chosen on these numbers
Si face (0001), 1200 °C, 0.8428 hoxide thickness11.2 nm23.121.9+96%off (±10%)chosen on these numbers
Si face (0001), 1200 °C, 1.2414 hoxide thickness14.9 nm28.827.9+88%off (±10%)chosen on these numbers
Si face (0001), 1200 °C, 2.3318 hoxide thickness23.8 nm41.240.5+70%off (±10%)chosen on these numbers
Si face (0001), 1200 °C, 5.2029 hoxide thickness47.6 nm64.363.8+34%off (±10%)chosen on these numbers
Si face (0001), 1200 °C, 9.3639 hoxide thickness81.2 nm88.488+8%within (±10%)chosen on these numbers

No time zero fixes the thin regime: the program's linear rate B/A (Song's, from ex-situ points at 0.25 h and later) is the program's rate at zero thickness, and it is 1.5 to 2.7 times what was measured in situ at 1 to 10 nm. This is the opposite of the chapter's own finding against its own Deal-Grove fit (rates above D-G below 20 nm): the two laboratories' B/A differ by about a factor of 2 on the C face (Song 108 nm/h at 1090 °C; Hijikata's solid line in Figure 1 starts near 50). Alignment cannot touch B/A or B: they are sourced constants.

The Si face needs a different B, not a different history: with Song's B the program cannot grow at a constant 4 nm/h from 10 to 40 nm at 1100 °C. Song's Si-face activation energy for B (3.12 eV) rests on three temperatures.

Two-stage deceleration (break at 7 nm, initial rate independent of oxygen pressure, Figures 7 and 8) needs a program with a second growth channel; the Si and C emission model the chapter describes is one, and the language can write it (below).

What our language and ontology cannot yet say

  • A rate observable, measured at a thickness, not at a time. The chapter's data are dX/dt against X. The language observes states at the end of a history, so the rate had to be integrated to thickness against a reconstructed time with an unknown time zero. An observation of a state's time derivative (EQUATION: Growth_rate = d(x_ox)/dt) and a result indexed by a state (MEASURE Growth_rate AT Thickness = 1.0e-6) would compare the rates directly and need no time zero; it would also have answered “is the initial rate enhanced?” in one row.
  • A measurement during a RUN (MEASURE <observable> DURING <run> EVERY <s> or in situ), so an in-situ ellipsometry run is one history with many measured points instead of a curve sampled by re-running the history to each time.
  • Clock reference (as for Song 2004): TIME_ZERO at_gas_on | at_first_point, so an in-situ run's time axis can be stated rather than searched.
  • Predictor: a thin-oxide channel in the SiC growth program, with its own pressure law. The Si and C emission model is writable today: FIELDs for Si and C interstitials and oxygen in the oxide on a grid travelling with the interface, FLUX with D_Si, D_C, D_O, BOUNDARY fluxes ν_Si k C_O, ν_C k C_O and (2 − ν_Si − ν_C − α/2) k C_O at the interface (Eq. 10), an OxideGrowth rate k0 (1 − left(C_Si)/C_Si⁰)(1 − left(C_C)/C_C⁰) C_O / N0 (Eq. 8). Table 1 gives the oxide-side constants; ν_Si, ν_C and k0 per face and temperature exist only as points on Figure 6, so they would be graph reads. Its grid would need to follow the growing oxide (no grid of varying length today).
  • Predictor: the program scales its whole rate by p_O2. Hijikata's initial rate R_r is nearly independent of pressure while R_g is proportional (Figure 8). Any SiC program used for low-pressure or ramp-in-diluted-oxygen histories needs the two separated.

With heating and cooling transitions

No paper we hold states how its wafers heated up or cooled down. The project owner specified scenarios for one Vitkavage wafer (isl_harness/vitkavage_transitions.py); isl_harness/thermal_transitions.py applies the same numbers to every sample here: a heat-up in nitrogen before the first furnace step (a hot push of 1 to 5 min, or a cold-furnace ramp of 60 to 120 min), the owner's radiative cooling knots after the last furnace step or after the paper's own pull (fast, or every time multiplied by 5), and ramps around an anneal at 300 to 500 °C. The paper's own steps are kept as written. All transitions are assumptions, written in the history with TIMING assumed.

HistoryWithin toleranceMedian errorChanged numbers
as the paper states it (above)21 of 10329.0%
heat-up A (hot push), fast cooling21 of 10329.0%0 of 103 moved by more than 2%
heat-up A (hot push), slow cooling21 of 10329.0%0 of 103 moved by more than 2%
heat-up B (cold-furnace ramp), fast cooling21 of 10329.0%0 of 103 moved by more than 2%
heat-up B (cold-furnace ramp), slow cooling21 of 10329.0%0 of 103 moved by more than 2%

The paper's own conclusions

The paper statesWhat we find
Below about 20 nm the growth rate is higher than a Deal-Grove law fitted to the thick part (Figures 1, 3)Against Song's constants the opposite: the program's rate below 10 nm is 1.5 to 2.4 times the measured one on both faces (rate table below)differs
The Si face stays reaction-limited (constant rate) to several µm (Figure 5)With Song's Si-face B the program turns parabolic at a few nm: at 30 to 40 nm it grows at 0.6 of the measured rate at 1080 and 1100 °Cdiffers
C face about 8 times faster than Si face at several 10 nm near 1100 °CProgram (1090 °C C face, 1100 °C Si face): 108 against 28 nm/h at zero thickness, 54 against 1.9 nm/h at 40 nm, a ratio of 28; measured about 40 against 4.0 nm/h, a ratio of 10direction right
Growth rate at thin oxide falls in two stages; the break (X_c) is at about 7 nm for every pressure and faceOne linear-parabolic law has no second stagenot modelled
R_g (gentle stage) is proportional to p_O2, R_r (initial) is notThe program multiplies its whole rate by p_O2partly

What the reproduction shows

Growth rate against thickness, measured (in situ, read from Figures 1 and 5) and the SiC growth program's (Song's constants, dX/dt = B/(A + 2X) at the measured thickness; checked against finite differences of the predictor's thickness). Each cell: median measured rate / program rate in nm/h, and their ratio, over the points read in that thickness band.

Run0–5 nm5–10 nm10–20 nm20–50 nm50–100 nm100–500 nm
C 890 °C (outside)6.89 / 15.8 (2.29)5.78 / 8.83 (1.53)4.46 / 5.18 (1.16)3.34 / 2.8 (0.84)
C 930 °C (outside)13.2 / 26.6 (2.02)11.4 / 18.1 (1.58)11.3 / 15.2 (1.34)8.61 / 10.1 (1.17)9.17 / 5.39 (0.59)6.79 / 3.75 (0.55)
C 970 °C21.7 / 36.7 (1.69)19.9 / 30 (1.51)19.2 / 23.1 (1.20)15.3 / 15.5 (1.02)13.2 / 10.2 (0.77)8.87 / 6.75 (0.76)
C 1000 °C28.8 / 42.1 (1.46)25.1 / 33.5 (1.34)20.1 / 23.9 (1.19)18.8 / 14.8 (0.79)15.4 / 9.65 (0.63)
C 1050 °C48.2 / 56 (1.16)35.2 / 39.1 (1.11)29.8 / 27.1 (0.91)20.8 / 16.8 (0.81)
C 1090 °C (Figure 1)53.8 / 80.6 (1.50)40.9 / 54.1 (1.32)35.3 / 38.2 (1.08)27.9 / 24.7 (0.89)
C 1090 °C (Figure 3)52.8 / 88 (1.67)50.8 / 77.8 (1.53)40.1 / 56.7 (1.41)36 / 36.4 (1.01)22.2 / 14.2 (0.64)
C 1150 °C76.1 / 130 (1.70)62.2 / 104 (1.68)54.7 / 72 (1.32)38.4 / 43.6 (1.14)
C 1220 °C (outside)105 / 242 (2.30)95.2 / 233 (2.45)89.2 / 221 (2.48)81.4 / 175 (2.15)65.2 / 125 (1.91)62.7 / 105 (1.67)
Si 1050 °C2.89 / 7.58 (2.62)2.33 / 3.44 (1.48)2.2 / 1.98 (0.90)
Si 1080 °C4.35 / 11.7 (2.69)3.44 / 6 (1.74)3.12 / 3.43 (1.10)3.21 / 2 (0.62)
Si 1100 °C9.35 / 14.1 (1.51)5.11 / 8.75 (1.71)4.45 / 5.23 (1.18)4.05 / 2.43 (0.60)
Si 1200 °C (outside)15.5 / 44.6 (2.87)10.2 / 32 (3.14)9.1 / 22.1 (2.43)8.42 / 11.4 (1.36)7.73 / 6.04 (0.78)

The initial fast regime the chapter reports is fast relative to its own Deal-Grove fit. Relative to the program it is slow: on both faces, at every temperature, the program's rate below 10 nm is above the measured one. The program is closest between 20 and 100 nm on the C face at 970 to 1090 °C (ratios 0.77 to 1.32), the regime Song's ex-situ points covered.

What we would like Emily to check

  1. Is a growth rate read from in-situ ellipsometry at 1 to 5 nm on SiC trustworthy, given the 1.5 nm interface layer the same group reports?
  2. Song 2004 and Hijikata disagree on the Si face: Song's B makes growth parabolic at a few nm, Hijikata's rate is flat to 80 nm. Which would you trust for a 50 nm gate oxide at 1100 to 1400 °C?
  3. Should the growth program carry a thin-oxide term (Massoud-like, or the emission model) on SiC, or is Song's linear-parabolic law the reference for the challenge?