Agentic PrimitivesAP

Essay ·

The vocabulary: what the ontology calls things

The 68 domain terms and 36 working terms of the interface ontology, each with its definition, who wrote it, whether any source in the library uses the words, and which sources. Seven terms have no source.

Richard Pedersen · Agentic Trust Labs · Rich Canvas

Emily's pages: Questions · Vocabulary · Language · Studies reproduced · Experiment proposal · The essay

The vocabulary: what the ontology calls things

Companion to [Questions we need Emily to answer](/writing/questions-for-emily-testing-a-theory-of-the-interface). Written 10 November 2026. Generated from the ontology's own files; this page is not edited by hand.

The ontology has two vocabularies. 68 domain terms are the field's words that the language can name, so that a model reasoning in it uses the field's terms and not ours. 36 working terms are the quantities, process factors and operator kinds that the programs and claims actually use.

Two things to know before reading the tables.

  • The definitions of the 68 were written by the AI agent from general knowledge. They have not been checked by a person. Whether a term is supported is not decided by the agent: a script searches the text of the sources in our library for the term's words as a phrase. "The sources' own term" means at least two sources use it; "one source's term" means one does; "no source in the library" means none does, so it comes from general knowledge alone.
  • Of the 68 domain terms, 49 are the sources' own, 12 are one source's, and 7 have no source (e-prime-center, gate-oxide-integrity, hydrogen-chloride, interlayer-thickness, miscut, nitric-oxide-anneal, off-axis-angle). Of the 36 working terms, 28 are the sources' own, 2 are one source's, 4 join two of the sources' terms, 1 is the challenge statement's, and 1 is ours.

What we would like Emily to check

  1. Mark any term a practitioner would not use, or would use differently. Say what they would say instead.
  2. For the terms marked no source in the library: is the term right and the definition right? These are the ones most likely to carry our memory of the field and not the field's own words.
  3. Anything missing that a process engineer would expect to find in each group.
  4. Whether Qss, Nf and Qf, which sources use for the same or different charges, should stay separate (the ontology keeps the source's symbol and treats the quantity as distinct).

The 68 domain terms

Quantities (19): things that are measured or computed

TermDefinition (agent, unverified)SupportSources (of how many)
threshold-voltageGate voltage at which the channel forms.the sources' own termDeal and Razouk 1980, Faruque 2016, Fukuda 1992, Goncharova 2011 and 4 more (8)
breakdown-fieldElectric field at which the oxide fails.the sources' own termFaruque 2016, Fukuda 1992, Goto and Hijikata 2016, Hung 1987 and 2 more (6)
channel-mobilityCarrier mobility in the inversion channel; lowered by interface defects.the sources' own termGoto and Hijikata 2016, Hijikata 2013, Kobayashi 2017, Li et al. 2023 and 2 more (6)
refractive-indexRefractive index of the oxide film; tracks its stoichiometry (suboxide content) as well as its density.the sources' own termFaruque 2016, Hijikata 2013, Kao, Part I report (DTIC ADA181721), Kobeda and Irene report (DTIC ADA169602) and 2 more (6)
flat-band-voltageGate voltage at which the semiconductor bands are flat; shifts with oxide charge.the sources' own termDeal and Razouk 1980, Fukuda 1992, Murali 1988, Osullivan 2001 and 1 more (5)
suboxideSilicon in oxidation states between the element and the dioxide, found at the interface.the sources' own termBashouti 2013, Goncharova 2011, Li et al. 2023, Thornton 2022 and 1 more (5)
transition-regionThe thin region across which composition changes from substrate to oxide.the sources' own termGoncharova 2011, Hung 1987, Raider and Berman 1978, Raider and Flitsch 1978 and 1 more (5)
mobile-ionic-chargeCharge of ions such as sodium that move in the oxide under bias and temperature.the sources' own termDeal and Razouk 1980, Hung 1987, Razouk and Deal 1979, Vitkavage and Irene 1990 (4)
oxide-trapped-chargeCharge held on traps in the bulk of the oxide.the sources' own termDeal and Razouk 1980, Hung 1987, Razouk and Deal 1979, Vitkavage and Irene 1990 (4)
oxygen-vacancyA missing oxygen in the oxide network.the sources' own termFukuda 1992, Hijikata 2013, Stanford SUPREM report 1982 (DTIC ADA121414), Wang 2017 (4)
capture-cross-sectionCross-section with which a trap captures a carrier; bulk traps have one as well as interface states.the sources' own termDeal and Razouk 1980, Hung 1987, Johnson et al. 1981 (3)
carbon-clusterAggregate of carbon atoms (C–C bonded) at or near the SiC/oxide interface.the sources' own termGupta and Akhtar, InTech chapter on SiC oxidation, Li et al. 2023, Yano and Kimoto 2002 (3)
near-interface-trapsOxide traps near the interface, the usual term on SiC. Synonym of border-traps: the same physical concept.the sources' own termGoto and Hijikata 2016, Hijikata 2013, Li et al. 2023 (3)
film-stressStress in the oxide film.the sources' own termKobeda and Irene report (DTIC ADA169602), Vitkavage and Irene 1990 (2)
interface-roughnessRoughness of the boundary between substrate and oxide.the sources' own termFaruque 2016, Hung 1987 (2)
oxide-densityMass density of the oxide film.the sources' own termKrzeminski 2012, Vitkavage and Irene 1990 (2)
border-trapsTraps in the oxide close enough to the interface to exchange charge with the substrate. Synonym of near-interface-traps: the same physical concept.one source's termFukuda 1992 (1)
germanium-pile-upGermanium accumulated at the oxide interface when silicon is oxidized selectively.one source's termRabie 2005 (1)
interlayer-thicknessThickness of a layer that forms between a deposited dielectric and the substrate.no source in the librarynone

Processes (22): things done to a sample

TermDefinition (agent, unverified)SupportSources (of how many)
wet-oxidationOxidation in the presence of water vapour.the sources' own termDeal 1967, Deal and Grove 1965, Faruque 2016, Gupta and Akhtar, InTech chapter on SiC oxidation and 14 more (18)
dry-oxidationOxidation in oxygen with little water.the sources' own termDeal and Grove 1965, Goto and Hijikata 2016, Gupta and Akhtar, InTech chapter on SiC oxidation, Hijikata 2013 and 13 more (17)
native-oxideThe thin oxide present on a surface before deliberate oxidation.the sources' own termBashouti 2013, Faruque 2016, Gupta and Akhtar, InTech chapter on SiC oxidation, Hijikata 2013 and 9 more (13)
forming-gas-annealA low-temperature anneal in dilute hydrogen.the sources' own termDeal and Razouk 1980, Gupta and Akhtar, InTech chapter on SiC oxidation, Osullivan 2001, Reed 1989 and 3 more (7)
post-oxidation-annealAn anneal after oxidation and before metallization.the sources' own termDeal and Razouk 1980, Hung 1987, Kobeda and Irene report (DTIC ADA169602), Murali 1988 and 3 more (7)
nitridationIncorporation of nitrogen into the oxide or interface.the sources' own termFaruque 2016, Kobayashi 2017, Krzeminski 2007, Li et al. 2023 and 2 more (6)
cooling-rateRate of cooling from the process temperature.the sources' own termHayamizu, patent EP0562783, Kobayashi 2017, Osullivan 2001, Razouk and Deal 1979 and 1 more (5)
ramp-rateRate of heating to the process temperature.the sources' own termFaruque 2015, Faruque 2016, Hung 1987, Vitkavage and Irene 1990 and 1 more (5)
rapid-thermal-oxidationOxidation in a lamp-heated single-wafer system, in seconds to minutes.the sources' own termDavid 2015, Deal and Grove 1965, Murali 1988, Osullivan 2001 and 1 more (5)
water-vaporWater in the process gas.the sources' own termDeal 1967, Deal and Grove 1965, Mayo and Evans 1979, Ryu and Tomozawa 2006 and 1 more (5)
substrate-dopingDopant type and concentration of the substrate.the sources' own termKao, Part I report (DTIC ADA181721), Osullivan 2001, Stanford SUPREM report 1982 (DTIC ADA121414), Stanford SUPREM report (DTIC ADA130105) (4)
atomic-layer-depositionDeposition of a dielectric by sequential, self-limiting surface reactions (ALD).the sources' own termFaruque 2016, Goncharova 2011, Li et al. 2023 (3)
electron-beam-evaporationMetal deposition by electron-beam heating; can damage the oxide.the sources' own termDeal and Razouk 1980, Faruque 2016, Johnson et al. 1981 (3)
radiation-damageDefects made by ionizing radiation during processing.the sources' own termJohnson et al. 1981, Stanford SUPREM report 1982 (DTIC ADA121414), Vitkavage and Irene 1990 (3)
post-metallization-annealAn anneal after the gate metal is deposited.the sources' own termDeal and Razouk 1980, Vitkavage and Irene 1990 (2)
gate-metalMaterial and deposition method of the gate electrode.one source's termHung 1987 (1)
germanium-fractionGermanium content of a SiGe alloy.one source's termRabie et al. 2005 (1)
total-pressureTotal pressure of the process gas.one source's termWang et al. 1994 (1)
hydrogen-chlorideHCl added to the oxidizing gas.no source in the librarynone
miscutTolerance on the actual deviation of the wafer surface from its nominal orientation, as specified or measured; separate from the intended off-axis angle.no source in the librarynone
nitric-oxide-annealAn anneal in NO, used on SiC to lower trap density.no source in the librarynone
off-axis-angleNominal intentional tilt of the wafer surface from the basal plane, with its direction.no source in the librarynone

Mechanisms (12): things that happen inside it

TermDefinition (agent, unverified)SupportSources (of how many)
linear-parabolicGrowth law with a reaction-limited linear regime and a diffusion-limited parabolic regime.the sources' own termFaruque 2016, Goto and Hijikata 2016, Gupta and Akhtar, InTech chapter on SiC oxidation, Hijikata 2013 and 5 more (9)
interdiffusionMutual diffusion of two species, as silicon and germanium.the sources' own termDavid 2015, Faruque 2016, Goncharova 2011, Rabie 2005 and 3 more (7)
oxidant-diffusionDiffusion of the oxidizing species through the oxide.the sources' own termBashouti 2013, Goto and Hijikata 2016, Kao, Part I report (DTIC ADA181721), Rabie 2005 and 2 more (6)
hydrogen-diffusionDiffusion of hydrogen through the oxide.the sources' own termMayo and Evans 1979, Osullivan 2001, Reed 1989 (3)
carbon-emissionEmission of carbon atoms from the SiC interface during oxidation.the sources' own termGoto and Hijikata 2016, Hijikata 2013 (2)
strain-relaxationLoss of strain in a layer.the sources' own termDavid 2015, Muller 2023 (2)
viscous-flowFlow of the oxide at high temperature, relieving stress.the sources' own termKao, Part I report (DTIC ADA181721), Kobeda and Irene report (DTIC ADA169602) (2)
depassivationLoss of hydrogen from passivated defects.one source's termStesmans and Afanasev 1996 (1)
germanium-condensationThe process of oxidizing SiGe so that germanium is rejected from the growing oxide and enriches the remaining layer, for example to make Ge-on-insulator.one source's termDavid 2015 (1)
isotope-exchangeExchange of oxygen between gas and film; oxygen isotopes are how it is traced.one source's termGoncharova 2011 (1)
silicon-emissionEmission of silicon atoms from the interface during oxidation.one source's termHijikata 2013 (1)
gate-oxide-integrityReliability property class of a gate oxide: breakdown distribution, Q_BD and time-dependent dielectric breakdown (TDDB).no source in the librarynone

Defects (5): what electrical measurements are about

TermDefinition (agent, unverified)SupportSources (of how many)
dangling-bondAn unsatisfied bond on an atom (Si, Ge or C) at or near the interface.the sources' own termFukuda 1992, Gupta and Akhtar, InTech chapter on SiC oxidation, Hung 1987, Johnson et al. 1981 and 4 more (8)
pb-centerA silicon dangling bond at the Si/SiO2 interface, back-bonded to three silicon atoms (unlike E′).the sources' own termFukuda 1992, Kobayashi 2017, Osullivan 2001, Vitkavage and Irene 1990 (4)
pb0The dangling-bond centre on (111) and one of two on (100).one source's termOsullivan 2001 (1)
pb1The second dangling-bond centre on (100).one source's termOsullivan 2001 (1)
e-prime-centerO₃≡Si• defect in SiO₂; E′γ is the oxygen-vacancy variant.no source in the librarynone

Techniques (10): how things are measured

TermDefinition (agent, unverified)SupportSources (of how many)
ellipsometryOptical measurement of film thickness and index.the sources' own termFaruque 2016, Goto and Hijikata 2016, Gupta and Akhtar, InTech chapter on SiC oxidation, Hijikata 2013 and 10 more (14)
capacitance-voltageMeasurement of capacitance against gate voltage.the sources' own termDeal 1967, Faruque 2016, Hung 1987, Kobayashi 2017 and 6 more (10)
x-ray-photoelectron-spectroscopySurface-sensitive measurement of chemical state.the sources' own termBashouti 2013, Faruque 2016, Hung 1987, Li et al. 2023 and 4 more (8)
transmission-electron-microscopyImaging of cross-sections at atomic scale.the sources' own termBashouti 2013, Hung 1987, Kao, Part I report (DTIC ADA181721), Li et al. 2023 and 3 more (7)
quasi-staticLow-frequency C–V used with high-frequency C–V to extract Dit across the band gap.the sources' own termJohnson et al. 1981, Kobayashi 2017, Li et al. 2023, Murali 1988 and 2 more (6)
electron-spin-resonanceDetection of unpaired electrons; counts paramagnetic defects such as Pb and E′ centers.the sources' own termFukuda 1992, Johnson et al. 1981, Osullivan 2001, Reed 1989 and 1 more (5)
conductance-methodExtraction of state density from ac conductance.the sources' own termOsullivan 2001, Yano and Kimoto 2002 (2)
deep-level-transient-spectroscopyCapacitance transient method for trap levels.the sources' own termJohnson et al. 1981, Reed 1989 (2)
medium-energy-ion-scatteringDepth-resolved composition by ion scattering.the sources' own termGoncharova 2011, Song 2004 (2)
secondary-ion-mass-spectrometryDepth profiling by sputtering and mass analysis.one source's termJohnson et al. 1981 (1)

The 36 working terms

These are used by the programs, the claims and the findings. A source's own words for the same thing are shown where the term itself is not in its text.

TermKindStandingSources (of how many)The sources say instead
oxidation-temperaturefactorthe sources' own termBashouti 2013, David 2015, Deal 1967, Deal and Grove 1965 and 32 more (36)-
oxidation-timefactorthe sources' own termBashouti 2013, David 2015, Deal and Grove 1965, Faruque 2015 and 24 more (28)-
orientationfactorthe sources' own termBashouti 2013, Deal 1967, Deal and Razouk 1980, Faruque 2016 and 22 more (26)Si face, C face
growth-ratefactorthe sources' own termDeal 1967, Faruque 2016, Fukuda 1992, Goncharova 2011 and 16 more (20)-
anneal-temperaturefactorthe sources' own termBashouti 2013, Deal 1967, Faruque 2016, Fukuda 1992 and 11 more (15)annealing temperature
laboratoryfactorthe sources' own termDeal and Razouk 1980, Faruque 2015, Faruque 2016, Fukuda 1992 and 10 more (14)-
processing-conditionsfactorthe sources' own termDeal and Razouk 1980, Faruque 2016, Fukuda 1992, Goncharova 2011 and 6 more (10)-
ge-concentrationfactorthe sources' own termDavid 2015, Ganster 2012, Long 2012, Muller 2023 and 3 more (7)-
hydrogen-annealfactorthe sources' own termFukuda 1992, Hung 1987, Kobayashi 2017, Razouk and Deal 1979 and 3 more (7)-
compressive-stressfactorthe sources' own termBashouti 2013, Kao, Part I report (DTIC ADA181721), Kobeda and Irene report (DTIC ADA169602), Krzeminski 2012 and 2 more (6)viscous flow, stress in the oxide
cooling-ratefactorthe sources' own termHayamizu, patent EP0562783, Kobayashi 2017, Osullivan 2001, Razouk and Deal 1979 and 1 more (5)-
vacuum-annealfactorthe sources' own termFukuda 1992, Johnson et al. 1981, Osullivan 2001, Reed 1989 and 1 more (5)vacuum annealing, anneal in vacuum
oxygen-pressurefactorthe sources' own termGoto and Hijikata 2016, Hijikata 2013, Mayo and Evans 1979, Song 2004 (4)-
final-annealfactorthe sources' own termStanford SUPREM report 1982 (DTIC ADA121414), Stanford SUPREM report (DTIC ADA130105) (2)-
inert-annealfactorthe sources' own termKobeda and Irene report (DTIC ADA169602), Osullivan 2001 (2)inert ambient, anneal in nitrogen, argon anneal, nitrogen anneal
oxide-thickness-grownfactorthe sources' own termStanford SUPREM report 1982 (DTIC ADA121414), Stanford SUPREM report (DTIC ADA130105) (2)-
pre-oxidation-cleanfactorthe sources' own termMayo and Evans 1979, Osullivan 2001 (2)-
thermal-historyfactorthe sources' own termRyu and Tomozawa 2006, Stanford SUPREM report (DTIC ADA130105) (2)-
fictive-temperaturefactorone source's termRyu and Tomozawa 2006 (1)-
hydrogen-during-coolingfactorbuilt from the sources' termsOsullivan 2001 (1)cooling rate, presence of hydrogen
nanowire-diameterfactorone source's termMuller 2023 (1)NW diameter
slow-pull-in-oxygenfactorbuilt from the sources' termsDeal and Razouk 1980 (1)slow pull, pull rate
surface-diffusion-frontfactoroursnone-
OxideGrowthoperator_kindthe sources' own termBashouti 2013, Deal and Grove 1965, Faruque 2015, Faruque 2016 and 21 more (25)interface moves
Transportoperator_kindthe sources' own termBashouti 2013, David 2015, Deal and Grove 1965, Faruque 2015 and 15 more (19)-
Relaxationoperator_kindthe sources' own termDavid 2015, Deal and Grove 1965, Ganster 2012, Hearn and Schwuttke 1975 and 9 more (13)equilibrium, decay
Passivationoperator_kindthe sources' own termBashouti 2013, Deal and Razouk 1980, Fukuda 1992, Goncharova 2011 and 8 more (12)-
Exchangeoperator_kindthe sources' own termDavid 2015, Faruque 2016, Ganster 2012, Goncharova 2011 and 4 more (8)-
DefectGenerationoperator_kindthe sources' own termKobayashi 2017, Osullivan 2001, Stanford SUPREM report 1982 (DTIC ADA121414) (3)-
oxide-thicknessquantitythe sources' own termDavid 2015, Deal 1967, Deal and Grove 1965, Deal and Razouk 1980 and 30 more (34)-
fixed-chargequantitythe sources' own termDeal and Razouk 1980, Fukuda 1992, Hung 1987, Kobayashi 2017 and 8 more (12)-
interface-state-densityquantitythe sources' own termDeal and Razouk 1980, Goto and Hijikata 2016, Hijikata 2013, Kobayashi 2017 and 6 more (10)interface states, interface trap density
composition-profilequantitythe sources' own termJohnson et al. 1981, Long 2012 (2)concentration profile, depth profile
density-of-dangling-bondsquantitybuilt from the sources' termsFukuda 1992 (1)dangling bond, Pb center
consumed-substratequantitythe challenge's own termnoneconsumed
interface-state-density-after-hydrogen-annealquantitybuilt from the sources' termsnoneforming gas anneal, post metallization anneal

Source counts are of the sources in our library whose text has been read (49 with a text layer; 3 more are scans and are not searched). Where a source name has no link it has no checked link: see the library for the full citation.