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Study reproduced ·

Reproducing Krzeminski et al. 2012: retarded oxidation of silicon nanowires

Krzeminski, Han and Larrieu 2012: the sample and the timing of its process history as the paper states them, our encoding beside them item by item, the simulation in ISL, and how far it lands from the paper's numbers (9 within, 4 near).

Richard Pedersen · Agentic Trust Labs · Rich Canvas

One of the [studies we reproduced](/writing/interface-studies-reproduced) for [Questions we need Emily to answer](/writing/questions-for-emily-testing-a-theory-of-the-interface), the companion to [the essay](/writing/testing-a-theory-of-the-interface-with-an-ontology). Generated by `scripts/reproduce_studies.py` from `reproductions/krzeminski_2012.py`. Every value from the paper was read by an AI agent and has not been checked by a person; the sample and history were re-read from the PDF alone by a second agent that had not seen our earlier transcription.

The study and why we depend on it

C. Krzeminski, X.-L. Han and G. Larrieu, “Understanding of the retarded oxidation effects in silicon nanostructures”, Appl. Phys. Lett. 100, 263111 (2012); arXiv 1203.2803 (the version read).

The second nanowire dataset, from the same laboratory (LAAS, Larrieu) eleven years before Müller 2023, and the one the radial program is tested on with nothing refitted. Figure 1(b) gives the oxide at mid-height on six wires and on nanobeams after 10 and 20 min of wet oxidation at 850 °C; Figure 1(a) gives two wires and two rings against time. Run unchanged, the predictor's radial program passes 4 of 12 wires (evaluations/krzeminski_transfer_report.json): it predicts too little slowdown on wires of 70 nm and below. scripts/search_nanowire.py then fitted the form of the curvature slowdown on Müller's five largest wires and this paper's six 10 min wires together and held out the 20 min wires; it chose a curvature length (exp(−ℓ/a), ℓ = 6.4 nm) over the viscous shell. The predictor still runs the shell with Müller's stress time, so on this page the 10 min wires are not fitted by the program that runs; they are the rows the alignment chooses its unknowns on.

How well can this study be reproduced?

Low. One sentence describes the process: etched structures “wet oxidized at 850°C” for 10 and 20 minutes. No furnace cycle, no steam source, no wafer orientation or doping, no clean, no statement of whether each time is a fresh sample. Every curve starts at about 5 nm at t = 0 without explanation. Its value is the nanobeams: a flat sidewall oxidized beside the wires in the same run, which gives the rate a nanowire program needs without knowing the furnace.

Sample described0 of 5 properties we need are stated and encoded the same
History described1 of 9 steps are stated and encoded the same; 1 are stated by the paper and absent from our history; 5 are ours because the paper is silent
Timing1 of 3 simulated steps have a stated duration; 5 of 5 other steps have none; 5 timing gaps listed below
How the results are givenFigure 1 only, no printed thicknesses (read from the vector drawing); the planar (110) line may be a model curve
Repeatability stated by the authorsNot stated; no error bars
Internal consistencyModerate. The two panels of Figure 1 agree where they overlap. The planar (110) line in Figure 1(b) (about 37 and 57 nm at 10 and 20 min) does not match the dashed curve in Figure 1(a); the model's printed rate constants are many orders of magnitude from the rates in its Figure 4
Is our model independent of this paper's data?Yes for the predictor as it stands: its stress time (142 s) was fitted on Müller's five largest wires only, and its rate is Müller's. A separate structure search (scripts/search_nanowire.py) fitted a curvature length jointly on Müller's large wires and this paper's six 10 min wires; that search's result is not what the predictor runs
Outcome9 of 13 numbers within tolerance

The grade is ours and is about the paper as a source for simulation, not about the quality of the experiment: high means the sample, every step and its timing are stated well enough that a simulation needs no choices of ours; moderate that some choices are ours and are listed; low that the result depends on choices the paper does not constrain.

The sample and its history, played back

The sample is drawn from the simulation: layer heights and the read-outs are what the ISL programs compute at each moment of the history. Steps the language cannot state (a clean, a metallization, a measurement) are on the clock and marked as recorded, not simulated.

as etched 90 nmSi core 90 nmSiO2 0 nm
Step 1 of 8 · recorded, not simulated
Top-down lithography and etch (details in Ref. 8)
temperature 25 °C
elapsed 0 s of 26 min 30 s
timing in the paper: not stated

“With the current top-down fabrication capabilities, etched silicon nanostructures including nanobeams, nanorings and nanowires have been fabricated with a high resolution [8]”

The simulation at this moment
oxide thickness0 nm21.6
remaining silicon diameter90 nm
consumed substrate (radius)0 nm
right column: the paper, at the end of the history
FabricateCleanLoadRampUp15 minTimeZeroOxide1.5 minWetOxidation10 minUnloadMeasure8500 °CThe same history to true scale (26 min 30 s simulated). Steps with no stated duration take no width.Temperature through the history. Step widths grow with the logarithm of duration; the bar under each step is how well our encoding matches the paper.
Drag the sample to turn it. Click the clock to move through the history.Layer heights are the simulated thicknesses, drawn to one scale within the film; the substrate is cut short.

Does our sample and history match the paper's?

Left: the paper's own words, with the page of the PDF. Right: what we simulate. 1 same, 3 approximated, 7 assumed, 3 not in ours.

✓1 same≈3 approximated?7 assumed✕3 not in ours
Sample: what the paper saysWhat we simulate
Substrate
Not stated: wafer orientation, doping, bulk or SOI. “Si bulk (110)” labels only the planar reference line and the model's linear rate constant
PDF p. 2
?assumed
FAMILY: Si_Nanowire; ORIENTATION: Si100 (as stored; no program reads it)
Si100 is the stored value and is ours; the paper's only orientation is (110), for the planar line.
Wires
“nanobeams and nanowires of height 240 nm”; diameters “from 40 nm to 140 nm” in the text, about 30 to 230 nm on the axis of Figure 1(b)
PDF p. 2
≈approximated
SHAPE: nanowire; DIAMETER_NM: 30 to 230; HEIGHT_NM: 240 (recorded; no program reads it)
Whether the plotted diameter is before oxidation is said for the beams (“previous width L”) and implied for the wires.
Nanobeams
“The oxide growth on Si nanobeams of previous width L is clearly thicker than a SiNWs with the diameter d = L. A size dependent oxidation kinetic was not observed”
PDF p. 2
✕not in ours
SHAPE: nanobeam; WIDTH_NM: no program
No program for the flat sidewall of a nanostructure; the beams enter only as the rate in the variant below.
Nanorings
“silicon nanorings (concave nanostructure) with inner diameters of 70 nm and 430 nm” (caption); “inner radius” in the text
PDF p. 2, 8
✕not in ours
not encoded
A concave surface: the radial program is for a convex cylinder only.
Starting oxide
Figure 1(a) curves start at about 5 nm at t = 0; not explained
PDF p. 10
?assumed
written as 90 s of steam before time zero (assumed)
History: what the paper saysWhat we simulate
Top-down lithography and etch (details in Ref. 8)
“With the current top-down fabrication capabilities, etched silicon nanostructures including nanobeams, nanorings and nanowires have been fabricated with a high resolution [8]”
PDF p. 2
✕not in ours
SHAPE and DIAMETER_NM on the sample
Lithography, etch chemistry, mask removal: deferred to Ref. 8, not in this paper.
Pre-oxidation clean
not stated
PDF p. 2
?assumed
CLEAN: not_stated
Whether the native oxide was removed before oxidation is not said.
Into the furnace
not stated
PDF p. 2
?assumed
not in our history
Ramp to 850 °C (assumed, in nitrogen)
not stated
PDF p. 2
?assumed
RUN RampUp DURATION 900 TEMP 700->850 AMBIENT inert_N2
The paper describes no furnace cycle. A 15 min ramp from 700 °C in nitrogen is ours.
Oxide present at time zero (about 5 nm)
Figure 1(a): every curve starts at about 5 nm at t = 0 (graph read); the origin is not explained
PDF p. 10
?assumed
RUN TimeZeroOxide DURATION 90 TEMP 850->850 AMBIENT steam
The radial program has no starting oxide. It is written as 90 s of steam before time zero, which grows about 5 nm on a flat sidewall; whether it is native oxide, ramp oxide or a fit offset is not known.
Wet oxidation at 850 °C, 10 min
“then wet oxidized at 850°C”; “nanobeams and nanowires of height 240 nm have been oxidized for 10 and 20 minutes”
PDF p. 2
≈approximated
RUN WetOxidation DURATION 600 TEMP 850->850 AMBIENT steam
How the steam is made, its partial pressure and the flow are not stated; pure steam at 1 atm is ours. The stored recipe is this step alone.
Unload and cool
not stated
PDF p. 2
?assumed
the history ends when the oxidation ends
Oxide thickness by SEM at mid-height
“the oxide thicknesses have been measured in the middle of these vertical structures described in SEM images”
PDF p. 2
✓same
the observable Thickness
Tilted-view SEM for wires, cross-section for beams; no error bars.
Model in the paper
Extended Deal-Grove in cylindrical coordinates with stress-dependent reaction rate and diffusivity and a shear-thinning viscosity; (B/A)[110] 5.18e-09 nm/s, B0 2.68e-13 nm²/s, V_k 15 ų, V_d 45 ų, σ_c 1 GPa, η0 1.4e18 P at 850 °C (as printed)
PDF p. 3–4
≈approximated
the radial program: Kao's cylindrical law with one lumped stress time, no stress on diffusion, linear viscosity
The printed constants are not usable as printed (units); the paper's model is not reproduced here.

The timing of the history

Time is counted from the start of the first simulated step. A step the language cannot state takes no simulated time; where the paper gives its duration, the duration is in the last column. Stated means the paper gives the duration; partly stated that it gives a bound or a range; not stated; assumed that the duration in our history is ours.

Si nanowire, 90 nm, 10 min

#StepStarts atLastsEnds atTemperatureRateGasIs the timing in the paper?
1Top-down lithography and etch (details in Ref. 8)0 snot simulatednot stated
2Pre-oxidation clean0 snot simulatednot stated
3Into the furnace0 snot simulatednot stated. Load temperature, gas and push rate not stated
4Ramp to 850 °C (assumed, in nitrogen)0 s15 min15 min700 → 850 °C+0.167 °C/sinert_N2not stated; assumed. no ramp, load temperature or gas stated; 5 to 30 min searched
5Oxide present at time zero (about 5 nm)15 min1 min 30 s16 min 30 s850 → 850 °Cheldsteamnot stated; assumed. about 5 nm at t = 0 on the figure; written as 1 to 300 s of steam before the stated time
6Wet oxidation at 850 °C, 10 min16 min 30 s10 min26 min 30 s850 → 850 °Cheldsteamstated. 10 and 20 min in the text; 10 to 40 min on the axis of Figure 1(a). Whether each time is a fresh sample is not stated
7Unload and cool26 min 30 snot simulatednot stated. Gas, rate and temperature not stated
8Oxide thickness by SEM at mid-height26 min 30 snot simulatednot stated

Simulated time in this history: 26 min 30 s.

Across the samples

SampleRampUpTimeZeroOxideWetOxidationTotal
Si nanowire, 90 nm, 10 min15 min at 700→850 °C1 min 30 s at 850 °C10 min at 850 °C26 min 30 s
Si nanowire, 30 nm, 10 min15 min at 700→850 °C1 min 30 s at 850 °C10 min at 850 °C26 min 30 s
Si nanowire, 40 nm, 10 min15 min at 700→850 °C1 min 30 s at 850 °C10 min at 850 °C26 min 30 s
Si nanowire, 70 nm, 10 min15 min at 700→850 °C1 min 30 s at 850 °C10 min at 850 °C26 min 30 s
Si nanowire, 130 nm, 10 min15 min at 700→850 °C1 min 30 s at 850 °C10 min at 850 °C26 min 30 s
Si nanowire, 230 nm, 10 min15 min at 700→850 °C1 min 30 s at 850 °C10 min at 850 °C26 min 30 s
Si nanowire, 30 nm, 20 min15 min at 700→850 °C1 min 30 s at 850 °C20 min at 850 °C36 min 30 s
Si nanowire, 40 nm, 20 min15 min at 700→850 °C1 min 30 s at 850 °C20 min at 850 °C36 min 30 s
Si nanowire, 70 nm, 20 min15 min at 700→850 °C1 min 30 s at 850 °C20 min at 850 °C36 min 30 s
Si nanowire, 90 nm, 20 min15 min at 700→850 °C1 min 30 s at 850 °C20 min at 850 °C36 min 30 s
Si nanowire, 130 nm, 20 min15 min at 700→850 °C1 min 30 s at 850 °C20 min at 850 °C36 min 30 s
Si nanowire, 230 nm, 20 min15 min at 700→850 °C1 min 30 s at 850 °C20 min at 850 °C36 min 30 s
Si nanobeam, 50 nm wide, 10 min15 min at 700→850 °C1 min 30 s at 850 °C10 min at 850 °C26 min 30 s
Si nanowire, 70 nm, 10 to 40 min15 min at 700→850 °C1 min 30 s at 850 °C40 min at 850 °C56 min 30 s
Si nanowire, 130 nm, 10 to 40 min15 min at 700→850 °C1 min 30 s at 850 °C40 min at 850 °C56 min 30 s

Timing the paper does not give

  • No furnace cycle at all: load temperature, ramp, gas before and after the steam, cool-down and unload.
  • Time zero: whether 10 and 20 min count from steam on, and what grows the 5 nm present at t = 0.
  • Whether each time is a fresh sample or one sample oxidized again.
  • Steam source and partial pressure: “wet” only.
  • The 30 and 40 min points of Figure 1(a) exist for two wires only.

What the second reading changed

  • The stored recipe is one steam step of 600 or 1200 s at 850 °C. The paper states 850 °C, “wet” and the two times, and nothing else; the stored recipe adds pure steam at 1 atm. Our history adds an assumed ramp and an assumed oxide at time zero.
  • Every curve of Figure 1(a) starts at about 5 nm at t = 0. The radial program starts from bare silicon, so either the program misses 5 nm or the paper's times do not start at the start of oxidation. Writing that oxide as 90 s of steam before the stated time makes every wire thicker by 1 to 5 nm, which is the wrong direction for this paper.
  • The predictor uses Müller's flat-surface rate (1.46 nm/min on bulk times a sidewall factor of 2.32, about 3.4 nm/min on a flat sidewall) and grows linearly in time. This paper's nanobeams, the flat sidewall of this run, have 32.2 nm at 10 min (3.2 nm/min) and 42.3 nm at 20 min (2.1 nm/min on average): the furnace's flat rate falls with time, and the program's does not. At 20 min the program's flat sidewall would carry 68 nm.
  • The stored ORIENTATION is Si100. The paper never states the wafer orientation; the planar line it compares with is (110).
  • The nanobeams and nanorings are not in the stored recipes. The beams are in the dataset as rows with no program; the rings are not in the dataset.

Their terms and ours

The paper saysWe writeKind in our vocabularyNote
SiNWs (convex nanostructure), diameter dSHAPE: nanowire; DIAMETER_NMsample fields (not in ontology/isl_vocabulary.json)
nanobeam of previous width LSHAPE: nanobeam; WIDTH_NMsample fields; no programA flat sidewall in a nanostructure: the quantity the radial program takes from Müller as its sidewall factor.
nanoring, inner diameter (concave)(none)no shape the language or a program hasThe paper's minus sign in Eq. 1.
wet oxidized at 850°CAMBIENT steamambientp_H2O = 1 atm is ours; the source of the steam is not stated.
oxide thickness measured in the middle of the structuresThickness (target: oxide thickness)observable (target: layer_thickness)At mid-height of a 240 nm wire; the program is an infinite cylinder.
retarded oxidationF_ShellFlowStress: exp(-stress)operator kind Relaxation; parameter stress_time (fitted on Müller)The paper's mechanism is reaction-limited by radial stress for convex wires; ours is a lumped form of that.
radial stress σ_r, activation volume V_kstress (a state, dimensionless)STATEOurs is σ_r V_k / k_B T lumped, with no units of pressure.
hydrostatic pressure on diffusion, V_d(none)not in the programThe paper says this dominates for concave rings.
shear-dependent (plastic) viscosity(none)not in the programOurs is a linear viscous shell.
Si bulk (110)(none)a planar reference not encodedPossibly a calculated curve.

The simulation in our language

Each sample is one history file: a SAMPLE and a CONTROL_TRAJECTORY. This is the whole input; run it with PYTHONPATH=. python -m isl_harness.predict <file>.

Si nanowire, 90 nm, 10 min

# Si nanowire, 90 nm, 10 min
SAMPLE Si_nanowire_90nm_10min {
    FAMILY: Si_Nanowire
    ORIENTATION: Si100
    CLEAN: not_stated
    SHAPE: nanowire
    DIAMETER_NM: 90
    HEIGHT_NM: 240
    RUN_FLAT_OXIDE_NM: 32.2
}
CONTROL_TRAJECTORY History {
    EVENT Fabricate KIND etch TIMING assumed                     # Top-down lithography and etch (details in Ref. 8)
    EVENT Clean KIND clean TIMING assumed                        # Pre-oxidation clean
    EVENT Load KIND load TIMING assumed                          # Into the furnace
    RUN RampUp DURATION 900 TEMP 700->850 AMBIENT inert_N2 TIMING assumed VARY duration 300..1800
    RUN TimeZeroOxide DURATION 90 TEMP 850->850 AMBIENT steam TIMING assumed VARY duration 1..300
    RUN WetOxidation DURATION 600 TEMP 850->850 AMBIENT steam TIMING stated
    EVENT Unload KIND other TIMING assumed                       # Unload and cool
    EVENT Measure KIND measurement TIMING assumed                # Oxide thickness by SEM at mid-height
}

Si nanowire, 30 nm, 10 min

# Si nanowire, 30 nm, 10 min
SAMPLE Si_nanowire_30nm_10min {
    FAMILY: Si_Nanowire
    ORIENTATION: Si100
    CLEAN: not_stated
    SHAPE: nanowire
    DIAMETER_NM: 30
    HEIGHT_NM: 240
    RUN_FLAT_OXIDE_NM: 32.2
}
CONTROL_TRAJECTORY History {
    EVENT Fabricate KIND etch TIMING assumed                     # Top-down lithography and etch (details in Ref. 8)
    EVENT Clean KIND clean TIMING assumed                        # Pre-oxidation clean
    EVENT Load KIND load TIMING assumed                          # Into the furnace
    RUN RampUp DURATION 900 TEMP 700->850 AMBIENT inert_N2 TIMING assumed VARY duration 300..1800
    RUN TimeZeroOxide DURATION 90 TEMP 850->850 AMBIENT steam TIMING assumed VARY duration 1..300
    RUN WetOxidation DURATION 600 TEMP 850->850 AMBIENT steam TIMING stated
    EVENT Unload KIND other TIMING assumed                       # Unload and cool
    EVENT Measure KIND measurement TIMING assumed                # Oxide thickness by SEM at mid-height
}

Si nanowire, 40 nm, 10 min

# Si nanowire, 40 nm, 10 min
SAMPLE Si_nanowire_40nm_10min {
    FAMILY: Si_Nanowire
    ORIENTATION: Si100
    CLEAN: not_stated
    SHAPE: nanowire
    DIAMETER_NM: 40
    HEIGHT_NM: 240
    RUN_FLAT_OXIDE_NM: 32.2
}
CONTROL_TRAJECTORY History {
    EVENT Fabricate KIND etch TIMING assumed                     # Top-down lithography and etch (details in Ref. 8)
    EVENT Clean KIND clean TIMING assumed                        # Pre-oxidation clean
    EVENT Load KIND load TIMING assumed                          # Into the furnace
    RUN RampUp DURATION 900 TEMP 700->850 AMBIENT inert_N2 TIMING assumed VARY duration 300..1800
    RUN TimeZeroOxide DURATION 90 TEMP 850->850 AMBIENT steam TIMING assumed VARY duration 1..300
    RUN WetOxidation DURATION 600 TEMP 850->850 AMBIENT steam TIMING stated
    EVENT Unload KIND other TIMING assumed                       # Unload and cool
    EVENT Measure KIND measurement TIMING assumed                # Oxide thickness by SEM at mid-height
}

Si nanowire, 70 nm, 10 min

# Si nanowire, 70 nm, 10 min
SAMPLE Si_nanowire_70nm_10min {
    FAMILY: Si_Nanowire
    ORIENTATION: Si100
    CLEAN: not_stated
    SHAPE: nanowire
    DIAMETER_NM: 70
    HEIGHT_NM: 240
    RUN_FLAT_OXIDE_NM: 32.2
}
CONTROL_TRAJECTORY History {
    EVENT Fabricate KIND etch TIMING assumed                     # Top-down lithography and etch (details in Ref. 8)
    EVENT Clean KIND clean TIMING assumed                        # Pre-oxidation clean
    EVENT Load KIND load TIMING assumed                          # Into the furnace
    RUN RampUp DURATION 900 TEMP 700->850 AMBIENT inert_N2 TIMING assumed VARY duration 300..1800
    RUN TimeZeroOxide DURATION 90 TEMP 850->850 AMBIENT steam TIMING assumed VARY duration 1..300
    RUN WetOxidation DURATION 600 TEMP 850->850 AMBIENT steam TIMING stated
    EVENT Unload KIND other TIMING assumed                       # Unload and cool
    EVENT Measure KIND measurement TIMING assumed                # Oxide thickness by SEM at mid-height
}

Si nanowire, 130 nm, 10 min

# Si nanowire, 130 nm, 10 min
SAMPLE Si_nanowire_130nm_10min {
    FAMILY: Si_Nanowire
    ORIENTATION: Si100
    CLEAN: not_stated
    SHAPE: nanowire
    DIAMETER_NM: 130
    HEIGHT_NM: 240
    RUN_FLAT_OXIDE_NM: 32.2
}
CONTROL_TRAJECTORY History {
    EVENT Fabricate KIND etch TIMING assumed                     # Top-down lithography and etch (details in Ref. 8)
    EVENT Clean KIND clean TIMING assumed                        # Pre-oxidation clean
    EVENT Load KIND load TIMING assumed                          # Into the furnace
    RUN RampUp DURATION 900 TEMP 700->850 AMBIENT inert_N2 TIMING assumed VARY duration 300..1800
    RUN TimeZeroOxide DURATION 90 TEMP 850->850 AMBIENT steam TIMING assumed VARY duration 1..300
    RUN WetOxidation DURATION 600 TEMP 850->850 AMBIENT steam TIMING stated
    EVENT Unload KIND other TIMING assumed                       # Unload and cool
    EVENT Measure KIND measurement TIMING assumed                # Oxide thickness by SEM at mid-height
}

Si nanowire, 230 nm, 10 min

# Si nanowire, 230 nm, 10 min
SAMPLE Si_nanowire_230nm_10min {
    FAMILY: Si_Nanowire
    ORIENTATION: Si100
    CLEAN: not_stated
    SHAPE: nanowire
    DIAMETER_NM: 230
    HEIGHT_NM: 240
    RUN_FLAT_OXIDE_NM: 32.2
}
CONTROL_TRAJECTORY History {
    EVENT Fabricate KIND etch TIMING assumed                     # Top-down lithography and etch (details in Ref. 8)
    EVENT Clean KIND clean TIMING assumed                        # Pre-oxidation clean
    EVENT Load KIND load TIMING assumed                          # Into the furnace
    RUN RampUp DURATION 900 TEMP 700->850 AMBIENT inert_N2 TIMING assumed VARY duration 300..1800
    RUN TimeZeroOxide DURATION 90 TEMP 850->850 AMBIENT steam TIMING assumed VARY duration 1..300
    RUN WetOxidation DURATION 600 TEMP 850->850 AMBIENT steam TIMING stated
    EVENT Unload KIND other TIMING assumed                       # Unload and cool
    EVENT Measure KIND measurement TIMING assumed                # Oxide thickness by SEM at mid-height
}

Si nanowire, 30 nm, 20 min

# Si nanowire, 30 nm, 20 min
SAMPLE Si_nanowire_30nm_20min {
    FAMILY: Si_Nanowire
    ORIENTATION: Si100
    CLEAN: not_stated
    SHAPE: nanowire
    DIAMETER_NM: 30
    HEIGHT_NM: 240
    RUN_FLAT_OXIDE_NM: 42.3
}
CONTROL_TRAJECTORY History {
    EVENT Fabricate KIND etch TIMING assumed                     # Top-down lithography and etch (details in Ref. 8)
    EVENT Clean KIND clean TIMING assumed                        # Pre-oxidation clean
    EVENT Load KIND load TIMING assumed                          # Into the furnace
    RUN RampUp DURATION 900 TEMP 700->850 AMBIENT inert_N2 TIMING assumed VARY duration 300..1800
    RUN TimeZeroOxide DURATION 90 TEMP 850->850 AMBIENT steam TIMING assumed VARY duration 1..300
    RUN WetOxidation DURATION 1200 TEMP 850->850 AMBIENT steam TIMING stated
    EVENT Unload KIND other TIMING assumed                       # Unload and cool
    EVENT Measure KIND measurement TIMING assumed                # Oxide thickness by SEM at mid-height
}

Si nanowire, 40 nm, 20 min

# Si nanowire, 40 nm, 20 min
SAMPLE Si_nanowire_40nm_20min {
    FAMILY: Si_Nanowire
    ORIENTATION: Si100
    CLEAN: not_stated
    SHAPE: nanowire
    DIAMETER_NM: 40
    HEIGHT_NM: 240
    RUN_FLAT_OXIDE_NM: 42.3
}
CONTROL_TRAJECTORY History {
    EVENT Fabricate KIND etch TIMING assumed                     # Top-down lithography and etch (details in Ref. 8)
    EVENT Clean KIND clean TIMING assumed                        # Pre-oxidation clean
    EVENT Load KIND load TIMING assumed                          # Into the furnace
    RUN RampUp DURATION 900 TEMP 700->850 AMBIENT inert_N2 TIMING assumed VARY duration 300..1800
    RUN TimeZeroOxide DURATION 90 TEMP 850->850 AMBIENT steam TIMING assumed VARY duration 1..300
    RUN WetOxidation DURATION 1200 TEMP 850->850 AMBIENT steam TIMING stated
    EVENT Unload KIND other TIMING assumed                       # Unload and cool
    EVENT Measure KIND measurement TIMING assumed                # Oxide thickness by SEM at mid-height
}

Si nanowire, 70 nm, 20 min

# Si nanowire, 70 nm, 20 min
SAMPLE Si_nanowire_70nm_20min {
    FAMILY: Si_Nanowire
    ORIENTATION: Si100
    CLEAN: not_stated
    SHAPE: nanowire
    DIAMETER_NM: 70
    HEIGHT_NM: 240
    RUN_FLAT_OXIDE_NM: 42.3
}
CONTROL_TRAJECTORY History {
    EVENT Fabricate KIND etch TIMING assumed                     # Top-down lithography and etch (details in Ref. 8)
    EVENT Clean KIND clean TIMING assumed                        # Pre-oxidation clean
    EVENT Load KIND load TIMING assumed                          # Into the furnace
    RUN RampUp DURATION 900 TEMP 700->850 AMBIENT inert_N2 TIMING assumed VARY duration 300..1800
    RUN TimeZeroOxide DURATION 90 TEMP 850->850 AMBIENT steam TIMING assumed VARY duration 1..300
    RUN WetOxidation DURATION 1200 TEMP 850->850 AMBIENT steam TIMING stated
    EVENT Unload KIND other TIMING assumed                       # Unload and cool
    EVENT Measure KIND measurement TIMING assumed                # Oxide thickness by SEM at mid-height
}

Si nanowire, 90 nm, 20 min

# Si nanowire, 90 nm, 20 min
SAMPLE Si_nanowire_90nm_20min {
    FAMILY: Si_Nanowire
    ORIENTATION: Si100
    CLEAN: not_stated
    SHAPE: nanowire
    DIAMETER_NM: 90
    HEIGHT_NM: 240
    RUN_FLAT_OXIDE_NM: 42.3
}
CONTROL_TRAJECTORY History {
    EVENT Fabricate KIND etch TIMING assumed                     # Top-down lithography and etch (details in Ref. 8)
    EVENT Clean KIND clean TIMING assumed                        # Pre-oxidation clean
    EVENT Load KIND load TIMING assumed                          # Into the furnace
    RUN RampUp DURATION 900 TEMP 700->850 AMBIENT inert_N2 TIMING assumed VARY duration 300..1800
    RUN TimeZeroOxide DURATION 90 TEMP 850->850 AMBIENT steam TIMING assumed VARY duration 1..300
    RUN WetOxidation DURATION 1200 TEMP 850->850 AMBIENT steam TIMING stated
    EVENT Unload KIND other TIMING assumed                       # Unload and cool
    EVENT Measure KIND measurement TIMING assumed                # Oxide thickness by SEM at mid-height
}

Si nanowire, 130 nm, 20 min

# Si nanowire, 130 nm, 20 min
SAMPLE Si_nanowire_130nm_20min {
    FAMILY: Si_Nanowire
    ORIENTATION: Si100
    CLEAN: not_stated
    SHAPE: nanowire
    DIAMETER_NM: 130
    HEIGHT_NM: 240
    RUN_FLAT_OXIDE_NM: 42.3
}
CONTROL_TRAJECTORY History {
    EVENT Fabricate KIND etch TIMING assumed                     # Top-down lithography and etch (details in Ref. 8)
    EVENT Clean KIND clean TIMING assumed                        # Pre-oxidation clean
    EVENT Load KIND load TIMING assumed                          # Into the furnace
    RUN RampUp DURATION 900 TEMP 700->850 AMBIENT inert_N2 TIMING assumed VARY duration 300..1800
    RUN TimeZeroOxide DURATION 90 TEMP 850->850 AMBIENT steam TIMING assumed VARY duration 1..300
    RUN WetOxidation DURATION 1200 TEMP 850->850 AMBIENT steam TIMING stated
    EVENT Unload KIND other TIMING assumed                       # Unload and cool
    EVENT Measure KIND measurement TIMING assumed                # Oxide thickness by SEM at mid-height
}

Si nanowire, 230 nm, 20 min

# Si nanowire, 230 nm, 20 min
SAMPLE Si_nanowire_230nm_20min {
    FAMILY: Si_Nanowire
    ORIENTATION: Si100
    CLEAN: not_stated
    SHAPE: nanowire
    DIAMETER_NM: 230
    HEIGHT_NM: 240
    RUN_FLAT_OXIDE_NM: 42.3
}
CONTROL_TRAJECTORY History {
    EVENT Fabricate KIND etch TIMING assumed                     # Top-down lithography and etch (details in Ref. 8)
    EVENT Clean KIND clean TIMING assumed                        # Pre-oxidation clean
    EVENT Load KIND load TIMING assumed                          # Into the furnace
    RUN RampUp DURATION 900 TEMP 700->850 AMBIENT inert_N2 TIMING assumed VARY duration 300..1800
    RUN TimeZeroOxide DURATION 90 TEMP 850->850 AMBIENT steam TIMING assumed VARY duration 1..300
    RUN WetOxidation DURATION 1200 TEMP 850->850 AMBIENT steam TIMING stated
    EVENT Unload KIND other TIMING assumed                       # Unload and cool
    EVENT Measure KIND measurement TIMING assumed                # Oxide thickness by SEM at mid-height
}

Si nanobeam, 50 nm wide, 10 min

# Si nanobeam, 50 nm wide, 10 min
SAMPLE Si_nanobeam_50nm_10min {
    FAMILY: Si_Nanowire
    ORIENTATION: Si100
    CLEAN: not_stated
    SHAPE: nanobeam
    DIAMETER_NM: 50
    WIDTH_NM: 50
    HEIGHT_NM: 240
    RUN_FLAT_OXIDE_NM: 32.2
}
CONTROL_TRAJECTORY History {
    EVENT Fabricate KIND etch TIMING assumed                     # Top-down lithography and etch (details in Ref. 8)
    EVENT Clean KIND clean TIMING assumed                        # Pre-oxidation clean
    EVENT Load KIND load TIMING assumed                          # Into the furnace
    RUN RampUp DURATION 900 TEMP 700->850 AMBIENT inert_N2 TIMING assumed VARY duration 300..1800
    RUN TimeZeroOxide DURATION 90 TEMP 850->850 AMBIENT steam TIMING assumed VARY duration 1..300
    RUN WetOxidation DURATION 600 TEMP 850->850 AMBIENT steam TIMING stated
    EVENT Unload KIND other TIMING assumed                       # Unload and cool
    EVENT Measure KIND measurement TIMING assumed                # Oxide thickness by SEM at mid-height
}

A nanobeam has flat sidewalls. Since 11 November the predictor runs SHAPE nanobeam as flat sidewalls (no curvature term) with the run's flat-surface oxide as the rate; DIAMETER_NM carries the beam's width.

Si nanowire, 70 nm, 10 to 40 min

# Si nanowire, 70 nm, 10 to 40 min
SAMPLE Si_nanowire_70nm_series {
    FAMILY: Si_Nanowire
    ORIENTATION: Si100
    CLEAN: not_stated
    SHAPE: nanowire
    DIAMETER_NM: 70
}
CONTROL_TRAJECTORY History {
    EVENT Fabricate KIND etch TIMING assumed                     # Top-down lithography and etch (details in Ref. 8)
    EVENT Clean KIND clean TIMING assumed                        # Pre-oxidation clean
    EVENT Load KIND load TIMING assumed                          # Into the furnace
    RUN RampUp DURATION 900 TEMP 700->850 AMBIENT inert_N2 TIMING assumed VARY duration 300..1800
    RUN TimeZeroOxide DURATION 90 TEMP 850->850 AMBIENT steam TIMING assumed VARY duration 1..300
    RUN WetOxidation DURATION 2400 TEMP 850->850 AMBIENT steam TIMING stated
    EVENT Unload KIND other TIMING assumed                       # Unload and cool
    EVENT Measure KIND measurement TIMING assumed                # Oxide thickness by SEM at mid-height
}

Figure 1(a), drawn and not scored: the four times are not in the project's dataset, and the paper does not say whether they are one wire oxidized four times or four wires.

Si nanowire, 130 nm, 10 to 40 min

# Si nanowire, 130 nm, 10 to 40 min
SAMPLE Si_nanowire_130nm_series {
    FAMILY: Si_Nanowire
    ORIENTATION: Si100
    CLEAN: not_stated
    SHAPE: nanowire
    DIAMETER_NM: 130
}
CONTROL_TRAJECTORY History {
    EVENT Fabricate KIND etch TIMING assumed                     # Top-down lithography and etch (details in Ref. 8)
    EVENT Clean KIND clean TIMING assumed                        # Pre-oxidation clean
    EVENT Load KIND load TIMING assumed                          # Into the furnace
    RUN RampUp DURATION 900 TEMP 700->850 AMBIENT inert_N2 TIMING assumed VARY duration 300..1800
    RUN TimeZeroOxide DURATION 90 TEMP 850->850 AMBIENT steam TIMING assumed VARY duration 1..300
    RUN WetOxidation DURATION 2400 TEMP 850->850 AMBIENT steam TIMING stated
    EVENT Unload KIND other TIMING assumed                       # Unload and cool
    EVENT Measure KIND measurement TIMING assumed                # Oxide thickness by SEM at mid-height
}

Figure 1(a), drawn and not scored: the four times are not in the project's dataset, and the paper does not say whether they are one wire oxidized four times or four wires.

The programs the predictor ran on these histories: experiments/muller_nanowire/radial_oxidation.isl.template with the length exponential curvature term.

The model itself, experiments/muller_nanowire/radial_oxidation.isl.template, as it is written. Every equation the simulation uses is in this text; the runtime holds no physics.

# ==============================================================================
# ISL MODEL: OXIDATION OF A SILICON NANOWIRE (challenge system 2)
#
# Data: Mueller et al., Nanotechnology 34, 105303 (2023), Figure 5: vertical silicon
# nanowires oxidized wet at 850 C, oxide thickness and remaining core against the
# as-etched diameter.
#
# The wire is a cylinder of silicon of radius a inside an oxide shell of outer radius b.
#   - Oxide forms at the silicon surface at the planar linear rate, times a sidewall
#     factor, reduced by diffusion through the shell in cylindrical geometry
#     (the linear-parabolic law written for a cylinder, after Kao et al.).
#   - New oxide takes more room than the silicon it replaces, so the shell must flow
#     outward. In a viscous shell that puts the silicon surface under a radial
#     compression proportional to the growth rate and to (1/a^2 - 1/b^2). The reaction
#     slows exponentially with that compression. One parameter, stress_time, lumps the
#     oxide viscosity and the activation volume of the reaction.
#   - The stress is carried as a state that follows its viscous value with a short lag,
#     because the viscous value depends on the rate it reduces.
# The outer radius is not a state: it follows from the silicon consumed.
#
# Not included: the effect of pressure on oxidant diffusion and solubility, stress-
# dependent viscosity, and faceting. Fields in {{braces}} are filled by
# scripts/run_muller_nanowire.py.
# ==============================================================================
SAMPLE Wire_{tag} {{
    FAMILY: Si_Nanowire
    CLEAN: not_stated
    ORIENTATION: Si100
    SHAPE: nanowire
    DIAMETER_NM: {diameter_nm}
}}
STATE a {{ UNIT: cm; INITIAL: a_0; MIN: 1.0e-9; MAX: 1.0e-4 }}
STATE stress {{ UNIT: 1; INITIAL: 0; MIN: 0; MAX: 50 }}
CONTROL T {{ UNIT: K }}
CONTROL p_H2O {{ UNIT: atm }}
PARAMETER a_0 {{ VALUE: {a_0_cm}; UNIT: cm; STATUS: sourced; SOURCE: Mueller et al. 2023 Figure 5, half the as-etched diameter }}
# ---- taken from the paper's own planar and flat-sidewall measurements --------------
PARAMETER rate_planar {{ VALUE: {rate_planar}; UNIT: cm s^-1; STATUS: sourced; SOURCE: Mueller et al. 2023 Figure A1, slope of bulk (100) oxide thickness against time at 850 C wet }}
PARAMETER sidewall {{ VALUE: {sidewall}; UNIT: 1; STATUS: sourced; SOURCE: Mueller et al. 2023 p. 8, nanosheet oxide 44.1 nm over bulk oxide 19 nm in the same run }}
PARAMETER A_dg {{ VALUE: 1.1e-4; UNIT: cm; STATUS: sourced; SOURCE: Deal and Grove 1965 wet oxidation, A extrapolated from 920 and 1000 C to 850 C }}
# ---- fitted to the larger wires -----------------------------------------------------
PARAMETER stress_time {{ VALUE: 1.0; UNIT: s; STATUS: fitted }}
# ---- assumptions --------------------------------------------------------------------
PARAMETER lag {{ VALUE: 2.0; UNIT: s; STATUS: hypothesis }}
# Growth is switched off smoothly as the core vanishes, so a fully consumed wire stops instead of going negative.
PARAMETER a_end {{ VALUE: 2.0e-8; UNIT: cm; STATUS: hypothesis }}
PARAMETER expansion {{ VALUE: 2.27; UNIT: 1; STATUS: constant }}
PARAMETER consumed {{ VALUE: 0.44; UNIT: 1; STATUS: constant }}
PARAMETER p_ref {{ VALUE: 1.0; UNIT: atm; STATUS: constant }}
QUANTITY b {{ UNIT: cm; EQUATION: b = sqrt(a * a + expansion * (a_0 * a_0 - a * a)) }}
QUANTITY growth {{ UNIT: cm s^-1; EQUATION: growth = (p_H2O / p_ref) * sidewall * rate_planar * exp(-stress) * (a / (a + a_end)) / (1 + (2 * a / A_dg) * log(b / a)) }}
QUANTITY viscous_stress {{ UNIT: 1; EQUATION: viscous_stress = stress_time * (1 - consumed) * a * growth * (1 / (a * a) - 1 / (b * b)) }}
CONTROL_TRAJECTORY History_{tag} {{
{runs}
}}
# Silicon is consumed at 0.44 of the oxide thickness formed at its surface.
OPERATOR F_RadialOxidation : OxideGrowth {{
    EQUATION: d(a)/dt = -consumed * growth
}}
# The compression at the silicon surface follows the value a viscous shell would carry.
OPERATOR F_ShellFlowStress : Relaxation {{
    EQUATION: d(stress)/dt = (viscous_stress - stress) / lag
}}
OBSERVATION_MODEL Obs_Oxide {{ TARGET: Thickness; UNIT: cm; EQUATION: Thickness = sqrt(a * a + expansion * (a_0 * a_0 - a * a)) - a }}
OBSERVATION_MODEL Obs_Core {{ TARGET: Core_diameter; UNIT: cm; EQUATION: Core_diameter = 2 * a }}
OBSERVATION_MODEL Obs_Consumed {{ TARGET: Consumed_substrate; UNIT: cm; EQUATION: Consumed_substrate = a_0 - a }}
EVALUATION_CONTRACT Contract_{tag} {{
    FROZEN: true
    DATASET: data/derived/muller_2023_nanowires.csv
    DATASET_DIGEST: sha256:{dataset_sha256}
    SPLIT: {split}
    TARGET: Thickness = {oxide_cm} +/- {oxide_tol_cm} abs
    TARGET: Core_diameter = {core_cm} +/- {core_tol_cm} abs
}}

Our simulation against the paper

9 within, 4 near of 13 numbers. Tolerance is stated per row; nothing was fitted for this page.

✓9 within tolerance≈4 within twice the tolerance
simulation below the paper ← 0 → simulation above the paper-100%-50%0%+50%+100%Si nanowire, 90 nm, 10 minoxide thickness at mid-heightours 23.2 · paper 21.6 nm✓ within tolerance (+7.5%)Si nanowire, 30 nm, 10 minoxide thickness at mid-heightours 13.5 · paper 10.1 nm≈ within twice the tolerance (+34%)Si nanowire, 40 nm, 10 minoxide thickness at mid-heightours 16.4 · paper 12.2 nm≈ within twice the tolerance (+35%)Si nanowire, 70 nm, 10 minoxide thickness at mid-heightours 21.4 · paper 17.6 nm≈ within twice the tolerance (+22%)Si nanowire, 130 nm, 10 minoxide thickness at mid-heightours 25.3 · paper 27.2 nm✓ within tolerance (-6.8%)Si nanowire, 230 nm, 10 minoxide thickness at mid-heightours 27.7 · paper 29.3 nm✓ within tolerance (-5.5%)Si nanowire, 30 nm, 20 minoxide thickness at mid-heightours 15.8 · paper 18 nm✓ within tolerance (-12%)Si nanowire, 40 nm, 20 minoxide thickness at mid-heightours 19.7 · paper 20.8 nm✓ within tolerance (-5.4%)Si nanowire, 70 nm, 20 minoxide thickness at mid-heightours 26.6 · paper 24.8 nm✓ within tolerance (+7.2%)Si nanowire, 90 nm, 20 minoxide thickness at mid-heightours 29.1 · paper 30.8 nm✓ within tolerance (-5.5%)Si nanowire, 130 nm, 20 minoxide thickness at mid-heightours 32.1 · paper 34.9 nm✓ within tolerance (-8.0%)Si nanowire, 230 nm, 20 minoxide thickness at mid-heightours 35.5 · paper 42.3 nm≈ within twice the tolerance (-16%)Si nanobeam, 50 nm wide, 10 minsidewall oxide at mid-heightours 30.8 · paper 33.1 nm✓ within tolerance (-7.0%)
The pale green band is the tolerance. Bars past ±100% are cut and carry their value.
Oxide on a nanowire against wet-oxidation time
021.643.264.886.5010203040time in WetOxidation (min)oxide thickness (nm)70 nm130 nmour simulationthe paper
Oxide on Si nanowires against diameter, 10 min
07.9115.823.731.63080130180230diameter (nm)oxide thickness (nm)10 minour simulationthe paper
Oxide on Si nanowires against diameter, 20 min
011.422.834.345.73080130180230diameter (nm)oxide thickness (nm)20 minour simulationthe paper
Sample and historyQuantityThe paperOur simulationDifferenceVerdictWhat the program's own evaluation saysWhere in the paper
Si nanowire, 90 nm, 10 minoxide thickness at mid-height21.6 nm23.2 nm+7%within (±13.9%)direction onlyFigure 1(b), vector drawing; dataset krzeminski_2012_nanowires
Si nanowire, 30 nm, 10 minoxide thickness at mid-height10.1 nm13.5 nm+34%near (±29.7%)direction onlyFigure 1(b), vector drawing; dataset krzeminski_2012_nanowires
Si nanowire, 40 nm, 10 minoxide thickness at mid-height12.2 nm16.4 nm+35%near (±24.6%)direction onlyFigure 1(b), vector drawing; dataset krzeminski_2012_nanowires
Si nanowire, 70 nm, 10 minoxide thickness at mid-height17.6 nm21.4 nm+22%near (±17%)direction onlyFigure 1(b), vector drawing; dataset krzeminski_2012_nanowires
Si nanowire, 130 nm, 10 minoxide thickness at mid-height27.2 nm25.3 nm-7%within (±11%)direction onlyFigure 1(b), vector drawing; dataset krzeminski_2012_nanowires
Si nanowire, 230 nm, 10 minoxide thickness at mid-height29.3 nm27.7 nm-6%within (±10.2%)direction onlyFigure 1(b), vector drawing; dataset krzeminski_2012_nanowires
Si nanowire, 30 nm, 20 minoxide thickness at mid-height18 nm15.8 nm-12%within (±16.7%)direction onlyFigure 1(b), vector drawing; dataset krzeminski_2012_nanowires
Si nanowire, 40 nm, 20 minoxide thickness at mid-height20.8 nm19.7 nm-5%within (±14.4%)direction onlyFigure 1(b), vector drawing; dataset krzeminski_2012_nanowires
Si nanowire, 70 nm, 20 minoxide thickness at mid-height24.8 nm26.6 nm+7%within (±12.1%)direction onlyFigure 1(b), vector drawing; dataset krzeminski_2012_nanowires
Si nanowire, 90 nm, 20 minoxide thickness at mid-height30.8 nm29.1 nm-5%within (±10%)direction onlyFigure 1(b), vector drawing; dataset krzeminski_2012_nanowires
Si nanowire, 130 nm, 20 minoxide thickness at mid-height34.9 nm32.1 nm-8%within (±10%)direction onlyFigure 1(b), vector drawing; dataset krzeminski_2012_nanowires
Si nanowire, 230 nm, 20 minoxide thickness at mid-height42.3 nm35.5 nm-16%near (±10%)direction onlyFigure 1(b), vector drawing; dataset krzeminski_2012_nanowires
Si nanobeam, 50 nm wide, 10 minsidewall oxide at mid-height33.1 nm30.8 nm-7%within (±10%)direction onlyFigure 1(b), vector drawing; dataset krzeminski_2012_nanowires

Aligning the simulation: what the unstated things would have to be

Every step whose timing or temperature the paper leaves open carries a range in the history above (VARY). scripts/align_study.py searched those ranges against the paper's numbers through the same predictor, first one unknown at a time, then all together. No parameter a program declares fitted was touched. The unknowns were chosen on nanowire_130nm_10min, nanowire_230nm_10min, nanowire_30nm_10min, nanowire_40nm_10min, nanowire_70nm_10min, nanowire_90nm_10min only; every other number is a test they played no part in.

UnknownWhat the paper saysRange searchedThe reproduction usedBest aloneScore at the reproduction's valueBest score alone
Ramp to 850 °C (assumed, in nitrogen): durationno ramp, load temperature or gas stated; 5 to 30 min searched300 to 1800 s900 s900 s (flat: the data do not constrain it)3 of 6 within tolerance, median error 14.6%3 of 6 within tolerance, median error 14.6%
Oxide present at time zero (about 5 nm): durationabout 5 nm at t = 0 on the figure; written as 1 to 300 s of steam before the stated time1 to 300 s90 s90 s (flat: the data do not constrain it)3 of 6 within tolerance, median error 14.6%3 of 6 within tolerance, median error 14.6%

Together: RampUp duration 900 s (was 900); TimeZeroOxide duration 90 s (was 90).

As reproduced: 9 of 13 within tolerance, median error 7.5%. Aligned: 9 of 13 within tolerance, median error 7.5%. On the held-out samples only: 6 of 7 within tolerance, median error 7.2% as reproduced, 6 of 7 within tolerance, median error 7.2% aligned.

Choices of program or material property, each scored on its own and on top of the aligned history:

VariantAloneWith the aligned history
steam fraction 0.67 (pyrogenic H2:O2 = 1:1)3 of 13 within tolerance, median error 30.8%3 of 13 within tolerance, median error 30.8%

The unknowns were chosen on the six wires after 10 min, the rows scripts/search_nanowire.py also trained on; the six wires after 20 min are the test. The program that runs is the predictor's: the viscous shell with the stress time fitted on Müller's wires, not the curvature length that search selected.

The ramp is not visible. The radial program's rate is proportional to p_H2O and has no temperature in it, so a ramp in nitrogen grows nothing at any length from 5 to 30 min (49.7% median error at every value). The data cannot say anything about it through this program, and the search leaves it at the low end of its range only because ties go to the first value.

The 5 nm at time zero is ruled out as extra growth. Every wire is already too thick as reproduced (median +48%). Any steam before time zero makes it worse: 1 s gives a median error of 34% on the 10 min wires, 90 s gives 50%, 300 s gives 83%. The search sets it to the minimum. Whatever the 5 nm is, this program cannot have grown it and still match the wires.

The rate matters most. Taking the flat-surface rate from this paper's own nanobeams instead of Müller's (written as a steam fraction of 0.95 at 10 min and 0.62 at 20 min, because the language has no other way to give a program a measured reference rate) brings the 20 min wires from 0 of 6 to 2 of 6 within tolerance and all 6 within twice the tolerance (median error 14%). The 10 min wires go to 2 of 6: the 130 and 230 nm wires within 1%, the 30, 40 and 70 nm wires 39 to 74% too thick (17.6 against 10.1 nm at 30 nm). A pyrogenic steam fraction of 0.67 applied to every step scores the same count overall (2 of 12 alone) but by being wrong the other way on the large 10 min wires.

Aligned with the nanobeam rate: 4 of 12 within tolerance, median error 18% (0 of 12, 48%, as reproduced). This is the same 4 of 12 that evaluations/krzeminski_transfer_report.json records for the transfer with nothing refitted.

✓6 within tolerance≈1 within twice the tolerance
simulation below the paper ← 0 → simulation above the paper-100%-50%0%+50%+100%Si nanowire, 30 nm, 20 minoxide thickness at mid-heightours 15.8 · paper 18 nm✓ within tolerance (-12%)Si nanowire, 40 nm, 20 minoxide thickness at mid-heightours 19.7 · paper 20.8 nm✓ within tolerance (-5.4%)Si nanowire, 70 nm, 20 minoxide thickness at mid-heightours 26.6 · paper 24.8 nm✓ within tolerance (+7.2%)Si nanowire, 90 nm, 20 minoxide thickness at mid-heightours 29.1 · paper 30.8 nm✓ within tolerance (-5.5%)Si nanowire, 130 nm, 20 minoxide thickness at mid-heightours 32.1 · paper 34.9 nm✓ within tolerance (-8.0%)Si nanowire, 230 nm, 20 minoxide thickness at mid-heightours 35.5 · paper 42.3 nm≈ within twice the tolerance (-16%)Si nanobeam, 50 nm wide, 10 minsidewall oxide at mid-heightours 30.8 · paper 33.1 nm✓ within tolerance (-7.0%)
The pale green band is the tolerance. Bars past ±100% are cut and carry their value.

6 within, 1 near of 7 numbers with the aligned settings (the samples used to choose the unknowns are left out).

SampleQuantityThe paperAs reproduced aboveAlignedDifferenceVerdictHow
Si nanowire, 30 nm, 20 minoxide thickness at mid-height18 nm15.815.8-12%within (±17%)test
Si nanowire, 40 nm, 20 minoxide thickness at mid-height20.8 nm19.719.7-5%within (±14%)test
Si nanowire, 70 nm, 20 minoxide thickness at mid-height24.8 nm26.626.6+7%within (±12%)test
Si nanowire, 90 nm, 20 minoxide thickness at mid-height30.8 nm29.129.1-5%within (±10%)test
Si nanowire, 130 nm, 20 minoxide thickness at mid-height34.9 nm32.132.1-8%within (±10%)test
Si nanowire, 230 nm, 20 minoxide thickness at mid-height42.3 nm35.535.5-16%near (±10%)test
Si nanobeam, 50 nm wide, 10 minsidewall oxide at mid-height33.1 nm30.830.8-7%within (±10%)test

What alignment cannot fix: the wires of 70 nm and below are 39 to 74% too thick after 10 min and 17 to 24% after 20 min. The viscous shell, with a stress time fitted on Müller's wires of 75 nm and above, slows small wires too little. No history unknown changes that; it is the form of the curvature term. scripts/search_nanowire.py found that a curvature length (rate × exp(−ℓ/a), ℓ = 6.4 nm), fitted on Müller's large wires and these 10 min wires together, passes 5 of the 6 held-out 20 min wires; the predictor does not run it.

The program's flat rate is linear in time. The paper's flat sidewall grows 32.2 nm in 10 min and 42.3 nm in 20 min, and the 130 nm wire in Figure 1(a) bends over between 20 and 40 min (35.1 to 50.8 nm) while the program goes on at its rate (time chart above). Giving the rate per time as a steam fraction hides this for the two stated times only.

What our language and ontology cannot yet say

  • A reference sample in the same run. The nanobeams were oxidized beside the wires; their oxide is the furnace's flat-surface rate. The language cannot say that two samples shared a furnace run, nor let a program take its rate from a measured co-processed sample. Here it had to be smuggled in as a steam fraction per case. A BATCH of samples under one trajectory, with a REFERENCE sample whose measured value is an input, would make that explicit and stop the steam fraction meaning two things.
  • A starting oxide on the sample. The ~5 nm at t = 0 has no place: the radial program starts from bare silicon, and writing it as extra steam time grows it radially with the wire's slowdown. A sample field OXIDE_NM read as the initial shell (b > a at t = 0) would let the 5 nm be tested as native or ramp oxide.
  • Shapes beyond a cylinder. Nanobeams (flat sidewalls) and nanorings (concave) are half of this paper's data and have no SHAPE a program reads. A SHAPE: nanobeam should select a flat-sidewall program, and a SHAPE: nanoring with an inner radius should select the concave sign of Eq. 1; today a beam stored with DIAMETER_NM is silently run as a cylinder.
  • Temperature and gas in the nanowire program. Its rate depends on p_H2O only, so ramps, dry oxygen and the 850 °C itself are invisible. An Arrhenius rate and a dry-oxygen channel would let the furnace-cycle unknowns mean something.
  • Which form runs. The predictor runs the viscous shell fitted on one paper while the project's own search selected another form on two. A program registry that records which form a search selected, and runs that one, would make the page and the search agree.

With heating and cooling transitions

No paper we hold states how its wafers heated up or cooled down. The project owner specified scenarios for one Vitkavage wafer (isl_harness/vitkavage_transitions.py); isl_harness/thermal_transitions.py applies the same numbers to every sample here: a heat-up in nitrogen before the first furnace step (a hot push of 1 to 5 min, or a cold-furnace ramp of 60 to 120 min), the owner's radiative cooling knots after the last furnace step or after the paper's own pull (fast, or every time multiplied by 5), and ramps around an anneal at 300 to 500 °C. The paper's own steps are kept as written. All transitions are assumptions, written in the history with TIMING assumed.

HistoryWithin toleranceMedian errorChanged numbers
as the paper states it (above)9 of 137.5%
heat-up A (hot push), fast cooling9 of 137.5%0 of 13 moved by more than 2%
heat-up A (hot push), slow cooling9 of 137.5%0 of 13 moved by more than 2%
heat-up B (cold-furnace ramp), fast cooling9 of 137.5%0 of 13 moved by more than 2%
heat-up B (cold-furnace ramp), slow cooling9 of 137.5%0 of 13 moved by more than 2%

The paper's own conclusions

The paper statesWhat we find
Oxide on wires falls with decreasing diameter at 10 and 20 minDirection reproduced; the amount is too small below 90 nm (the program slows too little)direction right
Nanobeam sidewall oxide does not depend on width and is thicker than on a wire of the same sizeNo program for a flat nanostructure sidewall; the beams are used only as the ratenot tested
Growth slows with time on wires and rings; convex faster than concaveThe radial program's flat rate is linear in time: on the 130 nm wire it keeps growing where the data bend (Figure 1(a) chart); rings are not modelledpartly
Retardation is reaction-limited by radial stress for convex wires, diffusion-limited by pressure for concave ringsOur program has only the first, lumped; the second is absentnot tested

What we would like Emily to check

  1. Is the steam in this furnace pyrogenic, as in Müller 2023, and is the furnace cycle the same (600 °C load, nitrogen ramp, oxygen ramp, 5 min hold)?
  2. What is the 5 nm on every curve at t = 0: native oxide, oxide from the ramp, or an offset of the fit?
  3. Were the nanobeams and the wires in the same furnace run, so that the beam oxide is the flat-surface rate the wires saw?
  4. Is the “Si bulk (110)” line a measured wafer or a calculated curve?
  5. Is each point of Figure 1(a) a fresh sample, or one sample returned to the furnace?